RF Chipsets
Texas Instruments expands its portfolio of complete wireless signal-chain solutions for broadband wireless access by introducing three radio frequency (RF) chipsets, the TRF11xx chipset at 2.5 GHz, the TRF12xx chipset at 3.5 GHz and the TRF24xx chipset at 5.8 GHz. The chipsets are designed to support IEEE 802.16d/e standard RF front end for wireless basestations, access points as well as equipment backhaul, point-to-point microwave and public safety band applications. These chipsets are capable of supporting both emerging WiMAX and WiBro applications based on the IEEE 802.16 standard, as well as more traditional fixed wireless access. Both the TRF112xx chipset at 2.5 GHz and the TRF122xx chipset at 3.5 GHz consist of four chips, each with fully integrated super heterodyne receivers and transmitters. These RF chipsets are capable of supporting Frequency Division Duplex (FDD), Half Frequency Division Duplex (HFDD) and Time Division Duplex (TDD) modes with a real interface at low IF to the data conversion subsystem. The TRF11xx at 2.5 GHz and the TRF12xx at 3.5 GHz are also complemented by the power amplifiers, TRF1123 and TRF1223. Supporting a range of frequencies between 2.1 to 2.7 GHz and 3.3 to 3.8 GHz, these power amplifiers provide output third order intercept point (OIP3) of 45 dBm or better, enabling the support of complex OFDM (orthogonal frequency division multiplexing) signals. These power amplifiers can also be used as driver amplifiers in applications requiring larger output power. TI’s TRF2432 and TRF2436 heterodyne transceiver chipset consist of an IF and RF transceiver, and support the 4.9 tp 5.9 GHz air interface frequency band. The chipset supports TDD mode with complex I/Q interface.
Texas Instruments
Texas Instruments Inc.
Semiconductor Group SC-98054
4500 Cambridge
Fort Worth, TX, 76155
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