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Memory ICs

December 23, 2004 7:57 am | Product Releases | Comments

Matrix Semiconductor introduces up to 64 megabytes of storage per 3-D Memory (3DM) chip. Matrix 3DM is available as a standard semiconductor component (TSOP Package) and can also be incorporated into standard memory card formats such as MultiMediaCard (MMC). The primary market for Matrix 3DM is content publishing for mobile devices, such as handheld computers, mobile phones, portable audio and video players, advanced toys, and game consoles...

Bluetooth Software

December 23, 2004 7:55 am | Product Releases | Comments

Cambridge Consultants launches its Bluetooth v1.2-compliant Mezoe software, comprising a protocol stack and extensive library of application profiles. The profiles and protocol stack — Interface Express and BlueStack — are optimized for deeply-embedded applications with limited hardware resources....

Electric Field Solver Software

December 23, 2004 7:55 am | Product Releases | Comments

IES announces the release of ELECTRO 6.2, the latest version of their 2D electric field solver software. Used for applications such as high voltage shielding, cables, transformers, insulators and bushings, transmission lines, lightning arrestors and pulsed power systems, ELECTRO 6.2s calculations include electric field strength, transmission line parameters and capacitance....


Circuit Design Software

December 23, 2004 7:53 am | Product Releases | Comments

Electronics Workbench Launches Multisim 8, a circuit design and simulation system. Repetitive capture tasks are optimized, so the designer is free to create, test and ultimately perfect their designs. Multisim 8 includes real Virtual Instruments from Tektronix. The software includes Dynamic Probes, a time-saving function....

Brand of Professional Antenna Products

December 23, 2004 7:52 am | Product Releases | Comments

PCTEL, Inc. announces that it has entered into an agreement to acquire selected assets associated with Andrew Corporations' mobile antenna business. The company has agreed to pay $10 million in cash for the selected assets. The acquisition is part of PCTEL's continuing plan to solidify a leadership position within high-growth wireless communications markets....

All-In-One, IEEE 802.15.4/ZigBee SoC Solution

December 23, 2004 7:49 am | Wireless Design & Development | Product Releases | Comments

Chipcon unveils the CC2430 as part of its low-power, low-data-rate RF IC offerings. This device offers the wireless market a leading-edge System-on-Chip (SoC) solution, combining the unique features of the CC2420 with the technology of the 8051 MCU, 128 kB of FLASH memory, 8 kB of RAM, plus other powerful features....

The Next Generation of 802.11 Wireless LAN

December 23, 2004 7:40 am | by As next generation wireless applications emerge, higher WLAN data throughput will be required to meet expectations of performance. James Michael Wilson | Product Releases | Comments

In response to growing market demand for higher-performance WLANs, the IEEE-SA approved the creation of 802.11 TGn in 2003. The scope of TGn's objective is to define modifications to the PHY and MAC layers that deliver a minimum of 100 Mb/s throughput at the MAC SAP (see Figure 1). This minimum throughput requirement represents an approximate four-fold increase in WLAN throughput performance compared to today's 802....

RFID Tag Design

December 23, 2004 7:39 am | by Multi-dimensional technique enables fast, direct tuning of the antenna's match to the tag IC. Cory Edelman and Murthy Upmaka, Agilent Eesof | Product Releases | Comments

The interaction of the RFID reader and tag is of great interest to the RFID system designer. The environment is likely to include many reflective and absorptive surfaces as well as other tags. In addition, the increasing use of other RF systems in offices and industry means that other strong RF emitters might be operating near the RFID system, although in other frequency bands....


Compact 3G Receiver Design

December 23, 2004 7:33 am | by Arild T. Kolsrud | Product Releases | Comments

Advancements in component miniaturization and integration are paving the way for compact high-end communications receivers that do not sacrifice performance for cost or size. RF component technology is getting better, smaller, and more efficient. This makes it possible to make communications receivers smaller than ever....

Managing RFIC Test Challenges for WLAN Services

December 23, 2004 7:33 am | by Cost-effective, high-performance, reconfigurable test systems are the mantra for next generation WLAN RF components. John Lukez | Product Releases | Comments

The rapid growth of WLAN systems has created extraordinary challenges for RFIC testing. The emergence of WLAN standards is driving key performance characteristics such as channel bandwidths and data rates to unprecedented levels. To meet evolving requirements in WLAN and communications services, IC manufacturers need cost-effective, high-performance ATE systems that are easily upgradeable, maintain high-accuracy, and boost test throughput....

A Novel RFDAC Design

December 23, 2004 7:33 am | by Michael Hopkins | Product Releases | Comments

The RFDAC breaks the Nyquist frequency barrier with improved SFDR, IMD, and noise performance. In conventional RF synthesizer and modulator systems, DACs are used as baseband sources to convert digitally processed signals to analog signals, which are then filtered and applied to the inputs of analog mixers for RF upconversion....

Automated Test Solution

December 16, 2004 6:38 am | Product Releases | Comments

Agilent introduces an automated test solution for functional, at-speed test that reduces the cost of testing high-speed, system-on-a-chip (SOC) devices to the lowest in the industry. Part of the Agilent 93000 SOC Series, this complete high-speed I/O solution enables functional testing of high-pin-count devices, such as next-generation PC chipsets up to speeds of 3....

Micro-Fabrication Techniques for Millimeter-Wave Devices

November 30, 2004 6:28 am | Product Releases | Comments

Today, as frequencies increase, so does the pressure to reduce form factors and footprints. This is the driving force behind MEMS, and the movement it starting to target mm-wave devices. By Rich Chen The growth of the wireless communication industry has strengthened interest in millimeter-wave circuits....

PCI Module

November 23, 2004 11:18 am | Product Releases | Comments

Pentek introduces its latest in a series of PCI modules. The 7631A is a 16-channel multiband digital receiver that features two 14-bit A/Ds with a Virtex-II FPGA for direct wideband signal processing at sample rates as high as 105 MHz. Pentek's GateFlow tool suite allows implementation of user-defined signal processing functions in the gate array....

Diode Arrays

November 23, 2004 11:18 am | Product Releases | Comments

California Micro Devices announced the CM1218 and CM1219, low capacitance families of Zener diode arrays for electrostatic discharge (ESD) protection. The CM1219 features a low input capacitance of 4pF and protects ESD strikes up to ± 8 kV contact discharge, while the CM1218 with a low 7pF input capacitance provides ESD protection at ± 15 kV contact discharge....


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