The TO270WB and TO270WBL clamping devices, available from Richardson Electronics, enhance the connection between a plastic-packaged RF power transistor and the ground plate of an RF amplifier. Often these high-power plastic-packaged devices are just bolted down. The new clamps improve both the electrical ground and the thermal ground; thus increasing P1dB, decreasing IMD3, while improving thermal performance and reliability. Datasheets and samples are exclusively available at Richardson Electronics.