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TriQuint introduces the TQM7M4006 quad-band GSM850/GSM900/DCS/PCS power amplifier module (PAM) in a small form factor — 5 × 5 × 1.1 mm. The device is a 3 V power amplifier module designed for mobile handset applications. The device employs the company’s InGaP HBT technology in combination with CuFlip™ (flip-chip) assembly technology. This fully integrated module provides a simple 50Ω interface on all input and output ports. It includes internal closed-loop power control with wide dynamic range, and on-board reference voltage. No external matching or bias components are required. Specifications include: GSM output power of +34.2 dBm minimum; DCS/PCS output power of +32.0 dBm minimum; and 55 dB dynamic range control.

TriQuint Semiconductor, Inc.

TriQuint Semiconductor, Inc.
http://www.triquint.com