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CANBus 26.5 GHz Switches

October 3, 2005 9:16 am | Product Releases | Comments

Dow-Key Microwave announces a 26.5 GHz CANbus-Controlled SP6T Smart Switch with internal 50Ω termination. The switch utilizes the latest generation of Microcontrollers that incorporate a CANBus interface fully compliant with V2.0A and V2.0B standards. DC characteristics include 22 to 26 VDC (24 VDC nominal)....

Wirewound Resistors

October 3, 2005 9:16 am | Product Releases | Comments

Ohmite Manufacturing Company introduces its P series molded precision wirewound resistors. Designed to meet the exacting requirements of Military Specification MIL-R-93, the series offers high stability and low Temperature Coefficient of Resistance (TCR). These resistors offer tolerances of ± 0....

Harmonic Waveguide Filters

October 3, 2005 9:16 am | Product Releases | Comments

Microtek introduces a range of in-house manufactured absorptive harmonic waveguide filters, which, when used with high-power microwave amplifiers, avoid the potential damage that reflective filters can cause. The AMQ-HARM series of filters is designed to absorb signals with harmonic frequencies higher than the specified pass band, rather than reflecting them back to the amplifier....


Cross-over Jumper Components

October 3, 2005 9:16 am | Product Releases | Comments

Providing power supply manufacturers with a jumper component with an inductance value of < 0.2 nH, TT electronics IRC Advanced Film Division has developed a high current, low resistance cross-over jumper component. Designated the LRZ series, the components come in three standard chip sizes of 1206, 2010 and 2512....

7-16 DIN Adapter Kit

October 3, 2005 9:16 am | Product Releases | Comments

RF Connectors’ 7-16 DIN Adapter Kit is designed to aid technicians working in the cellular, PCS, GPS and digital communications fields. For cellular communications, the 7-16 DIN offers technical advantages over the N or SMA connector interfaces. Capable of carrying high power at high frequencies, 7-16 DINs are larger, and precise, offering more stable electrical and mechanical connections with tighter tolerances and improved VSWR performanc...

FPGAs With Reduced Standby Current

October 3, 2005 9:16 am | Product Releases | Comments

Lattice Semiconductor announces a power-saving feature that reduces standby power by over a factor of 1000 for its LatticeXP™ family of non-volatile FPGAs. Sleep mode utilizes the LatticeXP device’s unique Flash and SRAM architecture to provide an ultra low standby state that can be entered in nanoseconds and exited in less than 2 mS....

LCP-based Circuit Materials

October 3, 2005 9:16 am | Product Releases | Comments

The R/flex® 3000 Family of Liquid Crystalline Polymer (LCP)-based Circuit Materials from Rogers Corporation includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate. R/flex 3850 laminate is produced in a range of copper and film thicknesses, just as the single-clad laminate, and is available in standard panel formats....

Power Management Integrated Circuits

October 3, 2005 9:16 am | Product Releases | Comments

Microchip Technology Inc. introduces the TC1303/TC1304 and TC1313 series of power management integrated circuits that combine a synchronous buck switching regulator, low dropout regulator (LDO) and power-good function into single-chip components. These five devices offer low-power and low-cost advantages for a variety of battery-operated and dual-output-voltage systems....



October 3, 2005 9:16 am | Product Releases | Comments

White Electronic Designs Corporation announces its 1 GB DDR SDRAM, unbuffered, FBGA based module. WEDC is offering this 2 × 64 M × 72 Double Data Rate (DDR) synchronous DRAM memory module based on 512 Mb DDR SDRAM components. The device consists of eighteen 64 M × 8 DDR SDRAMs in a Fine Ball Grid Array (FBGA) package mounted on a 200-pin FR4 substrate....

EEPROM Product Line Expanded

October 3, 2005 9:16 am | Product Releases | Comments

Microchip Technology has expanded its SPI™ serial EEPROM product line with two high-density (256 Kb), high-speed (up to 10 MHz) devices. The 25AA256 is available in a 1.8 to 5.5 V voltage range, and the 25LC256 has a 2.5 to 5.5 V voltage range. Both industrial-temperature grade and extended-temperature grade versions are available....

Sabritec is AS9100 Certified

October 3, 2005 9:14 am | Product Releases | Comments

Sabritec, a custom connector manufacturer, is pleased to announce their certification to AS9100 Rev B. RWTUV USA INC certified that Sabritec has established and applies a management system for design and manufacture of connectors (coax, Triax, EMI/EMP filter and Fiber Channel), cable assemblies, integrated electro-mechanical assemblies and custom interconnect solutions that fulfill the requirements of ISO 9001:2000/AS9100 Rev B....

0.18µm Process Platform

October 3, 2005 9:13 am | Product Releases | Comments

Jazz addresses the next generation of integration needs in high performance analog and RF applications with its comprehensive 0.18µm process platform. The platform is suited for applications where analog or RF performance is the dominating factor, and future integration requires more complex analog, high voltage or higher density analog components....

SMT Test Point Series

October 3, 2005 9:13 am | Product Releases | Comments

Components Corporation announces the 100% RoHS-compliant TP-108 series of ultra-low profile test points. The surface mount devices feature a 0.060 inches profile, and a 0.070 inches× 0.135 inches pad size. The TP-108 is constructed utilizing a proprietary technology which includes the utilization of flat wire to facilitate a larger area for mounting the device to the board....

Embedding Memory in Next Generation Handset Designs

October 3, 2005 9:12 am | Product Releases | Comments

Glossary of Acronyms 3G — Third Generation DDR — Double Data Rate DRAM — Dynamic Random Access Memory LP-SDRAM — Low-Power Static Random Access Memory Mb — Megabit MLC — Multi-Level Cell NAND — NOT AND NOR — NOT OR PSRAM/strong> — Pseudo-Static Random Access Memory RAM — Random Access Memory RWW — ...

Designing a Dual-band LNA for Wireless LAN Applications

October 3, 2005 9:12 am | Product Releases | Comments

Glossary of Acronyms ADS — Advanced Design System EDA — Electronic Design Automation EM — Electro-Magnetic FET — Field-Effect Transistor GaAs — Gallium Arsenide IIP3 — Third-order Intercept Point LAN — LAN LNA — Low-Noise Amplifier MMIC — Monolithic Microwave Integrated Circuit NF — Noise Figure NF min ...


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