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Rogers introduces two lines of 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials for use in cell phone hinge flex, LCD interconnection, and other applications. Offerings include Rogers R/flex AP 200 material, a single-clad, cast-on type product and Mitsui Chemicals NEOFLEX NFX material, a double-clad, laminated-type product. Both are available in rolls 250 mm and 500 mm (9.84 inches and 19.68 inches) wide. The adhesiveless products are polyimide-based, made by directly bonding polyimide onto adhesion-treated copper foil, without the use of conventional adhesives. Product features and benefits include: good solder resistance, suited for lead-free soldering temperatures; thin cross-section, allowing smaller bend radius and high cycles in hinged applications; inherently flame-resistant, halogen-free (green) with a flammability rating of UL 94V-0; good dimensional stability, for use in making fine line flexible circuit designs and assemblies.

Rogers Corporation

Rogers Corporation
Advanced Circuit Materials
100 S Roosevelt Ave.
Chandler, AZ, 85226