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RF Solutions

August 30, 2004 7:45 am | Product Releases | Comments

SiGe Semiconductor announces a power amplifier, switch, and RF front-end reference design made to improve performance of Wi-Fi systems. The SE2528L power amplifier delivers output power of up to +23dBm at 3.0% error vector magnitude (EVM) while operating in 802.11g mode. When paired with the SE2560L DPDT RF switch, which features low insertion losses and high linearity, manufacturers can design systems that achieve output power of +20dBm at...

IC Packages

August 30, 2004 7:45 am | Product Releases | Comments

National Semiconductor announces IC packages as thin as four sheets of office paper. These micro Surface Mount Device (SMD) and Leadless Leadframe Package (LLP) 0.4 mm packages are available in National's analogue amplifier products now. The SMD packages are available in 4- to 36-bump-count packages....

Attenuators with Connectors

August 30, 2004 7:45 am | Product Releases | Comments

Mini-Circuits introduces their line of Adaptenuators, which simply an attenuator with different types of input and output connectors. The benefits of using these devices include improved interface matching and eliminating the hassle of working with, misplacing, and stocking different types of adapters to fit attenuators....


Ceramic Technology

August 30, 2004 7:45 am | Wireless Design & Development | Product Releases | Comments

Murata announces Planar High-density Passive Device (PHPD) -- a technology that is suitable for low-height components. PHPD technology, which is realized by thin film printing on high Q ceramics, can be applied for components including filters, diplexers, baluns, couplers, impedance transformers, phase transformers, power combiners and dividers, directional power monitors, and mode transformers....

LDMOS Packages

August 30, 2004 7:45 am | Product Releases | Comments

Kyocera introduces a line of brazed copper laminate LDMOS packages. These designs allow users to achieve a 16 to 18% improvement in Theta Jc when compared to traditional CuW heatsinks. The package design provides high "flange thermal dissipation" utilizing the robust brazed assembly process. The brazed configuration does not require a change from the preferred AuSi die attach process....

Foundry Design Kits

August 30, 2004 7:45 am | Product Releases | Comments

TriQuint Semiconductor announces the availability of new Advanced Design System (ADS) design kits for seven of the pHEMT processes available through its Richardson, TX location. The kits contain sets of scalable passive and active elements for four 0.25um pHEMT processes, the 0.15um LN-pHEMT process, the 0....

Manufacturing and Design Brochure

August 30, 2004 7:44 am | Product Releases | Comments

Pentair announces a detailed brochure highlighting its global design and manufacturing capabilities of enclosures for OEMs in such industries as medical, security, military, datacom, telecom, and other EOEMs. The full color, 16-page brochure, entitled Partner with Pentair Electronic Packaging, provides a comprehensive overview of the company's global manufacturing capabilities....

Transformers and Inductors

August 30, 2004 7:44 am | Product Releases | Comments

Renco introduces a 200+ page databook, including photos of their new facility and specifications for thousands of transformers and inductors. The book also includes toroids, chokes, and common mode chokes, drum corews, E-Klips, and MIL Spec inductors....


Power Systems Brochure

August 30, 2004 7:44 am | Product Releases | Comments

A new 12-page brochure from Unipower features hot-swap power systems from 200 to 7,500 W. There are eight series of products, each consisting of hot-swap power modules and a compatible 19 inches system rack. Systems are available in 1U, 2U or 3U height. The brochure has a two-page description of each product series and a series selection guide....

Digitizer Datasheet

August 30, 2004 7:44 am | Product Releases | Comments

Acqiris releases a datasheet that details the company's V-class DC440 12-bit resolution 400 MS/s CompactPCI digitizer. The datasheet outlines the device's features including the ability to measure signals up to 300 MHz with a low signal-to-noise ration of 65 dB and a spurious free dynamic range (SFDR) OF 80 dB, making the digitizer suitable for applications where high frequency input is required....

Datasheet for Power Management Processes

August 30, 2004 7:44 am | Product Releases | Comments

PolarFab announces an datasheet on the company's 0.5-micron, 40 V BCD/Power BiCMOS technology, the PBC4 process, available on 6 inches and 8 inches and suitable for power management applications. The datasheet outlines typical uses for the PBC4 process, including its use in 5 V CMOS and a range of 12 to 40 V LDMOS devices, as well as for all power IC applications at or below 40 V....


Featured Technology The Testing Needs of WLAN Technology

August 30, 2004 7:07 am | Product Releases | Comments

In order for Wireless LANs to achieve the performance demanded by corporate buyers, equipment and chipset manufacturers will need better test equipment. By Dr. Thomas Alexander, Rick Denker, and Gerard Goubert Today's WLANs resemble the early days of cell phones, whose first users were driven by the great convenience, and whose later users demanded much more sophisticated features and reliability: the transparent roaming, compact equipm...

Cover Story Integrating Ultra CMOS Designs in GSM Front Ends

August 30, 2004 7:06 am | Product Releases | Comments

Today's handsets require an RF front-end that can select between transmit and receive, as well as select different frequency bands. New processes remove the size and bulk associated with traditional switching devices. By Dylan Kelly Early handset designs could duplex between transmit and receive using a circulator (see Figure 1a)....

Frequency Multiplier Chips

August 18, 2004 10:03 am | Product Releases | Comments

Hittite introduces two low noise GaAs PHEMT x2 active frequency multiplier chips. These broadband multipliers are suitable for use in LO multiplier chains in microwave and VSAT radios yielding reduced inventory count vs. traditional approaches. When driven with a 0 dBm signal, the HMC448 provides +11 dBm of typical output power and excellent Fo and 3Fo isolation of 20 dB with respect to the output level....

Featured Technology Simplified Lossy Filter Design

August 17, 2004 11:43 am | Product Releases | Comments

Minimax lossy filters are designed with only one data table and two attenuation charts to produce direct-coupled bandpass filters using dissipative physical components. By Thomas R. Cuthbert RF filter designers have long been concerned about the fact that all components are lossy, i.e., dissipate some energy, all the while developing sophisticated ways to design lossless filters that produce classical response shapes 1 ....


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