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The Next Generation of 802.11 Wireless LAN

December 23, 2004 7:40 am | by As next generation wireless applications emerge, higher WLAN data throughput will be required to meet expectations of performance. James Michael Wilson | Product Releases | Comments

In response to growing market demand for higher-performance WLANs, the IEEE-SA approved the creation of 802.11 TGn in 2003. The scope of TGn's objective is to define modifications to the PHY and MAC layers that deliver a minimum of 100 Mb/s throughput at the MAC SAP (see Figure 1). This minimum throughput requirement represents an approximate four-fold increase in WLAN throughput performance compared to today's 802....

RFID Tag Design

December 23, 2004 7:39 am | by Multi-dimensional technique enables fast, direct tuning of the antenna's match to the tag IC. Cory Edelman and Murthy Upmaka, Agilent Eesof | Product Releases | Comments

The interaction of the RFID reader and tag is of great interest to the RFID system designer. The environment is likely to include many reflective and absorptive surfaces as well as other tags. In addition, the increasing use of other RF systems in offices and industry means that other strong RF emitters might be operating near the RFID system, although in other frequency bands....

Compact 3G Receiver Design

December 23, 2004 7:33 am | by Arild T. Kolsrud | Product Releases | Comments

Advancements in component miniaturization and integration are paving the way for compact high-end communications receivers that do not sacrifice performance for cost or size. RF component technology is getting better, smaller, and more efficient. This makes it possible to make communications receivers smaller than ever....

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Managing RFIC Test Challenges for WLAN Services

December 23, 2004 7:33 am | by Cost-effective, high-performance, reconfigurable test systems are the mantra for next generation WLAN RF components. John Lukez | Product Releases | Comments

The rapid growth of WLAN systems has created extraordinary challenges for RFIC testing. The emergence of WLAN standards is driving key performance characteristics such as channel bandwidths and data rates to unprecedented levels. To meet evolving requirements in WLAN and communications services, IC manufacturers need cost-effective, high-performance ATE systems that are easily upgradeable, maintain high-accuracy, and boost test throughput....

A Novel RFDAC Design

December 23, 2004 7:33 am | by Michael Hopkins | Product Releases | Comments

The RFDAC breaks the Nyquist frequency barrier with improved SFDR, IMD, and noise performance. In conventional RF synthesizer and modulator systems, DACs are used as baseband sources to convert digitally processed signals to analog signals, which are then filtered and applied to the inputs of analog mixers for RF upconversion....

Automated Test Solution

December 16, 2004 6:38 am | Product Releases | Comments

Agilent introduces an automated test solution for functional, at-speed test that reduces the cost of testing high-speed, system-on-a-chip (SOC) devices to the lowest in the industry. Part of the Agilent 93000 SOC Series, this complete high-speed I/O solution enables functional testing of high-pin-count devices, such as next-generation PC chipsets up to speeds of 3....

Micro-Fabrication Techniques for Millimeter-Wave Devices

November 30, 2004 6:28 am | Product Releases | Comments

Today, as frequencies increase, so does the pressure to reduce form factors and footprints. This is the driving force behind MEMS, and the movement it starting to target mm-wave devices. By Rich Chen The growth of the wireless communication industry has strengthened interest in millimeter-wave circuits....

Dual-Band Power Amp

November 23, 2004 11:18 am | Product Releases | Comments

Anadigics announces the AWL6950 dual-band 4 × 4 mm InGaP HBT power amplifier (PA). This PA supports the 2.4 GHz and 5 GHz bands, which allows wireless local area network (WLAN) equipment manufacturers to use a single PA for 802.11b, 802.11a, 802.11g, 802.11a/b, and 802.11a/b/g applications. The AWL6950 requires two external capacitors....

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Diode Arrays

November 23, 2004 11:18 am | Product Releases | Comments

California Micro Devices announced the CM1218 and CM1219, low capacitance families of Zener diode arrays for electrostatic discharge (ESD) protection. The CM1219 features a low input capacitance of 4pF and protects ESD strikes up to ± 8 kV contact discharge, while the CM1218 with a low 7pF input capacitance provides ESD protection at ± 15 kV contact discharge....

PCI Module

November 23, 2004 11:18 am | Product Releases | Comments

Pentek introduces its latest in a series of PCI modules. The 7631A is a 16-channel multiband digital receiver that features two 14-bit A/Ds with a Virtex-II FPGA for direct wideband signal processing at sample rates as high as 105 MHz. Pentek's GateFlow tool suite allows implementation of user-defined signal processing functions in the gate array....

Clock Converters

November 23, 2004 11:18 am | Product Releases | Comments

Pericom Semiconductor launches a family of 3.3 V, 1:4 LVPECL clock buffers with speeds up to 800 MHz. The PI6C4853x ICs target the networking/telecommunications, storage, and industrial system markets. PI6C48533-01 (Differential to LVPECL), PI6C48535-01 (LVCMOS to LVPECL), PI6C48535-11 (Crystal to LVPECL) are suitable solutions for solving translation requirements as well as eliminating jitter concerns....

Subsystem Solutions

November 23, 2004 11:18 am | Product Releases | Comments

Skyworks announces RF subsystems for next generation cellular infrastructure equipment and other wireless transceiver applications. These solutions leverage RF integrated circuit designs that maximize the performance of third and fourth generation (3G and 4G) base station transceivers. With the introduction of its DCR™ component, the SKY73010 -- a single chip direct quadrature modulator, Skyworks offers a direct conversion base transcei...

All I Want for Christmas (or Hanukkah)...

November 23, 2004 11:17 am | Product Releases | Comments

Well, here we are at the end of another, more or less lackluster year for the telecom industry. So much for the prognosticators who swore we'd be back in rare form by Q3, '04. At the risk of getting yelled at by my readers who don't think I should step outside of the bounds of wireless, I'm going to take a bit of editorial license and maybe a bit of tongue-in-cheek-edness as well....

Wi-Fi Testing Using a Cabled RF Environment

November 23, 2004 11:17 am | Product Releases | Comments

An elegant alternative to homegrown test environments for wireless systems. By Fanny Mlinarsky, Azimuth Systems As Wi-Fi technology matures, wireless LANs are moving from the relatively tolerant SOHO market to the demanding enterprise — a market where high network performance is needed to support mission-critical applications, a large number of network users, and a diversity of network elements....

Aeroflex / Inmet and Richardson Sign Agreement

November 23, 2004 11:16 am | Product Releases | Comments

Aeroflex / Inmet announced that it has signed a distribution agreement with Richardson Electronics. Under the terms of the agreement, Richardson will operate as exclusive worldwide distributor of a selected and extensive range of Aeroflex / Inmet products including fixed attenuators, terminations, DC blocks, Bias Tees, and adapters....

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