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Smart Card ICs

December 23, 2004 7:57 am | Product Releases | Comments

TDK Semiconductor debuts three smart card interface circuits: the TDK 73S8023C, 73S8024C, and the 73S8010C. These chips possess efficiency of 85% and a small size step-up/step-down converter that provides high card current capability for such card interfaces, with up to 100 mA supplied to the card....

Developer Tool Suite

December 23, 2004 7:57 am | Product Releases | Comments

PrismTech announces OpenFusion SCA OE, a COTS implementation of the SCA specification. This vertically-integrated and commercially-supported suite of middleware and developer tools simplifies the development of SCA-compliant radios. By providing a pre-integrated and optimized product (addressing the RTOS, ORB, and core framework layers of the SCA), PrismTech helps the waveform developer to focus on application value-add by reducing middlewa...

Design Library

December 23, 2004 7:57 am | Product Releases | Comments

Agilent announces its ultra-wideband (UWB) Design Exploration Library, which speeds design development. The company also announces that Daido Steel Co. Ltd. has selected Agilent's ADS 2004A EDA software and the new design library to help speed its development of bandpass filters used for UWB transceivers....

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Prototyping Development Platform

December 23, 2004 7:57 am | Product Releases | Comments

Spectrum Signal Processing announces the flexComm™ SDR-3000 MRDP, a MILCOM rapid-prototyping development platform. The platform is an RF to Ethernet commercial off-the-shelf (COTS) solution targeting military communications programs. This Software Communications Architecture (SCA) enabled platform integrates Spectrum's SDR-3000 with a DRT-2110 radio frequency (RF) front-end transceiver from Digital Receiver Technology, Inc....

Device Library

December 23, 2004 7:57 am | Product Releases | Comments

Ansoft Corporation and Taiyo Yuden announce the release of a device library for Ansoft Designer™ and Nexxim™ based on Taiyo Yuden's high-density miniaturized surface-mount components. The component library helps engineers designing electronic equipment, such as Wireless Local Area Networks (WLANs), car navigation systems, base stations and cellular handsets, by providing electrical responses and mechanical layout features for manufa...

Choke Inductor

December 23, 2004 7:57 am | Product Releases | Comments

Murata Electronics announces a wire wound choke inductor — the LQH2MC series. This addition to Murata's line of general and choke application inductors provides a wide inductance range with the maximum height of 0.95 mm allowing for lower profile designs. It is designed for all general and choke applications, but is especially suitable for cellular white LED applications....

LTCC Resistors

December 23, 2004 7:57 am | Product Releases | Comments

Ferro Electronic Material Systems introduces LTCC resistors that combine low temperature coefficient of resistance (TCR) with tight tolerances and eliminate the need for discrete resistor components. The 82-series post-fired thick film resistor pastes for A6M/Gold LTCC were developed for high frequency transmitter/receiver modules used in military and other applications....

Security Engine Controllers

December 23, 2004 7:57 am | Product Releases | Comments

Interpeak announced the integration of their IPsec solution and Freescale Semiconductor's ColdFire and PowerQUICC hardware security engine controllers (SEC). IPsec is the IETF standard for secure IP communication over the Internet, and comprises a set of protocols that encrypt and authenticate all IP packets....

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Amplifiers for Infrastructure Applications

December 23, 2004 7:57 am | Product Releases | Comments

M/A-COM introduces a family of 0.5, 1.0, and 2.0 watt amplifiers for commercial base station, and repeater infrastructure applications. The family of amplifiers includes: SMA2001 - a broadband, high dynamic cascadable amplifier with a low noise figure of 2.5 dB and high IP3 of 36.5 dBm; PA2001 - 1 watt RF linear driver amplifier with a low noise figure of 2 dB and a high OIP3 level of +46....

EMI Filter Arrays

December 23, 2004 7:57 am | Product Releases | Comments

ON Semiconductor introduces four highly-integrated electromagnetic interference (EMI) filter arrays with electrostatic discharge (ESD) protection in thin DFN packages. Specifically designed for high-speed data interfaces in mobile phones, these 4-channel, 6-channel, and 8-channel filters provide reliability in a drop-in replacement footprint (1....

Direct Conversion Modulator

December 23, 2004 7:57 am | Product Releases | Comments

A direct conversion modulator from Linear Technology enables the design of next generation, less costly 3G wireless base station transmitters. The LT5528 is a direct I-Q modulator with uncompromising performance. The LT5528 is targeted for high performance wireless infrastructure applications, including W-CDMA, TD-SCDMA, GSM, and PHS....

UMTS PA Module

December 23, 2004 7:57 am | Product Releases | Comments

TriQuint introduces the TQM7M60001 dual-band UMTS power amplifier module (PAM) in a small form factor — 4 × 4 × 1.1 mm. The module is designed to support cost-effective GSM/EDGE/UMTS (HSDPA) compressed mode phone architectures with only one antenna. The TQM7M6001 power amplifier module's biasing circuit is optimized for low idle current consumption (below 30 mA), which results in increased handset talk time in UMTS mode....

Crystal Packaging Technology

December 23, 2004 7:57 am | Wireless Design & Development | Product Releases | Comments

Fox introduces a quartz crystal packaging technology that provides a cost reduction of up to 20% or more over conventional ceramic packaging, as well as eliminating the recurring problems of ceramic shortages. The FQ Series is initially offered in three package sizes, each available in 2 or 4 pad configurations: 10 × 4....

Component Software Library

December 23, 2004 7:57 am | Product Releases | Comments

TDK Ltd. and Ansoft announced the release of a library for TDK's capacitor, inductor, common mode filter, and ferrite bead components for use in Ansoft Designer™. The component library helps engineers to design electronic equipment, such as Wireless Local Area Networks (WLANs), car navigation systems, base stations, and cellular handsets....

Diode Modules

December 23, 2004 7:57 am | Product Releases | Comments

X-FAB introduces a new PIN-diode module for its 0.6 μm BiCMOS technology (XB06). It is now possible to integrate PIN diodes with CMOS and BiCMOS transistors on a single chip. The parameters of standard XB06 transistors are not influenced by the integration of PIN diodes. The significant advantage of PIN diodes over conventional PN diodes is a reduction in barrier capacitance of around 80%....

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