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Low Cost EMI Filter

March 8, 2002 3:55 am | Product Releases | Comments

Syfer Technology's Integrated Passive Component (IPC) is a new three terminal electromagnetic interference filter device featuring cancellation of radio frequency noise, rather than reflection of the signals to ground. The unique new multilayer electrode and dielectric architecture provides simultaneous line-to-line and line-to-ground EMI filtering, using a single surface mountable ceramic chip, thus providing superior performance while red...

Boundary Scan Test and In-System Programming Environment

March 8, 2002 3:55 am | Product Releases | Comments

A new release of ASSET InterTech's ScanWorks boundary-scan (IEEE 1149.1/JTAG) test and in-system programming (ISP) environment features next-generation interconnect test tools that improve product quality by offering better test coverage and by speeding up the test development process with new simpler test development capabilities....

UMTS Network Sharing: Unique requirements for power amplifiers

March 5, 2002 5:54 am | Product Releases | Comments

By Joe Madden, Vice President, Spectrian Network operators around the world have spent huge sums of money in order to secure spectrum for upcoming 3G services. Unfortunately, many operators have found that the financial markets no longer have an unlimited appetite for investing related to telecommunications services....

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2.5 G and 3 G Wireless Networks & Services

March 4, 2002 7:30 am | Product Releases | Comments

A definitive, comprehensive and objective examination of 2.5G & 3G wireless standards, spectrum, technologies, networks, services, terminals and market opportunities....

2.5G & 3G Wireless Networks & Services

March 4, 2002 7:30 am | Product Releases | Comments

A definitive, comprehensive and objective examination of 2.5G & 3G wireless standards, spectrum, technologies, networks, services, terminals and market opportunities....

2.5 G & 3 G Wireless Networks & Services

March 4, 2002 7:30 am | Product Releases | Comments

A definitive, comprehensive and objective examination of 2.5G & 3G wireless standards, spectrum, technologies, networks, services, terminals and market opportunities....

International Conference and Exposition on High-Performance Adhesives, Sealants and Coatings

March 4, 2002 7:30 am | Product Releases | Comments

The High Tech Adhesives 2002 conference is being specifically tailored to meet the diverse needs of end-users, manufacturers and processors of high-performance adhesive products in all the key industrial sectors. The format selected for this conference will provide presentations on the latest technical developments for all-important sectors of high-performance adhesives....

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The 2002 International Conference on Communications (ICC 2002)

March 4, 2002 7:30 am | Product Releases | Comments

The meeting, which is sponsored by the IEEE Communications Society (IEEE ComSoc), offers hundreds of presentations for researchers and business leaders interested in voice, data, image, Internet, multimedia, and optical and wireless communications. Phone: (212) 705-8942 E-mail: icc2002@comsoc....

Embedded Omni Antennas for Terminal Applications

March 4, 2002 3:49 am | Product Releases | Comments

Radiall/Larsen introduces a series of embedded Omni antenna solutions for Wireless Data Networks. These antennas are designed for use in WLAN (802 A/B), Home Networking, RFDC (bar code scanner), RFID and POS applications. The easy to integrate, easy to mount embedded Omni antennas are small in size and cost effective while maintaining high performance levels....

LICC Series Capacitors

March 4, 2002 3:49 am | Product Releases | Comments

Leading passives manufacturer AVX Corp. expands its low inductance product offering with the availability of the expanding LICC Series. Designed for use in high-speed circuits, these devices provide design engineers with low inductance capacitors for microprocessor decoupling applications in computers and servers....

Top Protocol Tester

March 4, 2002 3:49 am | Product Releases | Comments

Tektronix, Inc. announced a new solution package that will further enable the development and deployment of more complex network elements for Universal Mobile Telecommunication System (UMTS) mobile networks. The newest third-generation (3G) UMTS network elements are much more complex to test than existing mobile network elements....

Voltage-Output DACs

March 4, 2002 3:49 am | Product Releases | Comments

Analog Devices has introduced a family of octal 8-, 10- and 12-bit buffered voltage-output digital-to-analog converters (DACs) that operate from a single 2.5-V to 5.5-V power supply and consume only 1.4 milliamps (max.) at 3 V. Rail-to-rail outputs provide maximum headroom and dynamic range in low voltage, single supply applications....

Aluminum Electrolytic Capacitor

March 4, 2002 3:49 am | Product Releases | Comments

The top temperature for all but a few aluminum electrolytic capacitor types is only 85 °C or 105 °C or less because higher temperatures require seals capable of withstanding high-pressure and exceed the stability limits of affordable electrolyte systems. However, with the new demands for 125 °C rated capacitors for automotive applications and for long-life and military switching-power applications, Cornell Dubilier has developed...

A/D Converters

March 4, 2002 3:49 am | Product Releases | Comments

Extending its reach in the analog marketplace, Microchip Technology introduced three upgraded, low-power analog-to-digital (A/D) converters with full differential inputs. Referred to as the MCP330X family, these 13-bit A/D converters are ideal for remote data acquisition, transducer interface and sensing applications....

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