Wednesday, July 23, 2008

   Search Sponsor  
Newsletters  |   About Us  |   Feedback



Free White Papers


THIS MONTH IN WDD
Upfront With Nancy
Brainstorm
Design Talk
What's Hot
Compliance Update
Product News
Emerging Tech & Markets
Industry News
Technology Awards
Tech Supplements
Tech Channel Articles
Year in Wireless



Web Casts

Wireless White Papers

Buyers Guide

Industry Links

Digital Edition Archive



ABOUT US
Staff
Advisory Board
Editorial Guidelines
Editorial Calendar (pdf)
Media Kit (pdf)
Advertising Rates
BPA Statement (pdf)
List Rental




E-mail for more information

Company's other products

E-mail to a colleague

See similar products

Printer friendly format

Multilayer Ceramic Chip Capacitors

Cal-Chip announces the expansion of the CHV series of high voltage multilayer ceramic chip (MLCC) capacitors to include those with voltages of up to 10 kV. Featuring chips in 8 EIA sizes ranging from 0603 to 8060 and in COG (NPO), X7R and Y5V/Z5U dielectric, the CHV Series has low ESR, good frequency response and good mechanical strength. Specified for surge suppression and temperature compensation in high voltage applications where PC board space is limited, these capacitors are suited for wireless and portable products including notebook computers, cellular phones, PDAs, camcorders, VCRs, telecommunications and test equipment. These MLCC caps are provided in voltages within the ranges of 250 V to 10 kV, and in capacitances ranging from 1.0 pF to 1.2 uF. Chips further possess an operating temperature of – 55° C to +125° C, with Temperature Coefficient of Capacitance (TCC) of ± 15%/° C for X7R dielectric, 0 ± 30 ppm/° C for COG for Y5V and Z5U dielectric.
Cal-Chip Electronics, Inc.

Cal-Chip Electronics, Inc.
59 Steamwhistle Drive
Ivyland, PA, 18974

© 2008 Advantage Business Media

free subscription


Wireless blog:
The Tesla Tales
Check out our blog covering the latest wireless tech and some things that are just plain cool. Click!








Amplifiers
Components
Development Kits/Platforms
Digital Hardware/ Components
Frequency Translators
Integrated Components
Integrated Subsystems
Interface/Interconnect
Materials
Passives
Power
Semis/ICs/MMICs
Services
Signal Processing
Signal Sources
Software
Test & Measurement
Transmission Components








Contact Wireless Design & Development | Terms & Conditions | Privacy Statement

© 2008 Advantage Business Media All rights reserved.