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Increasing Features and Reliability in Wireless Mobile Devices

September 7, 2006 11:45 am | Wireless Design & Development | Product Releases | Comments

Remember when the mobile phone was called a bag phone? This was a major accomplishment at the time. Then manufacturers began the miniaturization of the phone and they became smaller than a cigarette pack. The size reduction drove the market for new phone sales. People changed phones every two years so they would have the smallest device....

Protective Vent

September 7, 2006 8:50 am | Product Releases | Comments

Gore & Associates Inc. has released a protective vent with metal housing that performs in extreme conditions such as fluctuating temperatures, extreme moisture and large amounts of environmental contaminants. This product provides protection and pressure equalization for electrical enclosures, outdoor electronics, sensors and a wide range of other products containing electronic components....

LabVIEW 8.20 Targets Communications Test

September 7, 2006 7:30 am | Product Releases | Comments

National Instruments has released LabVIEW 8.20, the 20th anniversary edition of the LabVIEW graphical system design platform for test, control and embedded system design development. This new version extends the LabVIEW graphical programming platform with communications design, simulation and test tools specifically tailored to the needs of telecom design and test engineers....


Channel Emulation for Improved MIMO Product Design

September 7, 2006 5:24 am | Product Releases | Comments

By Jeff Abramowitz and Graham Celine MIMO technology will be the foundation for the next generation of Wi-Fi products. Whereas existing 802.11 devices use a single transmitter and single receiver, known as SISO, next generation 802.11n devices will use MIMO to leverage multiple transmit and receive antennas, delivering higher throughput (more megabits per second) and greater range (more distance between AP and client)....

Part 2: TD-SCDMA —3G technology whose time has come and Receiver Design and Integrated Solutions

September 7, 2006 5:24 am | Product Releases | Comments

By Thomas Barber, Aiguo Yan and Zoran Zvonar Receiver design is the most difficult task in the development of the UE since it carries the most complexity in the overall UE implementation. Multiple users in LCR are multiplexed via their assigned OVSF codes, however the orthogonality among different code channels is not preserved due to the delay spread in the multipath channel and the received signal at the input of the UE is subject to M...

Semiconductor Hermetic Package

September 6, 2006 1:04 pm | Product Releases | Comments

StratEdge introduces the G2420M-1 discrete semiconductor hermetic package for broadband applications. The package has seven leads (four on one side, one each on three sides) and is appropriate for single pole, double throw switch applications. They can be mounted on the board in drop-in or surface mount configurations....

Modem Development Kit

September 6, 2006 1:04 pm | Product Releases | Comments

Provigent Inc. announces the availability of a modem development kit for wireless point-to-point (PTP) systems. Based on the company’s PVG310 single-chip modem, the PVG350MDK kit allows system manufacturers to develop the digital and IF sections of a wireless PTP system and achieve rapid time-to-market....

WiMAX Mini-PCI Reference Design

September 6, 2006 12:43 pm | Product Releases | Comments

Wavesat has announced its partnership with Texas Instruments to develop a 5.8 GHz Mini-PCI module and reference design that is a development platform for WiMAX-compliant wireless systems for the 5.8 GHz unlicensed band using the company’s Evolutive WiMAXTM DM256 chip and TI’s family of WiMAX-optimized radio frequency (RF) solutions....


Automatic Die Bonder

September 6, 2006 10:54 am | Product Releases | Comments

Palomar Technologies announces the Model 3500-III, an automatic, high accuracy, precision microelectronics assembly, the flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach, and flip chip operations over a spacious 720 square inch (0.46 square meter) work area....

NR6012 Series

September 6, 2006 10:54 am | Product Releases | Comments

TAIYO YUDEN, INC. is announcing the NR6012 series of low-profile (1.2mm-height) 6 × 6mm power inductors for DC-DC converter choke coil applications in the LCD panels of notebook PCs. The 11 models in the NR6012 series offer a broad selection of low DC resistance (0.092-2.18 Ohms) and high inductance ratings (3-100µH), as well as the industry's highest current rating (1730mA) for the 6 × 6mm device form factor....


September 6, 2006 10:54 am | Product Releases | Comments

Novas Software, Inc. introduces a set of capabilities that enables designers to easily visualize and debug their complex communication protocols using transactions. The new capabilities leverage the SystemVerilog language by allowing users to describe their protocols using assertion constructs and extract the related activity as transactions....

RF Interference Mapping Software

September 6, 2006 10:54 am | Product Releases | Comments

Berkeley Varitronics Systems, Inc. introduces RF interference mapping software for use with BumbleBee™ spectrum analyzer. Honeycomb™ is interference-mapping software designed for use with the BVS Bumble Bee spectrum analyzer system. By overlaying RF data onto maps and floorplans, sources of interference can be separated from 802....

MOSFETs Portfolio

September 6, 2006 10:54 am | Product Releases | Comments

NEC Electronics Corporation announces the expansion of its power MOSFETs portfolio. These low-voltage dual N-channel MOSFETs are suited for battery-protection applications and are appropriate for use in lithium-ion battery packs for portable applications such as MP3 players, cell phones and other mobile wireless devices....

WiMAX System-on-Chip

August 25, 2006 10:14 am | Product Releases | Comments

Fujitsu Microelectronics America, Inc. has announced its Mobile WiMAX System-on-Chip (SoC) and roadmap. This highly integrated one-chip MAC and PHY mixed signal baseband SoC is designed to optimize both performance and power consumption using the company’s 90 nm process technology. It is appropriate for PC cards and mobile devices, and it is fully compliant with the IEEE 802....

Kits and RFDA Software

August 23, 2006 5:40 am | Product Releases | Comments

RF Monolithics, Inc. has begun shipping evaluation kits for its TRC101, TXC100, TXC101, TXC102 and RXC101 single chip, transceiver, transmitter and receiver IC products. The evaluation boards, available in various frequencies, are designed to serve as standalone platforms and allow for complete evaluation of the RFICs, without the need to develop code for a microcontroller....


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