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Materials
>Materials, Packaging
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Schreiner ProSecure Introduces new Covert Security Feature for Proof of Authenticity
Wireless Design & Development Advantage Business Media, February-11
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Chip-Scale Package Options Target Space-Constrained Sports, Fitness, and Health Applications
Nordic Semiconductor ASA, December-10
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Endwave Develops Enhanced QFN Packages to 50 GHz
Endwave Corp., December-10
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Rugged Blade System Delivers High-Performance Computing in Harsh Environments during Empire Challenge 10
Tracewell Systems Inc., November-10
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Dual Cool™ Package Answers the Need for Higher Power Density in DC-DC Designs
Fairchild Semiconductor, October-10
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Environment-Friendly Material Options
for the CPLD Family Now Available
Lattice Semiconductor Corp., September-10
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NAND BGA Package Provides Up to 16 GByte Solid State Storage
Microsemi Corporation, September-10
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New Corner Design Optimizes Part Rigidity for Improved Shielding Performance
Laird Technologies, September-10
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Next Generation PoP for Processor and Memory Stacking
Tessera, April-10
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Three Ways to Create Eco-Friendly, Financially-Beneficial Packaging
Brightstar, April-10
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Complex PC Board Assemblies Provide Solutions
Endicott Interconnect Technologies, Inc, May-09
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Lead-Free Thermal Management Material for Semiconductors
Honeywell Aerospace Electronics Systems, May-09
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Mobile Multimedia Applications Require New Memory Architectures
Amkor Technology, Inc., May-09
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New Flip Chip Technology Offers Significant Cost Savings Over Standard Flip Chip Packages
Wireless Design & Development Advantage Business Media, May-09
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System-in-Package Solution for Automotive LIN Networking Applications
Atmel Corporation, May-09
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Ball Grid Array Reduces Memory Footprint
Ramtron International Corporation, March-09
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Packaging Performs in X through K Band Frequencies
AdTech Ceramics, September-08
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New Process Delivers Significant Miniaturization
Avago Technologies, June-08
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New Process Delivers Significant Miniaturization
Avago Technologies, June-08
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Innovation in Package-Level EMI/RF Shielding
RF Micro Devices, Inc., March-08
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Hermetic Microelectronic Packages
CPS Technology Solutions, Inc, September-07
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PTFE-based Coreless Semiconductor Package
Endicott Interconnect Technologies, Inc, August-07
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Grid Array
Aries Electronics, October-06
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Semiconductor Hermetic Package
StratEdge, September-06
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Ball Grid Array Package
TT electronics IRC Advanced Film Division, August-06
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Soft Seal Foams
Rogers Corporation Advanced Circuit Materials, August-06
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Two-leaded Plastic Package
Tyco Electronics M/Acom, January-06
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ESD Protection Device
Semtech Corp., December-05
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Packageless Transceiver
Endwave Corp., December-05
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Singulated Substrate Process
DEK International GmbH, October-05
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Hermetic Packaging
StratEdge, June-05
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28-Lead QLFP Package
Kyocera America Inc Microelectronics Div, May-05
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IC Packages
National Semiconductor Corporation, September-04
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LDMOS Packages
Kyocera America Inc Microelectronics Div, September-04
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IC Packages
National Semiconductor Corporation, August-04
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LDMOS Packages
Kyocera America Inc Microelectronics Div, August-04
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Packaging Solutions
Minicaps, July-04
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