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Amplifiers for Infrastructure Applications

December 23, 2004 7:57 am | Product Releases | Comments

M/A-COM introduces a family of 0.5, 1.0, and 2.0 watt amplifiers for commercial base station, and repeater infrastructure applications. The family of amplifiers includes: SMA2001 - a broadband, high dynamic cascadable amplifier with a low noise figure of 2.5 dB and high IP3 of 36.5 dBm; PA2001 - 1 watt RF linear driver amplifier with a low noise figure of 2 dB and a high OIP3 level of +46....

EMI Filter Arrays

December 23, 2004 7:57 am | Product Releases | Comments

ON Semiconductor introduces four highly-integrated electromagnetic interference (EMI) filter arrays with electrostatic discharge (ESD) protection in thin DFN packages. Specifically designed for high-speed data interfaces in mobile phones, these 4-channel, 6-channel, and 8-channel filters provide reliability in a drop-in replacement footprint (1....

Direct Conversion Modulator

December 23, 2004 7:57 am | Product Releases | Comments

A direct conversion modulator from Linear Technology enables the design of next generation, less costly 3G wireless base station transmitters. The LT5528 is a direct I-Q modulator with uncompromising performance. The LT5528 is targeted for high performance wireless infrastructure applications, including W-CDMA, TD-SCDMA, GSM, and PHS....


UMTS PA Module

December 23, 2004 7:57 am | Product Releases | Comments

TriQuint introduces the TQM7M60001 dual-band UMTS power amplifier module (PAM) in a small form factor — 4 × 4 × 1.1 mm. The module is designed to support cost-effective GSM/EDGE/UMTS (HSDPA) compressed mode phone architectures with only one antenna. The TQM7M6001 power amplifier module's biasing circuit is optimized for low idle current consumption (below 30 mA), which results in increased handset talk time in UMTS mode....

Crystal Packaging Technology

December 23, 2004 7:57 am | Wireless Design & Development | Product Releases | Comments

Fox introduces a quartz crystal packaging technology that provides a cost reduction of up to 20% or more over conventional ceramic packaging, as well as eliminating the recurring problems of ceramic shortages. The FQ Series is initially offered in three package sizes, each available in 2 or 4 pad configurations: 10 × 4....

Component Software Library

December 23, 2004 7:57 am | Product Releases | Comments

TDK Ltd. and Ansoft announced the release of a library for TDK's capacitor, inductor, common mode filter, and ferrite bead components for use in Ansoft Designer™. The component library helps engineers to design electronic equipment, such as Wireless Local Area Networks (WLANs), car navigation systems, base stations, and cellular handsets....

Diode Modules

December 23, 2004 7:57 am | Product Releases | Comments

X-FAB introduces a new PIN-diode module for its 0.6 μm BiCMOS technology (XB06). It is now possible to integrate PIN diodes with CMOS and BiCMOS transistors on a single chip. The parameters of standard XB06 transistors are not influenced by the integration of PIN diodes. The significant advantage of PIN diodes over conventional PN diodes is a reduction in barrier capacitance of around 80%....

Memory ICs

December 23, 2004 7:57 am | Product Releases | Comments

Matrix Semiconductor introduces up to 64 megabytes of storage per 3-D Memory (3DM) chip. Matrix 3DM is available as a standard semiconductor component (TSOP Package) and can also be incorporated into standard memory card formats such as MultiMediaCard (MMC). The primary market for Matrix 3DM is content publishing for mobile devices, such as handheld computers, mobile phones, portable audio and video players, advanced toys, and game consoles...


Electric Field Solver Software

December 23, 2004 7:55 am | Product Releases | Comments

IES announces the release of ELECTRO 6.2, the latest version of their 2D electric field solver software. Used for applications such as high voltage shielding, cables, transformers, insulators and bushings, transmission lines, lightning arrestors and pulsed power systems, ELECTRO 6.2s calculations include electric field strength, transmission line parameters and capacitance....

Bluetooth Software

December 23, 2004 7:55 am | Product Releases | Comments

Cambridge Consultants launches its Bluetooth v1.2-compliant Mezoe software, comprising a protocol stack and extensive library of application profiles. The profiles and protocol stack — Interface Express and BlueStack — are optimized for deeply-embedded applications with limited hardware resources....

Circuit Design Software

December 23, 2004 7:53 am | Product Releases | Comments

Electronics Workbench Launches Multisim 8, a circuit design and simulation system. Repetitive capture tasks are optimized, so the designer is free to create, test and ultimately perfect their designs. Multisim 8 includes real Virtual Instruments from Tektronix. The software includes Dynamic Probes, a time-saving function....

Brand of Professional Antenna Products

December 23, 2004 7:52 am | Product Releases | Comments

PCTEL, Inc. announces that it has entered into an agreement to acquire selected assets associated with Andrew Corporations' mobile antenna business. The company has agreed to pay $10 million in cash for the selected assets. The acquisition is part of PCTEL's continuing plan to solidify a leadership position within high-growth wireless communications markets....

All-In-One, IEEE 802.15.4/ZigBee SoC Solution

December 23, 2004 7:49 am | Wireless Design & Development | Product Releases | Comments

Chipcon unveils the CC2430 as part of its low-power, low-data-rate RF IC offerings. This device offers the wireless market a leading-edge System-on-Chip (SoC) solution, combining the unique features of the CC2420 with the technology of the 8051 MCU, 128 kB of FLASH memory, 8 kB of RAM, plus other powerful features....

The Next Generation of 802.11 Wireless LAN

December 23, 2004 7:40 am | by As next generation wireless applications emerge, higher WLAN data throughput will be required to meet expectations of performance. James Michael Wilson | Product Releases | Comments

In response to growing market demand for higher-performance WLANs, the IEEE-SA approved the creation of 802.11 TGn in 2003. The scope of TGn's objective is to define modifications to the PHY and MAC layers that deliver a minimum of 100 Mb/s throughput at the MAC SAP (see Figure 1). This minimum throughput requirement represents an approximate four-fold increase in WLAN throughput performance compared to today's 802....

RFID Tag Design

December 23, 2004 7:39 am | by Multi-dimensional technique enables fast, direct tuning of the antenna's match to the tag IC. Cory Edelman and Murthy Upmaka, Agilent Eesof | Product Releases | Comments

The interaction of the RFID reader and tag is of great interest to the RFID system designer. The environment is likely to include many reflective and absorptive surfaces as well as other tags. In addition, the increasing use of other RF systems in offices and industry means that other strong RF emitters might be operating near the RFID system, although in other frequency bands....


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