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Advanced Interconnections Corp. announces its hybrid socket adapter design that uses both male and female pins in an interstitial pattern in 0.65 mm pitch BGA and LGA footprints. The patented design features the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At 2.00 mm larger than the device package with no external hold-downs required, this system is designed for development and validation of BGA and LGA devices, production level socketing and SMT board-to-board connector applications. The design offers low signal attenuation up to 3.5 GHz, and it features standard eutectic tin/lead solder balls or lead-free tin/silver/copper solder ball terminals for RoHA compliant applications