Advertisement
The Source on Design and Technology for the Wireless and RF Engineer
Subscribe to Wireless Design and Development All
View Sample

FREE WDD Email Newsletter

EL Driver Module

November 1, 2005 9:58 am | Product Releases | Comments

Rogers Corporation introduces the D381B electroluminescent (EL) driver module — the newest addition to its DUREL® integrated driver product line. The D381B driver is a "standalone" EL driver module that combines all external, discrete components required to backlight monochrome displays and keypads into a single chip....

CATV Push-Pull Hybrid Amplifier

November 1, 2005 9:58 am | Product Releases | Comments

CEL announces a GaAs push-pull amplifier to its family of NEC CATV hybrids. Designed to serve as an input stage for line amplifiers, nodes, splitters, trunk amplifiers and bridgers in bandwidth-hungry networks, the MC-7831-HA delivers 1 GHz of bandwidth with low distortion and low gain change over temperature....

CDMA Power Amplifiers

November 1, 2005 9:58 am | Product Releases | Comments

Anadigics introduces a new generation of High-Efficiency-at-Low-Power (HELP™) power amplifiers (PAs) for CDMA applications. The company’s second generation HELP™ (HELP2™) CDMA PAs provide industry-leading integration, while maintaining the high performance offered by first-generation HELP PAs....

Advertisement

Low Data Rate Transceiver IC

November 1, 2005 9:58 am | Product Releases | Comments

AMI Semiconductor introduces a versatile transceiver that provides a single-chip wireless product for automotive, medical and industrial applications. The AMIS-53000 is tunable for frequencies from 300 to 928 MHz, supports ASK, FSK and GFSK modulation, and incorporates application-specific features for wireless products targeted at the medical implantable communication systems (MICS) markets....

Mixed-signal SoC

November 1, 2005 9:58 am | Product Releases | Comments

AMI Semiconductor announces that the maximum operating temperature of its SmartPower high-voltage SoC mixed-signal IC technology has been extended to 200° C. The company’s SmartPower mixed-signal semiconductor technologies allow designers to integrate complex digital and precision analog circuitry, embedded microprocessors, non-volatile memory, and high voltage functionality into a single IC....

Filter Simulation and Design Kit

November 1, 2005 9:58 am | Product Releases | Comments

Modelithics’ Filter Simulation and Design Kit includes everything needed to design common lowpass, highpass, and bandpass filters. Fully customizable Global Models™ for all components and layouts for EDA software are included. These generate simulations that enable first-pass design success that can be validated using the pre-assembled sample filters included....

Low Noise Amplifier Module

November 1, 2005 9:58 am | Product Releases | Comments

Agilent Technologies Inc. introduces a low noise figure 0.9 to 3.5 GHz MMIC (monolithic microwave integrated circuit) LNA (low noise amplifier) module with integrated shutdown capability that enhances the performance of GPS handsets. The Agilent ALM-1106’s combination of low noise figure to improve sensitivity, miniature size, low-voltage operation, and battery-saving features makes the amplifier module an appropriate choice for GPS receive...

WLAN Power Amplifier Module

November 1, 2005 9:58 am | Product Releases | Comments

The TQP777002 power amplifier module from Link Microtek is a high linearity device designed for 802.11b/g wireless LAN and Bluetooth systems, as well as other applications in the 2.4 GHz ISM band. Manufactured by TriQuint Semiconductor using the company's InGaP HBT process, the module features integrated input and output matching circuitry, an output power detector, a temperature-compensated bias network, and second- and third-stage bias ch...

Advertisement

Signal Source Analysis Suite

November 1, 2005 9:58 am | Product Releases | Comments

Tektronix, Inc. introduces a Signal Source Analysis Suite for the WCA200A, RSA3300A and RSA3408A real-time spectrum analyzers. The software package provides engineers with automated signal source analysis tools to characterize phase noise, jitter, frequency deviation and settling time for transient RF signals....

Dual-Edge PWM Controller

November 1, 2005 9:58 am | Product Releases | Comments

ON Semiconductor announces the development of working silicon for its new dual-edge pulse width modulation (PWM) controller. The company’s DC/DC switching controller specifically addresses ‘active power’ applications with highly regulated, low voltage power supplies that require high conversion efficiency to meet stringent VR11 specifications....

DECT Power Amplifier

November 1, 2005 9:58 am | Product Releases | Comments

M/A-COM announces a RoHS-compliant DECT power amplifier for applications that require dual power modes, high gain and small size at a low cost. The MAAPSS0076, with its wide voltage operating range, is a dual mode power amplifier that maximizes system performance while reducing DC power consumption....

Handheld WLAN Power Analyzer

November 1, 2005 9:58 am | Product Releases | Comments

Berkeley Varitronics’ Caterpillar™ Wi-Fi frequency and power analyzer now includes USB connectivity for 2.4 GHz and 5 GHz monitoring, recording and playback via PC. Custom Windows® software allows for real time, detailed X-Y graphing of dBm, user threshold settings and live or recorded playback (play, pause, rewind, fast forward, etc....

MMIC SP3T Switch

November 1, 2005 9:58 am | Product Releases | Comments

California Eastern Laboratories announces the release of NEC’s new UPG2150T5L SP3T (Single Pole Triple Throw) switch. This high performance GaAs MMIC switch operates at 0.5 to 2.5 GHz and is housed in a new, miniature low profile 12-pin TSQFN package, measuring 2 mm square and 0.37 mm high. This provides real flexibility for size-constrained designs such as thin PCM cards and modules....

HSUPA Development Test Capability

November 1, 2005 9:58 am | Product Releases | Comments

Aeroflex has added a High Speed Uplink Packet Access (HSUPA) test capability to the company's 6401 Air Interface Monitor Emulator (AIME) 3G mobile protocol test system. HSUPA (also referred to as Enhanced Uplink) is a 3GPP Release 6 feature that provides higher uplink data rates and is expected to be offered in parallel with HSDPA....

M8 Connectors

November 1, 2005 9:58 am | Product Releases | Comments

ERNI announces M8 male and female connectors designed for automation technology. The first products will be three- and four-pin female connectors, and a four-pin version of the male connector. These connectors can be used to build a flexible I/O-connection on the circuit board. The interconnect geometry complies with the IEC 61067-2-101 standard....

Pages

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading