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Circuit Protection Modules

May 30, 2003 11:46 am | Product Releases | Comments

Bel introduces SIP circuit protection modules. These integrated devices combine fuses, overvoltage protectors and resistor networks into a vertical mount, SIP configuration to conserve PCB real estate, optimize manufacturing throughput, and accelerate time-to-market. The modules feature Bel's 1....

Dual EMI Air Filters

May 30, 2003 11:46 am | Product Releases | Comments

Broadband dual EMI air filters from Universal Air Filter integrate technology that meets the EMI/RFI noise shielding requirements of broadband communications equipment utilizing forced air cooling techniques. The Broadband air filter integrates the honeycomb and/or stainless steel mesh EMI shield into the air filter assembly....

Open Frame Rack

May 30, 2003 11:46 am | Product Releases | Comments

Schroff introduces a Seismic Open Frame Rack, in 19 inches and 23 inches widths, ideal for data communication centers and telecommunication equipment central offices. The Rack provides a mechanically secure platform for datacom or telecom equipment, ensuring both equipment protection and network integrity during earthquake tremors....

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Dual Driver/Receiver

May 30, 2003 11:46 am | Product Releases | Comments

Fairchild Semiconductor announces the FIN1049, a LVDS dual driver/receiver pair that provides high-speed control or data transfer in and outside of the box. The dual driver/receiver combines the functionality of two single driver/receiver devices in one 16-lead TSSOP package. The FIN1049 device has a 400+ Mbps bandwidth that provides a low channel-to-channel and pulse skew of 350 ps maximum....

IF-to-Baseband Receiver

May 30, 2003 11:46 am | Product Releases | Comments

The diversity receiver, the AD6650, is a member of the MxFE family and is based on a mixed-signal design technique that partitions the signal path according to performance-enhancing, rather than analog/digital, boundaries. The chip integrates a digitally controlled VGA, an IF-to-baseband demodulator, analog low-pass filtering, and dual analog-to-digital converters....

Circuit Simulation and Analysis Software

May 30, 2003 11:38 am | Product Releases | Comments

APLAC Solutions introduces version 7.90 of its APLAC circuit simulation and analysis software. APLAC 7.90 has an improved user interface that facilitates schematic creation, simulation, and use of utilities. The analysis setup includes templates and control forms with over 100 predefined simulations for circuit-specific and generic tasks....

Interface Headers

May 30, 2003 11:38 am | Product Releases | Comments

Molex introduces Micro-Fit 3.0™ Compliant Pin Interface headers. These press-fit headers require no soldering. The headers are appropriate for either power or signal uses and can carry up to five amperes per circuit. They are fully polarized to ensure proper mating and feature fully isolated contacts....

GSM/GPRS Transceivers

May 30, 2003 11:38 am | Product Releases | Comments

Silicon Laboratories announces the Aero™ I GSM/GPRS transceiver. The Aero I is based on RF CMOS technology, and is suited for small GSM/GPRS handsets and modules where small board space is required. The transceiver allows a triple band radio, excluding the power amplifier and switch, to be implemented in 1....

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Power Isolators

May 30, 2003 11:38 am | Product Releases | Comments

Designed to meet a 1.5 inches width by 1.92 inches footprint and weighting 180 grams, this 400 MHz isolators offers a 12% nominal bandwidth to provide 18 dB isolation and a low insertion loss of 0.40 dB to maximize an amplifier's gain in a space transmitter application. When operating at a full 70 watts forward power mode, the isolator is designed to meet or exceed a +6 dB margin of multipacting reliability and the isolator can withstand a ...

Transistors

May 30, 2003 11:38 am | Product Releases | Comments

The FPD1500SOT89 is a packaged depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT). It utilizes a 0.25 μm × 1500 μm Schottky barrier Gate, defined by high-resolution stepper-based photolithography. The recessed and offset Gate structure minimizes parasitics to optimize performance, with an epitaxial structure designed for improved linearity over a range of bias conditions and input power levels....

Switched Combiner

May 30, 2003 11:38 am | Product Releases | Comments

Technical Research and Manufacturing announces a low loss, high power four-way switching combiner and divider in a single package. The unit offers isolation between combiner and divider module of greater than 90 dB. The power divider has more than 30 dB isolation between outputs to minimize amplitude and phase changes during switching from one to four amplifiers....

Signal Processing Equipment

May 30, 2003 11:38 am | Product Releases | Comments

The WideFire-2002BP is based on the WideFire™ Technology. The Wide-Fire-2002BP features the same wireless generation capability as the WideFire-2002M, but is packaged in an application specific configuration. The WideFire-2002BP can generate live, sustained, and simultaneous AMPS/TDMA/CDMA and GSM standards and is software upgradeable to 3G capabilities....

Solid State Amplifiers

May 30, 2003 11:38 am | Product Releases | Comments

Part Number SSPA 13.7-14.5-30 is a high power, Ku band, solid state power amplifier that operates from 13.7 to 14.5 GHz. The P1dB at 25°C is 30 watts typical. The saturated output power is 35 watts typical at 25°C. Typical small signal gain is 40 dB. Noise figure is 4 dB typical at 25°C....

RF-CMOS Process

May 30, 2003 11:38 am | Product Releases | Comments

austriamicrosystems announces its 0.35 μm RF CMOS process. The CMOS base technology has been adapted for RF applications with analog/mixed-signal features from austriamicrosystems' 0.35μm silicon germanium BiCMOS process. The process features high performance transistors and a comprehensive suite of passive components characterized and tuned for RF applications....

Chip Antenna

May 30, 2003 11:38 am | Product Releases | Comments

NTK Technologies announces a series of SMD ceramic dielectric chip antennas designed for WLAN applications. The MAC2450A5362AAE series measures 11.8 × 2.5 × 0.7 mm. These dual band antennas are available with a center frequency of 2450 GH and 5362 GHz. They deliver a wide bandwidth (VSWR = 2) covering 2400 - 2500 GHz and 4900 - 5825 GHz respectively....

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