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APLAC Roadshow 2003

On a September tour from global research metropolis Helsinki, Finland, down through Europe to Munich, Germany, APLAC Solutions presents the latest developments in the field of circuit simulation, pausing at the European Microwave conference and exhibition held in Munich.

APLAC will present a tutorial demonstration of the APLAC Circuit Simulation and Design Tool, introducing MEMS and other cutting-edge APLAC 7.90 analysis features.

After these demonstrations, we invite you to bring out your future design tool needs, as we discuss how APLAC can be further improved to meet them in the best possible way. In addition, if you have an actual design problem that interests you, our experts are there to help you.

Presentations include:
• Demonstrations of the APLAC Circuit Simulation and Design Tool, including MEMS and other cutting-edge APLAC 7.90 analysis features

• Tutorial: Creating and managing project-specific test benches

• Integration: APLAC circuit simulation working together with 3D EM analysis

• Experienced users show: How APLAC is used in the real world to reach the most demanding specifications

For more information visit http://www.aplac.com
Wireless Design & Development
Advantage Business Media
Rockaway, NJ, 07866

© 2008 Advantage Business Media

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