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MAC Software

May 28, 2004 6:25 am | Product Releases | Comments

Chipcon announces the availability of IEEE 802.15.4 compliant MAC software for their products. The software is available free of charge under a licensee agreement and gives customers a head start in their ZigBee and IEEE 802.15.4 compliant product developments. The IEEE 802.15.4 MAC sub-layer implementation is running on the CC2420DBK hardware platform, which includes an Atmel AVRmega microcontroller....

Wireless Serial Devices

May 28, 2004 6:25 am | Product Releases | Comments

Quatech announced the release of a line of wireless serial device servers. These serial device servers connect RS-232 and RS-422/485 serial devices to local and wide-area networks without routing Ethernet cables. The devices integrate either Linksys or Cisco Aironet wireless engines with Quatech's ThinQ serial device servers to provide a flexible wireless Ethernet-to-Serial server....

USB Chipsets

May 28, 2004 6:25 am | Product Releases | Comments

Atheros introduces the Atheros AR5005UG and AR5005UX, featuring a completely integrated universal serial bus (USB) 2.0 interface. Using these new chipsets, WLAN equipment manufacturers can deliver high-performance 802.11g and 802.11a/g wireless connectivity with Atheros' Super G and Super AG adaptive bandwidth technology to any device with a USB port....


HSIA Hotspots and the Business Traveler

May 28, 2004 6:23 am | Product Releases | Comments

Ern Worthman, Technology and Editorial Director HSIA — stands for high-speed Internet access ... well, at least for today. For the purpose of this discussion, let's go with it. While one can endlessly discuss, philosophize and argue the various aspects of HSIA, one good topic of discussion is what HSIA means to the business traveler....

Meet W-USB...The Next Generation of Wireless Interconnect

May 28, 2004 6:17 am | Product Releases | Comments

The homes of tomorrow will be digital, wireless, and wideband. And both wireless USB and Ultra Wideband technologies will have a large role. By Rafael Kolic In the digital home of the not-too-distant future, it is expected that people will be sharing photos, music, video, data, and voice among networked consumer electronics, PCs, and mobile devices throughout the home and even remotely....

Anritsu Establishes Program for Wireless Network Professionals

May 28, 2004 6:17 am | Product Releases | Comments

Anritsu Company announces the establishment of a Handheld Solutions Partners Program to better address the test needs of wireless network professionals. The creation of the partners program allows Anritsu to more closely work with industry-leading software providers to develop integrated test solutions faster and easier so field technicians and engineering management can ensure optimum performance of today's wireless networks....

Compact LTCC Package Modeling Techniques

May 28, 2004 5:21 am | Product Releases | Comments

By Ted A. Miracco, Lloyd Nakamura, and Malcolm Edwards LTCC design poses challenges because it required flexibility in simulation, three dimensional layout, and integration. A highly integrated EDA solution with openness to customization for LTCC components design methology, addresses this issue....

Contactless Memory

May 27, 2004 1:09 pm | Product Releases | Comments

STMicroelectronics introduces a contactless memory intended for high volume applications in supply chain management, e-commerce, and access control. The LRI64 is a 64-bit, One Time Programmable (OTP) user memory with an additional 64-bit read-only Unique Identification number (UID). The device complies with the ISO 15693 standard for 13....


System Level Design

May 27, 2004 1:09 pm | Product Releases | Comments

Ansoft announces DesignerSI™, a design environment that combines with Nexxim™, HFSS™ and Q3D Extractor™, to deliver complete system-level signal-integrity (SI) solutions for IC/package/board co-design and verification. DesignerSI accurately predicts the performance of high-speed systems commonly found in optical networks, gigabit computers and communication backplanes....

IC and System Level Design Software

May 27, 2004 1:09 pm | Product Releases | Comments

The APLAC circuit design and analysis tool is now available as the version 7.92. APLAC 7.92 introduces enhanced measurement support for mixers, amplifiers and oscillators. Measurement support can be ordered to handle repetitive simulation tasks, enabling the designer to manage a larger-scale simulation with more focus and capacity....

Digital Step Attenuators

May 27, 2004 1:09 pm | Product Releases | Comments

Peregrine Semiconductor introduces a new family of Digital Step Attenuators (DSAs). The family of devices, including the 6-bit PE4302 and PE4304 components, is manufactured using UTSi( RF CMOS Silicon-on-Sapphire technology. The PE4302 and PE4304 devices are 50 and 75Ω, 6-bit DSAs with a 0....

RFID Device

May 27, 2004 1:09 pm | Product Releases | Comments

EM Microelectronic announces that it has developed an UHF RFID integrated circuit, EM4223, which is fully compliant with the international standard ISO18000-6A and EPC 64-bit and 96-bit code structure. The device is a 128-bit read-only UHF circuit with an anticollision protocol. It is frequency independent from 865 MHz to 2....

Passive Component Family

May 27, 2004 1:09 pm | Product Releases | Comments

Microlab/FXR announce a family of 450 MHz components to meet the demands of TETRA, homeland security, and the CDMA-450 applications. Fundamental to these products are the two- and three-way air-line splitters, Dx-51FN series, which covers 380 to 2200 MHz with dissipation losses below 0.1 dB. Also, benefiting from air-line technology is the 380 to 520 MHz range of directional couplers, CK-20N series, which have less than 0....

RF Capacitors

May 27, 2004 1:09 pm | Product Releases | Comments

Vishay introduces a family of silicon-based RF capacitors in the 0201 footprint. The HPC0201A silicon capacitors enable higher-performance, higher-precision operation at high frequencies while delivering low parasitic inductance and tight tolerances. Device dimensions are 0.61 × 0.30 mm with a 0....

Rectifier Package

May 27, 2004 1:09 pm | Product Releases | Comments

Diodes Inc. announces its high current density package type, PowerDI123. The package uses a patent-pending interlocking-clip construction and a flat lead frame heat-sink solder pad to achieve thermal performance. The package has a PCB footprint of 6.75 mm 2 and a package height of 1 mm. The breakthrough internal construction also exhibits low forward voltage drop and high surge current capabilities....


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