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Texas Instruments, Inc. introduces its WiLink™ 6.0 mobile platform that is a complete hardware and software offering comprising carrier-quality mobile WLAN, Bluetooth® and FM cores integrated into a single chip. They are manufactured in a 65-nm CMOS process and use the company’s DRP™ technology to deliver low-power, small form-factor and low cost requirements of handset manufacturers. The platform is optimized to work with OMAP 2, OMAP 3 and OMAP-Vox™ platforms, including the OMAPV1030 and OMAPV1035 "eCosto" GSM/GPRS/EDGE systems to provide complete modem, applications processor and mWLAN/Bluetooth/FM for low- to mid-tier handsets. Both systems support Bluetooth Specification 2.1 + EDR and FM transmit and receive.