DUBLIN -- (BUSINESS WIRE) -- Research and Markets has announced the addition of the "Global and China Mobile Phone Baseband Industry Report, 2010" report to their offering. STMicroelectronics, EMP and NXPs wireless division merged to be ST-ERICSSON, which has not given play to the synergy, while its revenue has started to decline, with the more drastic drop in growth margin than other mobile baseband peers.
SAN FRANCISCO, /PRNewswire-Asia/ -- Maxthon International, a developer of browsers for both the Windows desktop and Android phones, took desktop and mobile convergence one step further today with the release of its latest Android Browser, Maxthon Mobile. "Maxthon is making it easier for you to have your own internet cloud service," said Jeff Chen, CEO and founder of Maxthon.
BERLIN and PASADENA, California, /PRNewswire/ -- January 29th marks the 125th anniversary of the birth of the automobile by Karl Benz. On that date in 1886, the Mercedes-Benz namesake registered his "vehicle powered by a gas engine" in Germany. Today Germany's automotive industry is on the verge of a paradigm shift away from the internal combustion engine and toward electric mobility.
Electronic components distributor Digi-Key Corporation today announced its stock of Cree's LMR4 LED light modules is available in Europe and around the world. The LMR4 modules are designed to simplify the creative process, giving lighting manufacturers more options as they develop LED lighting products.
Calico Energy Services and Digi Partner to Enable Smart Grid Technologies for Energy and Demand Management CompaniesJanuary 21, 2011 6:15 am | Comments
Calico Energy Services and Digi International recently announced the availability of an integrated smart grid technology solution for energy and demand management. The solution is built upon the Digi X-Grid™ platform which provides device connectivity infrastructure, and Calico Energy’s EIS™ platform, which provides a complete utility energy management solution coupled with residential and commercial load control.
BOSTON -- (BUSINESS WIRE) -- Strategy Analytics found that the optoelectronics segment of the compound semiconductor industry continued to grow into the close of 2010, driven by trends like broader adoption of LEDs for general and automotive lighting applications, as well as increased performance demand by the optical transport market.
SEOUL, South Korea -- (BUSINESS WIRE) -- Samsung Electronics Co., Ltd. announced it has acquired display technology firm Liquavista BV. Samsung completed the acquisition of Liquavista, based in Eindhoven, the Netherlands, in December 2010. Liquavista, founded in 2006 as a spin-out from the Philips Research Labs, offers a new type of electronic display technology known as electrowetting for applications in e-readers, mobile phones, media players and other mobile devices.
NEW YORK -- (BUSINESS WIRE) -- The company that changed the world of video games with touch-screen gaming in 2004 and motion-controlled gaming in 2006 now pioneers the next dimensional shift. On March 27, Nintendo introduces portable entertainment in 3D – without the need for special glasses. The Nintendo 3DS™ system will be available in either Cosmo Black or Aqua Blue, and will have a suggested retail price of $249.
Murata Manufacturing Co., Ltd. announced the launch of the WIRELESSHD™ (WiHD) 2nd generation module, WHDM-T005/R006, which is adapted for a complete embedded solution to high-definition audio/visual (HD-A/V) electronics devices, such as Plasma Displays, LCD-TV, Projection DTV, A/V Receiver, and Blu-ray player, etc.
Parallel to AMD’s launch of the AMD Embedded G-Series platform, Kontron announces that it will support the world’s first Accelerated Processing Units (APUs) on three of the company’s small form factor (SFF) embedded platforms. With the new AMD Embedded G-Series platform that integrates energy efficient processor cores and an advanced GPU (Graphics Processing Unit) with support for DirectX® 11 into a single Advanced Processing Unit (APU), Kontron extends its small form factor portfolio of Computer-on-Modules, Embedded Motherboards and Single Board Computers (SBC) for high-performance multi-media content delivery applications.
Hittite Microwave Corporation announced it has acquired Arctic Silicon Devices, a developer of advanced mixed-signal integrated circuit (IC) technology, located in Trondheim, Norway. The acquisition price was approximately $12.0 million in cash and equity. The acquisition provides Hittite with new IC design and integration capability and a state-of-the-art product line of analog-to-digital converters (ADCs).
Mu Dynamics, Inc. recently announced that NTT WEST (Nippon Telegraph and Telephone West Corporation), one of the premier providers of telecommunications services in Japan, has adopted the Mu Test Suite for testing its Internet services. Devices being tested include service edge routers and residential gateways for wired services.
TEL AVIV, Israel -- (BUSINESS WIRE) --MTI Wireless Edge Ltd., the developer of high quality cost effective antenna solutions for WiMAX, Fixed Wireless and RFID applications, is proud to announce the release of a new broadband 4.9 to 6.5 GHz 29dBi 2 feet parabolic dish antenna. The device is part of a whole new product line of low-cost single and dual polarity directional antennas covering the 5.
Microchip Technology Inc., a leading provider of microcontroller, analog and Flash-IP solutions, recently announced that it has been recognized by the following electronics industry publications for product innovation and leadership. Microchip’s eXtreme Low Power (XLP) PIC® microcontrollers, featuring the industry’s lowest active and sleep power consumption, continue to gain top honors from the leading global electronics publications.
Thermal Simulation Software that Solves the Cooling Problems from Heat-Generating Electronics ComponentsJanuary 19, 2011 5:24 am | Comments
SAN JOSE, Calif. -- (BUSINESS WIRE) -- Future Facilities Incorporated has released a case study showing that its new CFD software for electronics cooling design, 6SigmaET solves the problem of how to shrink electronics devices that generate heat. Electronics design engineers face complex tradeoffs when they design small high-power-consuming lighting devices like LEDs.