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Interface Headers

May 30, 2003 11:38 am | Product Releases | Comments

Molex introduces Micro-Fit 3.0™ Compliant Pin Interface headers. These press-fit headers require no soldering. The headers are appropriate for either power or signal uses and can carry up to five amperes per circuit. They are fully polarized to ensure proper mating and feature fully isolated contacts....

Circuit Simulation and Analysis Software

May 30, 2003 11:38 am | Product Releases | Comments

APLAC Solutions introduces version 7.90 of its APLAC circuit simulation and analysis software. APLAC 7.90 has an improved user interface that facilitates schematic creation, simulation, and use of utilities. The analysis setup includes templates and control forms with over 100 predefined simulations for circuit-specific and generic tasks....

Transistors

May 30, 2003 11:38 am | Product Releases | Comments

The FPD1500SOT89 is a packaged depletion mode AlGaAs/InGaAs pseudomorphic High Electron Mobility Transistor (pHEMT). It utilizes a 0.25 μm × 1500 μm Schottky barrier Gate, defined by high-resolution stepper-based photolithography. The recessed and offset Gate structure minimizes parasitics to optimize performance, with an epitaxial structure designed for improved linearity over a range of bias conditions and input power levels....

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Switched Combiner

May 30, 2003 11:38 am | Product Releases | Comments

Technical Research and Manufacturing announces a low loss, high power four-way switching combiner and divider in a single package. The unit offers isolation between combiner and divider module of greater than 90 dB. The power divider has more than 30 dB isolation between outputs to minimize amplitude and phase changes during switching from one to four amplifiers....

Signal Processing Equipment

May 30, 2003 11:38 am | Product Releases | Comments

The WideFire-2002BP is based on the WideFire™ Technology. The Wide-Fire-2002BP features the same wireless generation capability as the WideFire-2002M, but is packaged in an application specific configuration. The WideFire-2002BP can generate live, sustained, and simultaneous AMPS/TDMA/CDMA and GSM standards and is software upgradeable to 3G capabilities....

Solid State Amplifiers

May 30, 2003 11:38 am | Product Releases | Comments

Part Number SSPA 13.7-14.5-30 is a high power, Ku band, solid state power amplifier that operates from 13.7 to 14.5 GHz. The P1dB at 25°C is 30 watts typical. The saturated output power is 35 watts typical at 25°C. Typical small signal gain is 40 dB. Noise figure is 4 dB typical at 25°C....

RF-CMOS Process

May 30, 2003 11:38 am | Product Releases | Comments

austriamicrosystems announces its 0.35 μm RF CMOS process. The CMOS base technology has been adapted for RF applications with analog/mixed-signal features from austriamicrosystems' 0.35μm silicon germanium BiCMOS process. The process features high performance transistors and a comprehensive suite of passive components characterized and tuned for RF applications....

Chip Antenna

May 30, 2003 11:38 am | Product Releases | Comments

NTK Technologies announces a series of SMD ceramic dielectric chip antennas designed for WLAN applications. The MAC2450A5362AAE series measures 11.8 × 2.5 × 0.7 mm. These dual band antennas are available with a center frequency of 2450 GH and 5362 GHz. They deliver a wide bandwidth (VSWR = 2) covering 2400 - 2500 GHz and 4900 - 5825 GHz respectively....

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GPS Receivers

May 30, 2003 11:38 am | Product Releases | Comments

RF Micro Devices introduces the RF8009 GPS receiver designed for telematics and automotive navigation products. The RF8009 is a low-cost, fully integrated, plug-and-play 12-parallel-channel GPS receiver module that simplifies product design and implementation. The receiver includes baseband digital signal processing logic....

Dual Filter

May 30, 2003 11:38 am | Product Releases | Comments

The LT1568 is an ultra low noise (92 dB SNR) high frequency filter building block for channel antialiasing or reconstruction applications. The LT1568 provides a pair of matched second order filter sections integrated on a single chip. The LT1568 features differential outputs, making it suitable for single-ended to differential conversion and driving high-speed A/D converters....

GPS Technology

May 30, 2003 11:38 am | Product Releases | Comments

The SiRFstarIIe/LP offers power efficiency, high performance and design tools for long battery life, quick time to first fixes, and fast integration of GPS location technology in consumer devices such as cell phones and mobile computer accessories. SiRFstarIIe/LP's Adaptive TricklePower features an advanced power management technology that reduces power consumption by remaining in low-power mode in strong GPS signal areas....

Gain Block Amplifiers

May 30, 2003 11:38 am | Product Releases | Comments

RF Micro Devices introduces a series of RF amplifier IC gain blocks. The RF339x devices are highly reliable, low-cost RF amplifier gain blocks that are suited for wireless infrastructure applications, where low noise and high linearity are mandatory. Operating in frequency bands from DC to 6000 MHz, the devices are self-contained with 50 ohm input and output impedances, requiring two external DC-biasing elements to operate....

Translators

May 30, 2003 11:38 am | Product Releases | Comments

STMicroelectronics introduces a 16-bit dual-supply bus transceiver level translator available in a TFBGA package. The 74VCX1632245 provides a two-way asynchronous communications interface between buses at 3.3 V and 2.5 V or 1.8 V in mixed 3.3 V/1.8 V, 3.3 V/2.5 V or 2.5 V/1.8 V supply systems. The parts offer symmetrical output impedance and balanced propagation delays....

Power System Architecture

May 30, 2003 11:38 am | Product Releases | Comments

Vicor introduces a power system architecture based on power conversion technologies. The architecture, called Factorized Power Architecture (FPA), is enabled by power conversion components called V•I chips or VICs. V•I chips process up to 200 watts of power in a 0.25 cubic inch power Ball Grid Array (BGA) package....

Connectable LED Modules

May 30, 2003 11:38 am | Product Releases | Comments

The StripLED connectable LED modules contain four super-bright, wide angle (85°C) SpiderLEDs, on 3-inch double-ended connector harness for daisy chain assembly, and a pre-applied strip of 3M® double-sided foam tape for "peel-and-stick" placement. LEDs are wired in parallel and function independently....

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