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Sangshin

September 2, 2003 8:59 am | Product Releases | Comments

KH Chang, President As the leading manufacturer of electronic components in Korea, Sangshin has continually been the technological leader in both low frequency filters (Audio, VCR & Color TV) and high frequency filters (Telecommunications, WLAN,MMDS). Our continued introduction high performing filters in smaller, more cost effective packages for the telecommunications market as well as our introduction of miniature LTCC chip antennas h...

Noise Com

September 2, 2003 8:59 am | Product Releases | Comments

Noise Com (a Wireless Telecom Group, Inc. Company) and Boonton Electronics, a wholly owned subsidiary of Wireless Telecom Group, Inc. have been in the RF and Microwave Test Equipment industry for 17 and 56 years respectively. Over the past decade Noise Com had made many contributions to the progression of communications testing through our expertise in noise....

Micronetics, Inc.

September 2, 2003 8:59 am | Product Releases | Comments

One of the most significant advancement of Micronetics noise product is the patent pending dithering module. The dithering module allows users an easy way to increase sensitivity by increasing spurious free dynamic range(SFDR). Confused? Multi-stage High-speed A/D converters produce spurs caused by the stack up of quantization errors along the stages....

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Micron Technology, Inc.

September 2, 2003 8:59 am | Product Releases | Comments

Jan du Preez, Vice President of Networking and Communications Group Micron Technology, Inc., designs and manufactures DRAM, Flash memory, CMOS image sensors and other semiconductor products for a variety of applications. Access to information is driving a plethora of new non-PC applications with unique memory needs....

MaxStream, Inc.

September 2, 2003 8:59 am | Product Releases | Comments

By Brad Walters, CEO & President MaxStream develops and manufactures wireless modem modules and stand-alone radio modems for the wireless device networking market. We have developed proprietary filtering and modulation/demodulation techniques that allow for phenomenal levels of interference immunity within the 900 MHz & 2....

CTI

September 2, 2003 8:59 am | Product Releases | Comments

Mr. Adrian Lalicata, VP Engineering For three decades CTI has been an innovator in high-performance frequency generation and synthesis. Whether the critical parameter was spurious or phase noise in frequency synthesizers or DROs, CTI has consistently provided the best value in the industry....

Agilent Technologies, Inc.

September 2, 2003 8:59 am | Product Releases | Comments

Bryan Ingram, vice president and general manager, Agilent Wireless Semiconductor Division Agilent Technologies draws on more than three decades of microwave and RF design and manufacturing experience. This has enabled us to define and introduce disruptive technologies vital to the success of wireless communications....

The Future of WD & D

September 2, 2003 8:49 am | News | Comments

Ern Worthman, Technology and Editorial Director Hello everyone... If you're surprised to see my column in this publication, it is because I have left my position at RF Design and taken the technological helm as Technology and Editorial Director of Wireless Design & Development and Fiberoptic Product News.

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Connecting in the Future

September 2, 2003 8:46 am | News | Comments

By Russell Shaller, W. L. Gore & Associates, Inc. Some interesting developments within the microwave electronic industry over the past decade include the convergence towards more standard interconnects, the resilience of existing technologies, and the comparatively smaller incremental improvements in these interconnects versus achievements in active components.

A Future for Wi-Fi

September 2, 2003 8:46 am | News | Comments

By Harry Helms, Co-founder, Elsevier Science Book Group Short-range wireless networks operating under Part 15 of the FCC's regulations — exemplified by the 802.11 family — were the most significant RF/wireless development in the past decade, and that will likely be true in the coming decade as well.

What It Takes to Do Business in China

September 2, 2003 8:46 am | News | Comments

By Joseph P. Keithley, Keithley Instruments, Inc. China is the world's largest manufacturing economy, and will soon become the world's largest consumer economy. Any company that wishes to prosper in the coming years must have a presence there, but to succeed one must understand how the Chinese do business.

Wireless for the Here and Now

September 2, 2003 8:46 am | News | Comments

By David McCartney, Wavecom We in the wireless business have traditionally focused our efforts on the development and introduction of new, bleeding-edge technologies. Our priority has always been enabling the latest feature, smallest size or "killer" application. Well . . . those were the good old days! Today — and for the foreseeable future — we must be prepared to examine the 'value proposition' of our respective technology and product offerings.

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Reality of the Future

September 2, 2003 8:46 am | News | Comments

James A. Norling Jr., Motorola Inc. The old axiom "the only thing for certain is uncertainty" seems to be a good description of the current and future situation of the wireless industry — or more specifically the mobile wireless infrastructure industry. Stating the obvious, we can certainly look back at where the industry has come and where it is today, but looking ahead is murky at best.

Sharing the 5 GHz Band

September 2, 2003 8:46 am | News | Comments

By David A. Case NCE, NCT For the wireless industry, July 5th 2003 was a very important day, especially for the RLAN industry. This date is important because effective on that day was the adoption of numerous ITU-R resolutions and regulations that were approved at the World Radio Conference which ended 24 hours earlier.

Wire Bonder

September 2, 2003 8:42 am | Product Releases | Comments

Palomar Technologies announces Model 8000 high-speed thermosonic ball-and-stitch wire bonder. With a 12 × 6 inches X-Y bond area, it can handle large hybrids, MCMs (multichip modules) or several smaller devices at one time. The bonder is capable of placing 8 wires per second with a table repeatability of better than ± 5 μ m....

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