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TI announces a next generation programmable DSP capable of handling multiple 3G air interface standards and a range of basestation form factors on a single chip. The 1 GHz TMS320TCI6482 DSP consumes 3 W of power and provides infrastructure OEMs with a platform to upgrade current systems and expand product portfolios. The TCI6482 reduces the power consumed per channel, delivering more processing headroom for increased user density. The device also simplifies system-level thermal management. Built on the company’s 90 nm process, this DSP offers several enhancements on the previous TMS320C64x™-based products. The TCI6482 features 28 new DSP instructions that offer specific capabilities that enable more applications such as High Speed Download Packet Access (HSDPA). In addition, the product offers a serial Rapid IO™ interconnect for scalable connectivity, higher system bandwidth, and reduced latency and overhead for packet data processing.

Texas Instruments

Texas Instruments Inc.
Semiconductor Group SC-98054
4500 Cambridge
Fort Worth, TX, 76155