Littelfuse Hosts Speed2Design TechTalks at NASA
May 22, 2013 4:48 pm | by Littelfuse, Inc. | CommentsLittelfuse, Inc. has created a NASA Exploration & Discovery Experience for the engineering community as part of its 2013 Speed2Design promotion. Winning design engineers will get an opportunity to go behind the scenes to spend time with NASA engineers at two premiere NASA facilities. Littelfuse will host Speed2Design TechTalk events at NASA’s Ames Research Center in Moffett Field, Calif...
Aeroflex Releases the TETRA Enhanced Data Service Option for the 3920 Radio Test Set
May 22, 2013 4:18 pm | by Aeroflex Incorporated | CommentsAeroflex Incorporated, a wholly owned subsidiary of Aeroflex Holding Corp. [NYSE:ARX], has announced the release of the TETRA Enhanced Data Service (TEDS) option for the 3920 Digital and Analog Radio Test Set. This operation enables the technician or engineer to use the 3920 for verifying the operation of TEDS mobile stations and base stations.
GS1 and Open Mobile Alliance team up to bring intelligent bar code scanning to mobile devices
May 22, 2013 4:07 pm | by GS1 and Open Mobile Alliance (OMA | CommentsGS1 and Open Mobile Alliance (OMA) are collaborating to enable bar code scanning features built directly into mobile devices. This will make it easier for application developers to allow their apps to scan and link to trusted content.
Focus on Chinese Broadband Home at HGI's Shenzhen Meeting
May 22, 2013 4:01 pm | by HGI | CommentsAn open forum addressing the latest broadband home-services trends and Smart Home requirements will be hosted in Shenzhen on June 18 by HGI, the leading global organisation for publishing requirements for the digital Smart Home. This event, part of HGI’s regular quarterly meeting, will feature presentations from two of China’s leading service providers and will take place from June 18-21 at the Westin Hotel, Shenzhen.
QuickLogic’s Parallel Camera Interface for TI Sitara AM335x ARM Cortex-A8 Processors
May 22, 2013 3:58 pm | by QuickLogic Corporation | CommentsQuickLogic Corporation [NASDAQ: QUIK], the innovator of ultra-low-power programmable Customer Specific Standard Products (CSSPs), today announced that its Parallel Camera Interface (CAM I/F) for Sitara AM335x ARM Cortex-A8 processors from Texas Instruments Incorporated (TI) now supports the Android Jelly Bean 4.1.2 Operating System (OS).
Samsung Selects ANADIGICS’ WiFi and Cellular Solutions for Galaxy S 4
May 22, 2013 3:51 pm | by ANADIGICS, Inc. | CommentsANADIGICS, Inc. [Nasdaq: ANAD] has announced that the Company’s AWL9581 802.11ac front-end IC (FEIC), AWT6651 ProEficient power amplifier (PA), AWT6624 HELP4 PA, and AWC6323 HELP3E dual-band PA enable wireless connectivity in the Galaxy S 4 by Samsung Electronics. This feature-rich smartphone offers a 5-inch full HD Super AMOLED display, 1.9 GHz quad-core processor, 13 megapixel camera, and Android 4.2.2 Jelly Bean operating system.
H.B. Fuller Enters the Electronic and Assembly Materials Market with a New “Eco-system” Approach
May 22, 2013 3:47 pm | by H.B. Fuller Company | CommentsH.B. Fuller Company [NYSE: FUL] has announced that the company is entering the growing electronics and assembly materials market with a total solutions “eco-system” approach that includes materials, processes and equipment support from the concept phase to the consumer’s hands.
Spirent Enables Testing of E911 with Voice-over-LTE
May 22, 2013 3:17 pm | by Spirent Communications | CommentsSpirent Communications has announced that its 8100 Location Technology Solution (LTS) now offers support for end-to-end Voice-over-LTE (VoLTE) E911 testing. As North American carriers race to successfully deploy VoLTE, they also recognize their requirement to provide FCC-mandated E911 services.
New Technique May Open up an Era of Atomic-scale Semiconductor Devices
May 22, 2013 11:32 am | by Matt Shipman, NC State University | CommentsResearchers at North Carolina State University have developed a new technique for creating high-quality semiconductor thin films at the atomic scale – meaning the films are only one atom thick. The technique can be used to create these thin films on a large scale, sufficient to coat wafers that are two inches wide, or larger.
Apple Case Seen as Possible Spur to Tax Action
May 22, 2013 10:08 am | by MARCY GORDON, AP Business Writers PETER SVENSSON, AP Business Writers | CommentsNow that tech darling Apple Inc. has been dragged front and center into the debate over the U.S. tax code, lawmakers are hoping that the spotlight on such a high-profile company could be the catalyst for Congress to take action to close loopholes or reform the law.
The New Consoles from Microsoft, Nintendo and Sony
May 22, 2013 10:02 am | by BARBARA ORTUTAY, AP Technology Writer | CommentsMicrosoft is the last of the three big video game console makers to unveil its latest gaming system. The unveiling comes nearly eight years after the Xbox 360 went on sale. It follows last fall's debut of Nintendo's Wii U and a preview in February of the upcoming PlayStation 4 from Sony.
Sprint Boosts Buyout Offer for Clearwire
May 22, 2013 9:57 am | by Associated Press | CommentsSprint Nextel Corp. is offering 14 percent more than before for the stake in wireless data network operator Clearwire Corp. it does not already own, but a large shareholder said the offer was still inadequate. Sprint said Tuesday that it is offering $3.40 per share, or $2.5 billion, for the remainder of Clearwire Corp. Its previous offer, from December, was for $2.97 per share.
Mouser Electronics’ President and CEO Glenn Smith Celebrates 40 Years of Service
May 22, 2013 9:40 am | by Mouser Electronics, Inc. | CommentsMouser Electronics, Inc., regarded as a top design engineering resource and global distributor for semiconductors and electronic components, today announced the 40th company anniversary milestone of Glenn Smith, Mouser’s President and Chief Executive Officer.
Opening Doors to Foldable Electronics with Inkjet-Printed Graphene
May 21, 2013 10:14 am | by Sarah Ostman, Northwestern University | CommentsThe technology for these devices may not be so far off. Northwestern University researchers have recently developed a graphene-based ink that is highly conductive and tolerant to bending, and they have used it to inkjet-print graphene patterns that could be used for extremely detailed, conductive electrodes.
Iron-Platinum Alloys Could be New-Generation Hard Drives
May 21, 2013 9:31 am | by Andy Fell, UC Davis | CommentsMeeting the demand for more data storage in smaller volumes means using materials made up of ever-smaller magnets, or nanomagnets. One promising material for a potential new generation of recording media is an alloy of iron and platinum with an ordered crystal structure. Researchers led by Professor Kai Liu and graduate student Dustin Gilbert at the University of California, Davis ...



