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Parabolic Grid Dish Antenna

December 8, 2005 6:11 am | Product Releases | Comments

Pacific Wireless announces an addition to its 3.5 GHz product line, the 3.5 GHz parabolic grid dish antenna. These antennas utilize a patented parabolic grid design with a patented dipole feed. The antennas are constructed of welded steel wires which are galvanized and then powder coat painted with light gray epoxy paint....

The Impact of Card Grounding on EMC Emissions

December 8, 2005 6:10 am | by Recent research has indicated that electromagnetic emissions from interface cards can be reduced as much as 20 dB through simple changes in grounding arrangements. | Wireless Design & Development | Product Releases | Comments

A recent study by E-Mead Consulting Ltd. focused on paddle-board cards connected to the backplane of an equipment enclosure through connector pins. The study addressed modeling the effectiveness of the grounding pins using the concepts of partial inductance. The FLO/EMC simulation software from Flomerics was used to investigate the impact of grounding, bonding and inductance in real-world designs that could not be easily be analyzed by ...

Handheld 1xEV-DO Test Solution

December 8, 2005 6:10 am | Product Releases | Comments

Anritsu Company introduces three CDMA2000 1xEV-DO options for its Cell Master™ MT8212B handheld analyzer. Expanding the analysis capability to include on CDMA2000 1xEV-DO signals, the options allow the MT8212B to be used by RF engineers, maintenance personnel, and cell site technicians responsible for the deployment, maintenance, troubleshooting and optimization of CDMA2000 1xEV-DO basestations and networks....


Zero-Delay Buffers

December 8, 2005 6:09 am | Product Releases | Comments

Cypress Semiconductor Corporation announces two Zero-Delay Buffers (ZDBs). The CY23EP05 and CY23EP09 phase-locked loop (PLL) clock buffers offer desirable operating frequency, low cycle-to-cycle jitter and one of the lowest output-to-output skews on the market. The products add to the company’s portfolio of timing solutions for applications such as multiservice routers and switches, basestations, plasma displays and set-top boxes....

Chipset for Mobile Phones

December 8, 2005 6:09 am | Product Releases | Comments

Agere Systems announces its Vision™ X115 chipset product supporting cinema-quality video and CD-quality audio capabilities for mainstream EDGE feature phones and Smartphones. The X115 is based on Agere’s Vision mobile handset architecture and its OptiVerse™ software framework, both of which enable critical improvements for smaller and more affordable, feature-rich phones....

SST Oscillators

December 8, 2005 6:09 am | Product Releases | Comments

Euroquartz introduces a series of low EMI oscillators that offer a low cost alternative to expensive EMI problems. The EQHM53 series oscillators are housed in a 5 × 3.2 mm SMD package and offer up to – 15 dBc equipment EMI reduction. Operating from a 3.3 V supply, EQHM53 series oscillators are available covering a frequency range from 6 to 160 MHz and are drop-in replacements for standard 5 × 3....

Software for Designing Outdoor Wireless Mesh Networks

December 8, 2005 6:09 am | Product Releases | Comments

Wireless Valley® Communications announces the availability of MeshPlanner™, a software product for designing outdoor wireless mesh networks that provide good coverage, redundancy and overall quality of service. With MeshPlanner, network designers visually develop the plan on their computer. The software recommends where to place access points (APs) for maximum coverage and ease of installation, predicts how the landscape will impact ...

Capabilities for PowerPC Design

December 8, 2005 6:09 am | Product Releases | Comments

Cadence Design Systems, Inc. announces a set of services for SoC designers embedding PowerPC cores, including silicon validation of a new custom-synthesized design approach. Compared to a full-synthesis approach, the Cadence® custom-synthesized approach achieves a 20% to 30% increase in processor speed while reducing chip area by 40%....


3D EM Simulator

December 8, 2005 6:09 am | Product Releases | Comments

CST of America, Inc. announces CST MICROWAVE STUDIO®, version 2006. The new version now includes the use of the CST DESIGN ENVIRONMENT™ as a common access point to CST’s solver technology. Structures are presented in 3D and schematic views and the comparison of models and co-simulation has been facilitated by a new multi-document interface....

Packageless Transceiver

December 8, 2005 6:09 am | Product Releases | Comments

Endwave Corporation announces an integrated transceiver board product that is designed to eliminate 30% of the typical mechanical packaging cost from conventional modules, while preserving 100% of electrical performance. The proprietary packaging technique used is called Epsilon Packaging™. Epsilon Packaging reduces the size and weight of a typical transceiver subassembly by replacing heavy-weight metal mechanical items with plated FR-4...

Reduced Size OCXO

December 8, 2005 6:09 am | Product Releases | Comments

MtronPTI introduces the XO5183 family of OCXO products in a 1.0 inches× 0.8 inches× 0.5 inches enclosure. The XO5183 family features a close in phase noise performance of – 90 dBc at a 1 Hz offset for a 10 MHz sinewave device. It can be as low as – 100 dBc/Hz at a 1 Hz offset for special applications....

Radio Transceivers Using an I/Q Receiver Interface

December 8, 2005 6:07 am | Product Releases | Comments

By C.N. Wilson Conventional FM receivers use an analog demodulator, such as a PLL, or more commonly, a limiter-discriminator. Digital schemes replace these with digital processors. The following information covers general issues involving digital demodulators, with the marine AIS as an example....

SiGe BiCMOS Plays a Growing Role in the Mobile Platform

December 8, 2005 6:07 am | Product Releases | Comments

Lower costs and advancements in SiGe BiCMOS offer significant benefits to the wireless community. By Paul Kempf Glossary of Acronyms BiCMOS — Bipolar Complementary Metal-oxide Semiconductor CCK — Complementary Code Keying (RF modulation) CMOS — Complementary Metal Oxide Semiconductor COT — Customer-Owned Tooling E911 — Enhanced fT — Tr...

Embedded ZigBee Design Considerations

December 8, 2005 6:07 am | Product Releases | Comments

By Andy Wheeler Glossary of Acronyms API — Application Programming Interface HVAC — Heating, Ventilation and Air Conditioning ISM — Industrial, Scientific and Medical MAC — Medium Access Control (as defined by author) PHY — Physical Layer RFIC — Radio Frequency Integrated Circuit ROM — ...

600 W Hot-swap Front End

November 1, 2005 10:22 am | Product Releases | Comments

Power-One, Inc. introduces the FNP600-12, a 600 W hot-swap AC/DC front end that features I 2 C-compatible monitoring and control capabilities. Utilizing an 85 to 264 VAC universal input, the FNP600-12’s 51 A main output can be adjusted from 7 to 12 VDC, making it an appropriate bus-voltage source for a wide range of isolated and point-of-load DC/DC converters in networking and storage systems....


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