Wireless Design & Development

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Other Items from Taiyo Yuden (USA), Inc.

Power Inductor Allows for more Compact and Energy Efficient Mobile Devices
March 2011
Two Innovative Chip Filters for Cellular Band Applications
December 2010
Hybrid Lithium Ion Capacitors Provide Energy Densities up to 10X Greater than EDLCs
October 2010
Compact, Low Profile Power Inductors for Mobile Devices
August 2010
Slimmer Designed GPS Devices Require Equally Slim Antennas
April 2010
DC/AC Inverter with Alarm Signal Output
May 2009
Wire-Wound Power Inductor Offers Highest Rated Current for Size
February 2009
Choke Coil Targets HDMI Transmission Line Interfaces
January 2009
Power Inductors Present High Inductance
August 2008
One Device Provides the Capacitance of Two Typical 0402 Components
June 2008
One Device Provides the Capacitance of Two Typical 0402 Components
Wire-wound Performance with Multi-layer Manufacturability
Wire-wound Performance with Multi-layer Manufacturability
MLCCs Double Capacitance Ratings
January 2007
Chip Inductors
January 2006
Multilayer Chip Inductors
September 2005
Multilayer Ceramic Capacitors
March 2005
Ceramic Piezoelectric Speakers
April 2004
Switch-mode Power Supplies
October 2003
Ceramic Capacitors
January 2003
Performance Advantages of Multilayer Ceramic Capacitor (MLCC) Arrays
Multilayer Ceramic Capacitors
December 2002
Taiyo Yuden (USA), Inc.
April 2002
Bluetooth RF Module
March 2002
Bluetooth Full Module
February 2002
Ferrite Chip Bead Inductors
November 2001
Micro DC/DC Converter
Surface Mount High Current Ferrite Chip Beads
Taiyo Yuden (USA), Inc.
Surface-Mount Multilayer Ceramic Capacitors
October 2001
Micro DC/DC Converter
September 2001
Taiyo Yuden (U.S.A.), Inc.
June 2001
Bluetooth™ Module
May 2001
Wire Wound Chip Inductors
Chip Capacitor
April 2001
Taiyo Yuden (USA), Inc.
Taiyo Yuden (U.S.A.), Inc.
March 2001
Bluetooth RF Modules
January 2001


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