Wireless Design & Development

Now on Wireless Design & Development
Testing MMS Functionality in Mobile Phones
LTE Femtocell Roadmap from Concept to Reality
How US Design Engineers Can Meet Global Legislation Challenges...
Low Cost FPGA-Based HD/SD SDI Transceivers

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Other Items from Cadence Design Systems

Address Increasing Complex Chip Design
January 2008
SoC Functional Verification Kit Increases both Productivity and Predictability
October 2007
Adoption of Digital Co-design Technology
July 2007
PCB and RF Technology
Low-power Methodology Kit
June 2007
Introducing a New Approach to Wireless IC Design
May 2007
Xtreme III Systems
November 2006
Timing System offers Timing Debug Features
October 2006
Full-Chip Router
August 2006
Memory Controller IP
Processor-Based Kit
RF SiP Methodology Kit
RF SiP Methodology Kit
Design Suite
May 2006
Reference Flow
Chip-optimization Technology
April 2006
Chip-optimization Technology
March 2006
RF Design Kit
February 2006
Upgrade to SoC Verification Technology
Digital IC Design Platform
January 2006
Capabilities for PowerPC Design
December 2005
Software Aids SystemVerilog Adoption
AMS Design Kit
October 2005
PCB Design Technology
September 2005
Scalable PCB Design Software
Analysis Solution
July 2005
Analysis Software
June 2005
Design Platform
March 2005
Acceleration/Emulation System
December 2004
Verification Platform
March 2003


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Yokogawa Introduces Ultra High Speed CPUs for the FA-M3 PLC Yokogawa has announced the newest addition to the FA-M3 PLC family, the Vitesse Controller.  


SoC Enables Measurement and Diagnostics for High-Power Monitoring in Industrial Applications and Data Centers Maxim’s Teridian power measurement and monitoring SoC provides a fully self-contained energy measurement solution for 3-phase point-of-load (POL) applications.  


Ultra Wideband High Power Amplifier  300 - 3800 MHz / 50 Watts Broadband High Power Amplifier System. The BBS3G6QHM (SKU 2135) is a dual band, ultra broadband high power linear amplifier.  












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