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Miniature VCO

June 20, 2007 9:11 am | Product Releases | Comments

Z-Communications, Inc. announces the introduction of their sub miniature VCO (SMV4710A-LF) with low phase noise performance. SMV4710A-LF in frequency range of 4538 to 4903 MHz is designed to meet the high performance requirements of microwave radio applications. This module offers low phase noise performance of 㫫 dBc/Hz at 10 kHz....

Manufacturing Test Software

June 20, 2007 9:11 am | Product Releases | Comments

LitePoint Corporation announces the availability of the LitePoint IQfact™ manufacturing test software for products based on Sequans WiMAX chipsets. The turnkey software package runs on IQmax™𤯤 R&D and IQmax-100 WiMAX manufacturing one-box test solutions. Wireless product manufacturers can get the same fast test times and good test coverage for WiMAX that they've already been getting by using LitePoint's other IQfact products ...

Classic Design Software

June 20, 2007 9:11 am | Product Releases | Comments

Lattice Semiconductor Corporation releases its ispLEVER® Classic design software. The ispLEVER Classic design software is based on the complete ispLEVER software design tool suite, a comprehensive design environment for all Lattice programmable logic products. It includes a powerful set of software tools for all design tasks, including project management, HDL design entry, module/IP integration, place and route, timing analysis, in-syste...


WiFi/WiMAX Splitters

June 20, 2007 9:11 am | Product Releases | Comments

MECA offers RoHS compliant, WiFi / WiMAX splitters for high performance, broadband LANs and mobile applications at 2.4 GHz and 5.8 GHz, and also public safety networks operating in the licensed 4.9 GHz band. Available in 2-way and 3-way SMA or N-Female connector configurations, these splitters feature low loss (0....

High-speed Packet Access

June 20, 2007 9:11 am | Product Releases | Comments

Andrew Corporation introduces high-speed packet access (HSPA) capabilities to its OneBase™ Micro Node B and Pico Node B products for wireless network coverage and capacity enhancement, enabling a more than 20-fold increase in data transfer rates. The addition of high-speed downlink packet access (HSDPA), available now, and high-speed uplink packet access (HSUPA), expected later this year, to these products enables wireless network opera...

Active Doubler

June 20, 2007 9:11 am | Product Releases | Comments

Mimix Broadband, Inc. introduces a 2.5 to 6.0 / 5.0 to 12.0 GHz InGaP HBT active doubler offered in a 4 × 4 mm QFN surface mount plastic package that is RoHS compliant. Identified as the XX1002-QH, this device delivers +17 dBm output power, has good fundamental rejection of 35 dBc and offers the added feature of a single bias supply....

Two High Power Terminations

June 20, 2007 9:11 am | Product Releases | Comments

Microlab/FXR announces the addition of two high power terminations to its Money Saver Product Line. The TB-70 (50 W) and the TB-75 (100 W) are both available with either N or 7 to 16 mm DIN, male or female connectors. Units have been designed using solder-free mechanically stable connections and achieve a typical VSWR better than 1....

Coaxial Mismatch Termination Sets

June 20, 2007 9:11 am | Product Releases | Comments

Link Microtek introduces a series of coaxial mismatch terminations that provide an easy method of calibrating equipment or checking the performance of a microwave system. Supplied in boxed sets of five, the terminations offer standard VSWR values of 1.2, 1.5, 2, 5 and 10 to 1, and they can be specified with N-type or SMA connectors and frequency ranges of either 1 to 5 GHz or 1 to 18 GHz....


Die and SMT Power Amplifiers

June 20, 2007 9:11 am | Product Releases | Comments

Hittite Microwave Corporation introduces five GaAs PHEMT 1 W and 2 W MMIC power amplifiers that are suitable for point-to-point and point-to-multi-point radios, test instrumentation, military and space applications from 6 to 13 GHz. Optimized for high gain and high output power, the HMC590 and HMC590LP5(E) are high dynamic range GaAs PHEMT MMIC 1 W power amplifiers, which operate from 6 to 9....

Thermal Simulation Process

June 20, 2007 9:11 am | Product Releases | Comments

Hybricon, Inc. introduces a thermal simulation process that cools an ATR form-factor chassis that dissipates almost 200 W and operates at altitudes up to 50,000 feet. The process evaluates a range of possible design configurations, focusing on heat sink design and fan performance at high altitudes....

SERDES Interfaces in an FPGA World: What Do I Need To Know to Get Started?

June 20, 2007 8:46 am | Product Releases | Comments

By understanding the abilities of both FPGA products and SERDES interfaces, a design team can increase the reliability and functionality of its products while reducing time to market. By Dan Sides & Bertrand Leigh, Lattice Semiconductor For some years now, increasing levels of chip functionality and data throughput requirements have propelled the chip industry in a migration from lower data rate click t...

Software Radio in Wireless Applications: A Revolution through Software

June 20, 2007 7:26 am | Product Releases | Comments

By Marty Gilbert, Vanu, Inc. The intent of software radio is to separate the wireless standard from the hardware platform by developing wireless technology standards. Wireless communications infrastructure manufacturers have traditionally developed single-standard, high-power, high-capacity networks to address the need for cellular coverage over large areas....

FPD Taiwan

June 20, 2007 6:33 am | Product Releases | Comments


Low-power Methodology Kit

June 19, 2007 12:38 pm | Product Releases | Comments

Cadence Design Systems, Inc. announces a kit that enables engineers of different experience levels to adopt advanced low-power techniques with minimized risk and deployment effort. The Low-Power Methodology Kit provides a working end-to-end methodology covering logic design, functional verification and physical implementation....

Voltage Regulator Functionality

June 19, 2007 12:38 pm | Product Releases | Comments

AMI Semiconductor announces the release of devices that combine LIN (Local Interconnect Network) transceiver and voltage regulator functionality in a single low-power, mixed-signal chip. The AMIS-40615 and AMIS-40616 will allow automotive design engineers to improve the reliability while reducing the component count, power consumption and cost of LIN-based in-vehicle networking (IVN) applications....


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