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Two High Power Terminations

June 20, 2007 9:11 am | Product Releases | Comments

Microlab/FXR announces the addition of two high power terminations to its Money Saver Product Line. The TB-70 (50 W) and the TB-75 (100 W) are both available with either N or 7 to 16 mm DIN, male or female connectors. Units have been designed using solder-free mechanically stable connections and achieve a typical VSWR better than 1....

Coaxial Mismatch Termination Sets

June 20, 2007 9:11 am | Product Releases | Comments

Link Microtek introduces a series of coaxial mismatch terminations that provide an easy method of calibrating equipment or checking the performance of a microwave system. Supplied in boxed sets of five, the terminations offer standard VSWR values of 1.2, 1.5, 2, 5 and 10 to 1, and they can be specified with N-type or SMA connectors and frequency ranges of either 1 to 5 GHz or 1 to 18 GHz....

Die and SMT Power Amplifiers

June 20, 2007 9:11 am | Product Releases | Comments

Hittite Microwave Corporation introduces five GaAs PHEMT 1 W and 2 W MMIC power amplifiers that are suitable for point-to-point and point-to-multi-point radios, test instrumentation, military and space applications from 6 to 13 GHz. Optimized for high gain and high output power, the HMC590 and HMC590LP5(E) are high dynamic range GaAs PHEMT MMIC 1 W power amplifiers, which operate from 6 to 9....


Thermal Simulation Process

June 20, 2007 9:11 am | Product Releases | Comments

Hybricon, Inc. introduces a thermal simulation process that cools an ATR form-factor chassis that dissipates almost 200 W and operates at altitudes up to 50,000 feet. The process evaluates a range of possible design configurations, focusing on heat sink design and fan performance at high altitudes....

SERDES Interfaces in an FPGA World: What Do I Need To Know to Get Started?

June 20, 2007 8:46 am | Product Releases | Comments

By understanding the abilities of both FPGA products and SERDES interfaces, a design team can increase the reliability and functionality of its products while reducing time to market. By Dan Sides & Bertrand Leigh, Lattice Semiconductor For some years now, increasing levels of chip functionality and data throughput requirements have propelled the chip industry in a migration from lower data rate click t...

Software Radio in Wireless Applications: A Revolution through Software

June 20, 2007 7:26 am | Product Releases | Comments

By Marty Gilbert, Vanu, Inc. The intent of software radio is to separate the wireless standard from the hardware platform by developing wireless technology standards. Wireless communications infrastructure manufacturers have traditionally developed single-standard, high-power, high-capacity networks to address the need for cellular coverage over large areas....

FPD Taiwan

June 20, 2007 6:33 am | Product Releases | Comments


Low-power Methodology Kit

June 19, 2007 12:38 pm | Product Releases | Comments

Cadence Design Systems, Inc. announces a kit that enables engineers of different experience levels to adopt advanced low-power techniques with minimized risk and deployment effort. The Low-Power Methodology Kit provides a working end-to-end methodology covering logic design, functional verification and physical implementation....


Voltage Regulator Functionality

June 19, 2007 12:38 pm | Product Releases | Comments

AMI Semiconductor announces the release of devices that combine LIN (Local Interconnect Network) transceiver and voltage regulator functionality in a single low-power, mixed-signal chip. The AMIS-40615 and AMIS-40616 will allow automotive design engineers to improve the reliability while reducing the component count, power consumption and cost of LIN-based in-vehicle networking (IVN) applications....

Tool Automates Generation and Verification of Embedded Code

June 19, 2007 12:38 pm | Product Releases | Comments

The MathWorks, Inc. and Analog Devices, Inc. announce Link for Analog Devices VisualDSP++®, which integrates MATLAB® and Simulink® with the Analog Devices VisualDSP++, integrated development and debugging software environment. Link for Analog Devices VisualDSP++, which is sold and supported by The MathWorks, allows engineers verify embedded code running on VisualDSP++ using MATLAB and generate VisualDSP++ projects from Simulink models...

Reduce Development Cost and Design Risk

June 19, 2007 12:38 pm | Product Releases | Comments

ChipVision Design Systems announces breakthrough, patented Electronic System Level (ESL) technology that lets RTL designers work interactively with system-level descriptions to generate power-optimized Register Transfer Level (RTL) code. It creates implementation trade-off options for RTL designers, and immediately and accurately implements their visualized choices....

Mobile Media

June 19, 2007 12:38 pm | Product Releases | Comments

IDT™ introduces the Mobile Multimedia Interconnect™ (M2I), fully-optimized for multimedia applications in high-end mobile handsets and personal digital assistant devices. The M2I performs up to six times faster with 90% less battery drain. High-end handset users can reliably playback multimedia of high quality with minimal impact to their "talk time" and battery life....

Tuned Oscillators

June 19, 2007 12:38 pm | Product Releases | Comments

Micro Lambda Wireless, Inc. announces the production release of YIG-Tuned oscillators covering the 2 to 18 GHz and 2 to 20 GHz frequency bands. Four fundamental frequency models providing desirable phase noise performance are now available. The fundamental frequency units are available in two standard package configurations 1....

High-performance Broadband Amplifiers

June 19, 2007 12:38 pm | Product Releases | Comments

WJ Communications, Inc. announces a family of high-performance broadband amplifiers. The WJA broadband amplifier family offers up to 20 dB of gain and an output IP3 up to 43 dBm while consuming 60 to 90 mA from a +5 V supply. Utilizing the high-reliability InGaP/GaAs HBT process technology, the WJA amplifiers exceed the increasingly complicated requirements of the next-generation communication systems....

130 nm SiGe BiCMOS Processes Optimize Cost and Performance

June 19, 2007 11:51 am | Product Releases | Comments

HBTs feature a uniquely engineered fabrication process and new epitaxial materials optimized for wireless communications systems. David Cheskis, Ph.D., Jazz Semiconductor Silicon Germanium (SiGe) Heterojunction Bipolar Transistors (HBTs) are capable of much better performance than comparably sized CMOS devices....


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