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Surface Mount Filters

February 2, 2004 5:40 am | Product Releases | Comments

K&L Microwave is pleased to announces the IB60 series of filters, Microminiature packages, with the addition of gullwing pins and ground tabs for surface mount applications. These parts are manufactured using solder with a minimum liquidous temperature of 221°C. Chip and wire and ceramic product topologies are available in this configuration....

Cascade Microtech and Agilent Technologies Parametric Probing Seminar

January 30, 2004 9:04 am | Product Releases | Comments

Identify and discuss problems and challenges in making RF and DC/CV measurements. Learn how these can be overcome to ensure absolute confidence in your results. Seminar Agenda: 8 - 8:30 a.m. Continental Breakfast & Registration 8:30 - 9:30 a.m. Making Matching Measurements for Use in IC Design Bill Verzi, Agilent Technologies • Matching terminology and applications • Matching requirements for different device types...

Circuit Design and Analysis

January 21, 2004 11:49 am | Product Releases | Comments

APLAC has released version 7.91 of their circuit design and analysis software. APLAC combines an RF and analog simulation engine with analysis and optimization features. The software may be used as a stand-alone design framework or as an analysis tool integrated with other standard design environments....


Design Test System

January 21, 2004 11:49 am | Product Releases | Comments

Computer Access Technology Corporation (CATC) announces the Version 2.2 software for the BT Tracer/Trainer , CATC's Bluetooth design and verification test system. With this release, the BT Tracer/Trainer is compliant with the Bluetooth V1.2 specification. In addition, this release allows for the creation of a second, completely independent recording channel, includes a Profiles Decode toolbar for easier protocol selection and debug, and ex...

Development Suite

January 21, 2004 11:49 am | Product Releases | Comments

ARC introduces the Development Tool Suite for the ARC 600. It is a collection of tools to facilitate software and hardware development as well as co-simulation. The ARC 600 Development Tool Suite includes the ARChitect 2, MetaDeveloper, a Cycle Accurate Simulator, and MetaSim. Together these tools are designed to simplify the design of ARC processor-based SoCs by reducing the complexity of RTL integration, software development and system-le...

3-D Design Software

January 21, 2004 11:49 am | Product Releases | Comments

Ansoft introduces ePhysics, software that expands the capabilities of HFSS and Maxwell 3D. With ePhysics, engineers can incorporate three-dimensional steady-state thermal, transient thermal and linear stress analysis into their existing electromagnetic-based design flows. Coupling ePhysics with Maxwell 3D provides the cross-disciplinary analysis required in the design of electromechanical devices....

Spectrum Management Software

January 21, 2004 11:49 am | Product Releases | Comments

Summitek announces the release of OASIS II, a software package for spectrum management and spectrum and interference identification using standard spectrum analyzers or equivalent RF receivers. As a measurement tool, OASIS transforms a spectrum analyzer into a comprehensive spectrum management solution....

System Design Software

January 21, 2004 11:49 am | Product Releases | Comments

Altium Limited announces Nexar, a product that provides a solution for system-level design on an FPGA platform. Nexar integrates hardware design tools, embedded software development tools, IP-based components, virtual instrumentation and a reconfigurable development board to allow engineers to interactively design and implement a complete embedded system inside an FPGA....


Selective Radiation Meter for Collocated Sites

January 21, 2004 11:16 am | Product Releases | Comments

A long-standing issue that deals with the ability to accurately measure the contribution of each emitter at a site has been solved. Traditional measurement techniques were to turn off all emitters, then turn them back on one by one, measure their radiated emissions levels, and compute the percentage of standard radiated by each one....

RF System in Package Designs for LTCC and Co-fired Ceramic Laminate Substrates

January 21, 2004 10:57 am | Product Releases | Comments

Laminate structures and low-temperature co-fired ceramic technologies allow custom RF module designs for SiP architectures. By Michael Gaynor The design and development of RF circuits is an ever evolving work of art. From elementary circuit design to transmitter and receiver functions, RF power amplifiers for base stations and full architecture RF circuit design for satellite phones, one size doesn't fit all....

USB Switches

January 21, 2004 10:48 am | Product Releases | Comments

California Micro Devices announced three USB overcurrent protection switches. The CM3511/12/13 USB overcurrent switches support four USB ports in a single device. This allows next-generation PCs, which will have up to 8 ports per desktop, or 3 to 4 USB ports per notebook, to reduce the number of overcurrent protection devices per system by 50% vs....

Solid State Relays

January 21, 2004 10:48 am | Product Releases | Comments

Clare announces the CPC1130N, CPC1135N and CPC1231N OptoMOS solid-state relays (SSR). These 3 SSRs are optically coupled, normally closed relays, which utilize depletion mode MOSFETs to achieve a 1 Form B relay contact configuration. All are packaged in the miniature 4-pin SOP package. These products are normally closed switches which consume a minimal amount of power in the 'ON' state and feature silent switching....

Microwave Feedthru

January 21, 2004 10:48 am | Product Releases | Comments

Times Microwave introduces a new capability in ultra-high vacuum, high reliability microwave Feedthru's. The custom designs use a glass-to-metal seal technology, in Feedthru's and Beam Position Monitor applications. Designs for interfaces from SMA through 7/8 inch EIA have been produced. Key features of this design include: UHV capability; precision microwave design; high radiation compatibility; crack-free, high-reliability glass seal desi...

Ceramic Filters

January 21, 2004 10:48 am | Product Releases | Comments


Cable Connectors

January 21, 2004 10:48 am | Product Releases | Comments

Tyco Electronics announces a cable connector product extension to the MULTI-BEAM XL line of modular Power/Signal connectors. The cable mount connector terminates up to 8 AWG, 600 V wire, carries up to 55 Amps on a single contact and satisfies Hot-Swap and Cable I/O applications. The MULTI-BEAM XL cable connector is available in two versions....


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