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Card-Edge Connectors

March 13, 2007 12:50 pm | Product Releases | Comments

FCI develops press-fit, card-edge connectors to enable the implementation of MicroTCA™ (mTCA) architecture. These vertical card-edge connectors provide 170 contacts on 0.75 mm pitch, and they enable AMCTM cards to be plugged directly to a backplane, accommodating speeds up to 10 Gb/s. The press-fit version of the connectors extends the use of MicroTCA architecture to thicker backplanes where the size and complexity of the backplane is n...

ISM Band Transceivers

March 13, 2007 12:50 pm | Product Releases | Comments

Sirenza’s series of ISM Band Transceivers are fully-integrated 2FSK transceivers that include a complete receiver, transmitter and synthesizer on a single chip. The series includes the ML2722 (900 MHz), the ML2724 (2.4 GHz), the ML5800 (5.8 GHz) and the ML5824 (2.4/5.8 MHz). These transceivers are designed for simple ease-of-use with a minimum of external components and no tuning/alignment....

Connector Platform

March 13, 2007 12:50 pm | Product Releases | Comments

Amphenol TCS (ATCS) introduces its XCede™ connector platform that is designed to enable future data rate requirements for datacom, telecom, storage and wireless equipment, meeting and exceeding standards set for Ethernet, SONET/SDH, PCIe, Fiber Channel and Infiniband while employing a highly reliable press-fit attachment....

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High Power Remote Units

March 13, 2007 12:50 pm | Product Releases | Comments

Andrew Corporation introduces its ION™-B High Power Single Band UMTS and its ION-B Medium Power Triple Band EGSM/GSM1800/UMTS remote units for radio-over-fiber applications that ensure coverage and capacity in wireless environments. These units offer high power options for extending in-building radio coverage, and for enhancing performance in multi-carrier and multi-band applications....

WLAN Power Amplifiers

March 13, 2007 12:50 pm | Product Releases | Comments

Anadigics, Inc. announces its Wireless LAN (WLAN) power amplifiers (PAs) that support the upcoming 802.11n multi-input, multi-output (MIMO) standard, with applications that are expected to increase quickly as access point and notebook manufacturers accelerate to production. The benefits of MIMO technology include extended range beyond that of 802....

RoHS Compliant Bias Tees

March 13, 2007 12:50 pm | Product Releases | Comments

MECA announces its RoHS compliant Bias Tees that cover wireless band applications from 0.500 to 2.500 GHz. Its modular design offers maximum connector flexibility at any port. They are vailable in 7/16 DIN, SMA, N, BNC and TNC configurations with RF power ratings to 300 W (3 kW peak) and maximum DC levels of 100 VDC/7 A....

Near-Infrared Power Laser

March 13, 2007 12:50 pm | Product Releases | Comments

Dilas releases a near-infrared (NIR) emitting 60 W continuous-wave (CW) power laser at 808 nm and 980 nm from a single 19 emitter bar. Available in the industry-standard (25 325 mm) conduction-cooled package, this easy-to-integrate, high-brightness, multimode diode laser is an appropriate pump source for solid-state lasers used for medical and industrial applications....

Extreme Performance Families

March 13, 2007 12:50 pm | Product Releases | Comments

Lattice Semiconductor announces that the first members of its Extreme Performance LatticeSC and LatticeSCM (LatticeSC/M) FPGA families. The Extreme Performance LatticeSC/M devices are designed to provide the excellent performance and connectivity essential for high-speed system applications....

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Epoxy Resin Compound

March 13, 2007 12:50 pm | Product Releases | Comments

Master Bond Inc. introduces its high performance bonding, sealing, coating and encapsulation system. Designated EP21TDC-2LO, this formulation offers high flexibility and exceptional toughness. It cures at room temperatures or more rapidly at elevated temperatures. It has a 1:3 mix ratio by weight or volume, and it has a working life of >90 minutes for a 100 gm....

Expanded Platform Portfolio

March 13, 2007 12:50 pm | Product Releases | Comments

Universal Instruments expands the capabilities of its Genesis platform offering by augmenting its dual-gantry (D-Series) configuration with a quad-gantry (Q-Series) and two single-gantry (S-Series) models. The Genesis GC-120Q’s cost-per-placement and throughput-per-square meter metrics makes it well suited for the high-end chip market....

Multimedia Handsets

March 13, 2007 12:50 pm | Product Releases | Comments

Skyworks Solutions, Inc. introduces its Helios™ II-Plus EDGE radio that is appropriate for manufacturers developing next-generation quad band handsets incorporating advanced multimedia features such as DVB-H, FM radios, MP3 players, digital cameras and Web browsing. It reduces radio frequency (RF) board space by an additional 25% when compared to the company’s previous Helios design....

Class G Amplifier

March 13, 2007 12:50 pm | Product Releases | Comments

Maxim Integrated Products introduces the MAX9788, a mono, class G amplifier specifically designed to drive the high capacitive load of piezoelectric loudspeakers. One of the main attractions for using ceramic piezoelectric speakers is their thin form factor. But to maintain the advantage of the ceramic speaker, the amplifier must also provide a compact solution....

ZigBee Compliant Platform

March 13, 2007 12:50 pm | Product Releases | Comments

Microchip Technology Inc. announces the ZigBee Compliant Platform designation from the National Testing Service and the ZigBee Alliance for the combination of its MRF24J40 IEEE 802.15.4 RF transceiver and the PIC18 family of high-end 8-bit Flash microcontrollers. Additionally, Microchip offers compliant development tools and compliant source code for its royalty-free, no-cost license ZigBee protocol stack....

Thermal Tweezers Nozzles

March 13, 2007 12:50 pm | Product Releases | Comments

OK International introduces its Thermal Tweezers Nozzles that reduce thermal stresses placed on PCBs during multiple rework operations for POP package-on-package stacked device components. Using these nozzles, engineers will be able to remove devices, such as multiple vertically-stacked ICs, without damaging the IC packages and without exposing the PCB to excessive reflow cycles over and above the IPC-recommended maximum of five cycles....

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