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Samsung Electronics has delivered to market what is believed to be the thinnest cell phone ever made. Incorporating Agere Systems' innovative chip packaging design, Samsung could make Ultra Edition 6.9 (X820 bar design) and Ultra Edition 9.9 (D830 clamshell design) cell phones, the thinnest ever among its form factors.

The technique is called package-on-package (stacking), in which a packaged memory chip is stacked on top of the baseband chip package to reduce the overall area footprint. This enables single-sided component mounting so the phone itself can be made thinner in depth. Typically, cell phones have chips on both sides of the circuit board, making the cell phones thicker.

Mr. J.K. Shin, Executive Vice President of Samsung's Mobile R&D Team stated: I'm pleased to introduce Ultra Editions through the cooperation with Agere, and hope to keep providing global customers with the phones that want to have for their everyday life.

The Ultra Edition 6.9 measures less than one-quarter inch in depth (6.9 millimeters) and weighs only 66 grams. The Ultra Edition 9.9 measures 9.9 millimeters thick. Both are the world's thinnest of their types, according to Samsung. The cell phones contain Agere's Sceptre® HPE 2.5-generation GSM/E-GPRS chip set.

Both phones adhere to the 2.5-generation EDGE standard, which transmits data at up to 384 kilobits per second. At that speed, the Samsung phones are three times faster than today's mainstream cell phones, making music and photo downloads over the network much faster.


Samsung Electro Mechanics
http://www.sem.samsung.com