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Receiver Reference Design

April 4, 2005 8:47 am | Product Releases | Comments

Lattice Semiconductor announces its Rake Receiver reference design, targeted at basestations in wireless telecom applications. A Rake Receiver is used to counter the effects of RF multipath fading due to atmospheric absorption, ionospheric reflection and refraction, and reflection from terrestrial objects such as mountains and buildings....

Transmit Filter

April 4, 2005 8:47 am | Product Releases | Comments

Agilent announces a high-performance film bulk acoustic resonator (FBAR) full-band transmit filter for handsets, data cards, and other wireless products operating in the U.S. PCS (personal communications service) frequency band. The ACPF-7003 features higher rejection — 35 dB minimum, 45 dB typical in the 1930 to 1990 MHz receive band — than the company’s ACPF-7002 full-band filter....

Integrated Flow

April 4, 2005 8:47 am | Product Releases | Comments

Arithmatica and Cadence Design Systems, Inc. announce an integrated flow. Developed as part of the Cadence® OpenChoice Program, the flow includes Arithmatica CellMath silicon IP as well as Cadence synthesis technology — Encounter™ RTL Compiler synthesis — and Encounter Conformal® formal verification tools....

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Spiral Inductor Design Kit

April 4, 2005 8:47 am | Product Releases | Comments

UMC and Ansoft Corporation announce a parameterized spiral inductor design kit based on full-wave simulation. The kit enables RFCMOS designers to create and simulate custom inductor geometries by directly linking Ansoft's HFSS®, Ansoft Designer®, and Nexxim™ with UMC's CMOS process parameters....

Receive Module

April 4, 2005 8:47 am | Product Releases | Comments

Aethercomm Part Number Rx 3.0-3.5-1.0 is an S band receive module that includes a digital phase shifter and attenuator along with low noise amplification. This module exhibits a typical noise figure of 1.0 dB. Minimum gain across the band is 32 dB with typical gain flatness of ± 0.50 dB. This Rx unit has good phase linearity performance over the band....

Physical IP

April 4, 2005 8:47 am | Product Releases | Comments

Virage Logic announces its Silicon Aware IP™ initiative. Silicon Aware IP is Physical IP, such as memories, logic, and I/Os, designed with embedded infrastructure IP for test, diagnostics, repair, and yield enhancements. The result is IP that is high yielding and enables quick time-to-volume at advanced process nodes....

Flash Microcontroller

April 4, 2005 8:47 am | Product Releases | Comments

EM Microelectronic announces a Flash microcontroller, the EM6580, combining several features including true low current operation with no external components, 4-bit ADC or 12-level voltage level detector, and on-chip Flash memory. It is also possible to store a unique serial ID number on each device produced, allowing for identification and traceability....

Space-Qualified Switch

April 4, 2005 8:47 am | Product Releases | Comments

Dow-Key announces a space-qualified miniaturized SP3T switch. This unit (P/N 431HC-730822) offers a solution for S-band and C-band redundancy systems. Maximum weight is 98 grams. DC characteristics include 24 to 30 VDC (28 VDC nominal) operating voltage and 400 mA (maximum) operating current at 28 VDC and 20° C....

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Field Programmable Gate Arrays

April 4, 2005 8:47 am | Product Releases | Comments

QuickLogic announces the Eclipse II family of ultra low power FPGAs, available for applications requiring components that operate over the industrial temperature range. The product family provides small form-factor packaging, instant-on capability, and bulletproof design security from IP theft and reverse engineering....

In This Corner…

April 4, 2005 8:43 am | Product Releases | Comments

Ernest Worthman, Editorial Director I’m a fan of competition — make no mistake about it. Theoretically, competition is supposed to make things better and cheaper, among other things. Most of the time it does work that way — but not necessarily always. So, I’ve been keeping an ear to the rail with ZigBee, wondering how long it would take before we saw competition start to show up....

Quad-Band GSM/GPRS PA Module

April 4, 2005 8:18 am | Product Releases | Comments

TriQuint introduces the TQM7M4006 quad-band GSM850/GSM900/DCS/PCS power amplifier module (PAM) in a small form factor — 5 × 5 × 1.1 mm. The device is a 3 V power amplifier module designed for mobile handset applications. The device employs the company’s InGaP HBT technology in combination with CuFlip™ (flip-chip) assembly technology....

Digital Filter Design Toolkit

April 4, 2005 8:18 am | Product Releases | Comments

NI announces the NI LabVIEW Digital Filter Design Toolkit Version 7.5, which includes tools for modeling and creating software-based digital filters as well as LabVIEW FPGA and C code generation capabilities for chip-level implementation. With the toolkit, design and test engineers can use the LabVIEW graphical development environment to ensure a seamless digital filter design process from conception to completion....

Two-Chip Radio Solution

April 4, 2005 8:18 am | Product Releases | Comments

Maxim introduces the MAX2392 and MAX2507, RF to baseband TD-SCDMA radio solution reference designs. Available as an analog or digital interface, each reference design encompasses the functionality of the radio — from antenna to baseband. A 100-pin connector lets the radio interface with, and be controlled by, a PC or baseband emulator....

RF Connectivity Products

April 4, 2005 8:18 am | Product Releases | Comments

Aerocomm announces the ACE family of RF modems. ACE6490 and ACE6790 are housed in rugged NEMA-4x enclosures, designed to withstand extreme weather or other severe surroundings. Each product delivers variable output power up to one watt at 900 MHz. The products embed two protocols to offer flexibility for rugged applications....

Transmission Implementation of Emerging Serial Standards

February 25, 2005 11:41 am | Product Releases | Comments

Emerging serial chip-to-chip and backplane interconnects are the next level in faster, smaller and more robust device development. And transmission infrastructure standards are next on the agenda. By Ron Warner and Doron Lapidot The movement toward serial chip-to-chip and backplane interconnects continues at a frantic pace, particularly in the communications and storage arena....

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