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Signal Generator

August 30, 2004 7:45 am | Product Releases | Comments

Aeroflex announces that it has increased the frequency coverage of its 3410 series digital RF signal generators to 6 GHz to address the need for testing 802.11a wireless local area network (WLAN) devices. The 6 GHz 3416 digital RF signal generator offers all the benefits of the 3410 series RF signal generators including multi-band adjacent channel power, analog and vector modulation, a dual channel arbitrary waveform generator option, and a...

Probe Series

August 30, 2004 7:45 am | Product Releases | Comments

Cascade Microtech announces the Dual Infinity® Probe series, providing good isolation between two signals. The probe is available in GSGSG, GSSG, and SGS configurations and frequencies up to 67 GHz. The probe ensures low and stable contact resistance on aluminum pads (typically < 0.05Ω)....

Test Devices

August 30, 2004 7:45 am | Product Releases | Comments

Agilent introduces its Versatest Series Model V5400, which delivers testing across a full spectrum of memory devices. The V5400's dynamic algorithmic pattern generator (APG) and patented tester-per-site (TPS) architecture provide configuration flexibility and improvement in throughput for wafer sort and final memory testing....


RS-232 Adapter

August 30, 2004 7:45 am | Product Releases | Comments

SMART announces its Bluetooth 1.1 compliant RS-232 adapter for the industrial, medical, and scientific markets. This RS-232 adapter features an onboard antenna, an embedded configuration utility, and an embedded Bluetooth communications stack complete with the Bluetooth serial port profile. When used in combination with other Bluetooth-enabled products, the adapter replaces traditional serial cables in products such as laptop computers, ind...

Card Edge Connectors

August 30, 2004 7:45 am | Product Releases | Comments

Tyco introduces its AMP PACE card edge connectors. The connector is based on .100 inches× .200 inches centerlines and accepts .054 inches to .070 inches daughter cards. Eye of the needle contacts accommodate solder-free press fitting into a printed circuit board. Since this product is flat-rock compatible, no special tooling is required....

Smart Power Technology

August 30, 2004 7:45 am | Product Releases | Comments

X-FAB Semiconductor Foundries announces 650 V smart power technology based on a trench-isolated SOI process. The technology is suitable for any type of power net application up to 230 V. This technology is a modular process combining DMOS, bipolar, and 1-micron CMOS processing steps with dielectric insulation....

Analog Card

August 30, 2004 7:45 am | Product Releases | Comments

Agilent introduces the Audio/Video 8 analog card for its 93000 SOC Series, a card with eight independent units for true parallel, multisite analog test. The card does not require users to share the analog resources for multisite test or to purchase additional cards. The device's architecture handles all processing locally, eliminating the need for data transfer between the card and workstation and enabling higher multisite efficiency for an...

Waveguide Isolators

August 30, 2004 7:45 am | Product Releases | Comments

Raditek waveguide isolators operate up to frequencies beyond 100 GHz. The standard units are typically clear or yellow-alodyne coated aluminum. The low loss units are silver plated brass construction, typically. Virtually any wavequide type can be supplied. Either metric, US threads, or through holes can be supplied....


RF Solutions

August 30, 2004 7:45 am | Product Releases | Comments

SiGe Semiconductor announces a power amplifier, switch, and RF front-end reference design made to improve performance of Wi-Fi systems. The SE2528L power amplifier delivers output power of up to +23dBm at 3.0% error vector magnitude (EVM) while operating in 802.11g mode. When paired with the SE2560L DPDT RF switch, which features low insertion losses and high linearity, manufacturers can design systems that achieve output power of +20dBm at...

IC Packages

August 30, 2004 7:45 am | Product Releases | Comments

National Semiconductor announces IC packages as thin as four sheets of office paper. These micro Surface Mount Device (SMD) and Leadless Leadframe Package (LLP) 0.4 mm packages are available in National's analogue amplifier products now. The SMD packages are available in 4- to 36-bump-count packages....

Attenuators with Connectors

August 30, 2004 7:45 am | Product Releases | Comments

Mini-Circuits introduces their line of Adaptenuators, which simply an attenuator with different types of input and output connectors. The benefits of using these devices include improved interface matching and eliminating the hassle of working with, misplacing, and stocking different types of adapters to fit attenuators....

Ceramic Technology

August 30, 2004 7:45 am | Wireless Design & Development | Product Releases | Comments

Murata announces Planar High-density Passive Device (PHPD) -- a technology that is suitable for low-height components. PHPD technology, which is realized by thin film printing on high Q ceramics, can be applied for components including filters, diplexers, baluns, couplers, impedance transformers, phase transformers, power combiners and dividers, directional power monitors, and mode transformers....

LDMOS Packages

August 30, 2004 7:45 am | Product Releases | Comments

Kyocera introduces a line of brazed copper laminate LDMOS packages. These designs allow users to achieve a 16 to 18% improvement in Theta Jc when compared to traditional CuW heatsinks. The package design provides high "flange thermal dissipation" utilizing the robust brazed assembly process. The brazed configuration does not require a change from the preferred AuSi die attach process....

Foundry Design Kits

August 30, 2004 7:45 am | Product Releases | Comments

TriQuint Semiconductor announces the availability of new Advanced Design System (ADS) design kits for seven of the pHEMT processes available through its Richardson, TX location. The kits contain sets of scalable passive and active elements for four 0.25um pHEMT processes, the 0.15um LN-pHEMT process, the 0....

Datasheet for Power Management Processes

August 30, 2004 7:44 am | Product Releases | Comments

PolarFab announces an datasheet on the company's 0.5-micron, 40 V BCD/Power BiCMOS technology, the PBC4 process, available on 6 inches and 8 inches and suitable for power management applications. The datasheet outlines typical uses for the PBC4 process, including its use in 5 V CMOS and a range of 12 to 40 V LDMOS devices, as well as for all power IC applications at or below 40 V....



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