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Ironwood Electronics has released a series of heat sink screws for the company's high performance GHz BGA socket family. The HS-SG-6002 heat sink screw is designed for 31mm x 31mm to 42.5mm x 42.5mm package size and dissipates up to 16W with additional fan mounted on the top. In addition to heat dissipation, the heat sink screw also serves as a compression mechanism for the GHz socket. The heat sink screw threads into the socket lid which can be swivel open from the socket base. After placing the IC inside the socket cavity, swivel the lid and turn the heat sink compression screw. This provides enough force to compress the device on to the contact element as well as optimum surface contact with IC top side for heat dissipation to keep IC's junction temperature without exceeding its limits. The thermal resistance of heat sink screw is 0.530 C/W. Maximum temperature seen at heat sink base was 30.27°C and the minimum temperature seen at fins was 29.89°C.

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