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SiGe Semiconductor announces a complete RF front-end module for Wi-Fi products, designed to comply with the IEEE 802.11n draft specification. The SE2545A10 integrates two full dual-band transmit/receive chains, required for (MIMO) operation. The front-end module provides all of the circuitry required between the transceiver and the antenna in a single, chip-scale package. The device is capable of +18 dBm output power in 802.11b mode, +17 dBm output power in 802.11g mode and +15 dBm output power in 802.11a mode.

SiGe Semiconductor, Inc.