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Programmable Synthesizer PLLs

May 30, 2003 11:46 am | Product Releases | Comments

Temex introduces programmable synthesizer PLLs to reduce BOM costs for high performance microwave communication products from 100 MHz to 2.5 GHz. The first three devices of this new range are the 1050 - 1090 MHz PLC1050, the 1550 - 1620 MHz PLC1550, and the 2105 - 2175 MHz PLC2105. The PLC series PLLs display low SSB phase noise, typically around 90 dBc/Hz at 100 kHz, as well as fast switching speed....

AC Switches

May 30, 2003 11:46 am | Product Releases | Comments

The ACS family of switches is designed to control small pumps, fans, valves, relays, dispensers, door locks and micro-motors. The switches have high gate sensitivity, enabling them to be directly driven by microcontrollers and ensuring low power consumption. The high blocking voltage (up to 500 V) and clamping voltage (up to 1100 V) of the ACS devices means they can withstand the back-EMF created by inductive loads running from 240 V mains ...

Impedance Matching Pads

May 30, 2003 11:46 am | Product Releases | Comments

Models 854-012-IMP and 874-013-IMP match 50 Ohms to 75 Ohms and 75 Ohms to 50 Ohms resepectively. Both modules feature a DC - 2000 MHz frequency range and BNC connectors (male/female). These devices are a low cost solution to matching the impedance of a circuit or device under test to 50 Ohm test equipment....

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Type N Attenuator

May 30, 2003 11:46 am | Product Releases | Comments

Model 352-019-XXX is a precision 2 watt fixed attenuator that has a frequency range of DC - 18 GHz with attenuation values of 1 to 30 dB available. These units feature a VSWR of 1.35:1 maximum in a 1.76 inch long passivated stainless steel enclosure with Type N male/female connectors. www.broadwavetech....

Automatic Bonders

May 30, 2003 11:46 am | Product Releases | Comments

Model 5060 Automatic Ball Bonder and Model 5070 Automatic Wedge Bonder offer large area, deep access, ball and wedge wire bonding for microelectronic packaging applications. They have a large 12 inches× 5 inches work area and are designed for ergonomic operation. The 5060 provides thermosonic ball and stitch bonding with a heated workstage and an optional capillary heater....

Circuit Protection Modules

May 30, 2003 11:46 am | Product Releases | Comments

Bel introduces SIP circuit protection modules. These integrated devices combine fuses, overvoltage protectors and resistor networks into a vertical mount, SIP configuration to conserve PCB real estate, optimize manufacturing throughput, and accelerate time-to-market. The modules feature Bel's 1....

Dual EMI Air Filters

May 30, 2003 11:46 am | Product Releases | Comments

Broadband dual EMI air filters from Universal Air Filter integrate technology that meets the EMI/RFI noise shielding requirements of broadband communications equipment utilizing forced air cooling techniques. The Broadband air filter integrates the honeycomb and/or stainless steel mesh EMI shield into the air filter assembly....

Open Frame Rack

May 30, 2003 11:46 am | Product Releases | Comments

Schroff introduces a Seismic Open Frame Rack, in 19 inches and 23 inches widths, ideal for data communication centers and telecommunication equipment central offices. The Rack provides a mechanically secure platform for datacom or telecom equipment, ensuring both equipment protection and network integrity during earthquake tremors....

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Dual Driver/Receiver

May 30, 2003 11:46 am | Product Releases | Comments

Fairchild Semiconductor announces the FIN1049, a LVDS dual driver/receiver pair that provides high-speed control or data transfer in and outside of the box. The dual driver/receiver combines the functionality of two single driver/receiver devices in one 16-lead TSSOP package. The FIN1049 device has a 400+ Mbps bandwidth that provides a low channel-to-channel and pulse skew of 350 ps maximum....

IF-to-Baseband Receiver

May 30, 2003 11:46 am | Product Releases | Comments

The diversity receiver, the AD6650, is a member of the MxFE family and is based on a mixed-signal design technique that partitions the signal path according to performance-enhancing, rather than analog/digital, boundaries. The chip integrates a digitally controlled VGA, an IF-to-baseband demodulator, analog low-pass filtering, and dual analog-to-digital converters....

Circuit Simulation and Analysis Software

May 30, 2003 11:38 am | Product Releases | Comments

APLAC Solutions introduces version 7.90 of its APLAC circuit simulation and analysis software. APLAC 7.90 has an improved user interface that facilitates schematic creation, simulation, and use of utilities. The analysis setup includes templates and control forms with over 100 predefined simulations for circuit-specific and generic tasks....

Interface Headers

May 30, 2003 11:38 am | Product Releases | Comments

Molex introduces Micro-Fit 3.0™ Compliant Pin Interface headers. These press-fit headers require no soldering. The headers are appropriate for either power or signal uses and can carry up to five amperes per circuit. They are fully polarized to ensure proper mating and feature fully isolated contacts....

GSM/GPRS Transceivers

May 30, 2003 11:38 am | Product Releases | Comments

Silicon Laboratories announces the Aero™ I GSM/GPRS transceiver. The Aero I is based on RF CMOS technology, and is suited for small GSM/GPRS handsets and modules where small board space is required. The transceiver allows a triple band radio, excluding the power amplifier and switch, to be implemented in 1....

Power Isolators

May 30, 2003 11:38 am | Product Releases | Comments

Designed to meet a 1.5 inches width by 1.92 inches footprint and weighting 180 grams, this 400 MHz isolators offers a 12% nominal bandwidth to provide 18 dB isolation and a low insertion loss of 0.40 dB to maximize an amplifier's gain in a space transmitter application. When operating at a full 70 watts forward power mode, the isolator is designed to meet or exceed a +6 dB margin of multipacting reliability and the isolator can withstand a ...

Transistors

May 30, 2003 11:38 am | Product Releases | Comments

The FPD1500SOT89 is a packaged depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT). It utilizes a 0.25 μm × 1500 μm Schottky barrier Gate, defined by high-resolution stepper-based photolithography. The recessed and offset Gate structure minimizes parasitics to optimize performance, with an epitaxial structure designed for improved linearity over a range of bias conditions and input power levels....

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