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Aries offers a high frequency test socket for devices from 28 to 55 mm² wide. The socket is suited for manual testing of devices with pitches down to 0.50 mm, in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices. The RF socket provides minimal signal loss for higher bandwidth capability via a signal path of .077 inches (1.95 mm). The 4-point spring probe crown on the socket ensures "scrub" on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs, and other socket types. Single point probes are available for small land area contact pads. Estimated contact life is over 500,000 cycles and contact self-inductance is 0.51 nH. Contact forces of the center probe sockets are 9 g to 12 g per contact for 0.50 mm to 0.75 mm pitches, and 17 g to 20 g per contact for 0.80 mm pitches and larger. Operating temperature is – 55° C to 150° C. The compression spring probes are heat-treated beryllium copper alloy, plated with 30 μ inches min. (0.75 μm) gold per Mil-G-45204 over 30 μ inches min. (0.75 μm) nickel per QQ-N-290.

Aries Electronics

Aries Electronics
http://www.arieselec.com