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TriQuint Opens New England Design Center

February 2, 2006 7:48 am | Product Releases | Comments

TriQuint Semiconductor, Inc. announces the opening of a new design and support center in Chelmsford, Massachusetts. The facility, known as the New England Design Center (NEDC), is part of TriQuint’s ongoing efforts to work more closely with strategic partners and customers on development of next generation wireless modules and components....

RF Switches

February 2, 2006 7:43 am | Product Releases | Comments

The first devices to be released on the HaRP-enhanced UltraCMOS process are the PE42672 SP7T and the PE42660 SP6T RF switches, designed for quad-band GSM and GSM/WCDMA handset applications. Since the mid-1990s, integration, standardization and modularization have provided the GSM handset industry a roadmap of reduced size, increased performance and reduced cost....

Eighth-brick DC/DC Converters

February 2, 2006 7:42 am | Product Releases | Comments

Tyco Electronics Power Systems, Inc. announces its EQW010-040 series DC/DC converters, a line of eighth-brick, DC/DC power modules designed for regulated single output voltages ranging from 1.0 to 12 Vdc. The EQW series delivers up to 10 A at 12 Vout, 20 A at 5 V, 30 A at 3.3 V, 35 A at 2.5 V and 40 A of output current for 1....

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Step-up DC/DC Converter

February 2, 2006 7:42 am | Product Releases | Comments

Linear Technology Corporation announces the LTC3422, a 3 MHz, current mode, synchronous boost DC/DC converter with true output disconnect, inrush current limiting and integrated soft-start. Its internal switches provide a 1.5 A current limit (minimum) and deliver output voltages as high as 5.25 V from an input voltage range of 0....

AC/DC Rectifier

February 2, 2006 7:42 am | Product Releases | Comments

Valere Power announces a high power AC/DC power rectifier in its X7500 family. The X7500A1 features a power capacity of up to 8400 W and 150 A, a 50% improvement over the company’s existing X Series rectifiers in the same 2 RU form factor. The X7500A1 features a 48 V output and is made for wireless, enterprise and broadband network applications....

N-Channel MOSFET Drivers

February 2, 2006 7:42 am | Product Releases | Comments

Vishay Intertechnology, Inc. introduces three high-speed, half-bridge MOSFET driver ICs that provide flexible gate drive levels to optimize efficiency, reduce component count and minimize expense in high-frequency, high-current DC/DC synchronous rectifier buck power supplies. The MOSFET drivers operate with external N-channel MOSFETs....

RISC Processor Core

February 2, 2006 7:42 am | Product Releases | Comments

Cambridge Consultants introduces a 16-bit RISC microprocessor IP core, which features a modern, high performance RISC architecture with low gate count, low power consumption and high code density. It is optimized for use in cost- and performance-sensitive ASIC designs. On a 0.18µ CMOS fabrication process, XAP4 can deliver up to 63 Dhrystone MIPS at a clock frequency of 117 MHz....

Mobile Design With Plug & Play Flash Memory

February 2, 2006 7:41 am | Product Releases | Comments

Glossary of Acronyms ADC — Analog-to-Digital Converter BOM — Bill Of Materials EFD — Embedded Flash Drive MLC — Multi-Level Cell NAND — Not And (electronic logic gate) NOR — Not Or (electronic logic gate) SLC — Single-Level Cell XIP — eXecute In Place By Francois Kaplan, AVP Product Marketing, M-Systems Mobile D...

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Let’s Talk About Emerging Technologies

February 2, 2006 7:40 am | Product Releases | Comments

A couple of months back, I was on one of my "breather" weekend trips to Las Vegas. It’s about the only decent hot spot within a short flight from where I am located (Denver). It’s been a tradition for me and a few of my friends who like the glitz and entertainment (and a little gaming) to take a few of these long weekends during the year....

The Need for Dynamic Phase Alignment in High-speed FPGAs

February 2, 2006 7:39 am | Product Releases | Comments

Glossary of Acronyms ADC — Analog-to-Digital Converter BGA — Ball-Grid Array CDR — Clock-Data Recovery DPA — Dynamic Phase Alignment EMI — Electromagnetic Interference FPGA — Field-Programmable Gate Array I/O — Input/Output ISI — Inter-Symbol Interference LE — Logic Elements LVDS — Low-Voltage Differential Signaling...

Process Variations and Layout Design in IC Design

February 2, 2006 7:37 am | Product Releases | Comments

Process modeling advances allow the designer to assess, analyze and predict manufacturing behavior of components under other-than-nominal conditions. by J. A. Torres and C.N. Berglund Traditionally, IC designers have relied on a hands-off approach in which geometric and connectivity design rules determine the manufacturability of a particular product....

Why Can’t We All Get Connected

January 13, 2006 6:37 am | Product Releases | Comments

Andrea Joest, Managing Editor Hello everyone. It’s Andrea, WD&D’s managing editor and Ern’s editorial regulator (at least that’s what he calls me). After a recent conversation Ern and I had about WiMAX and other contenders in the wireless communications arena, he quickly recognized the opportunity to slack off for a bit and put my brain to work....

Second Generation Virtual Design Lab

January 4, 2006 6:51 am | Product Releases | Comments

Nu Horizons Electronics Corporation announces its second generation virtual digital signal processing (DSP) design lab which builds upon the Spartan-3™ two million-gate XC3S2000 FPGA from Xilinx. Nu Horizons' signal processing virtual lab incorporates the Mathworks Simulink® simulation and model-based design with both A/D converter interfaces and D/A converter modules....

Transmitter Chip

January 3, 2006 1:01 pm | Product Releases | Comments

The TH72016 transmitter from Melexis works in virtually any FSK, ASK or FM system in the 380 to 450 MHz unlicensed ISM and SRD frequency bands. Its extended operating temperature range of – 40° C to +125° C and clock output to drive a microcontroller make it well suited for automotive applications such as Tire Pressure Monitoring Systems (TPMS) or Remote Keyless Entry (RKE) that require enhanced data timing....

Multi Mode Transceiver

January 3, 2006 12:44 pm | Product Releases | Comments

Sequoia Communications announces SEQ-5400, a single-chip, multi mode WEDGE (WCDMA, HSDPA, EDGE, GPRS, GSM) RF transceiver based on Sequoia Communications’ FullSpectra™ polar architecture. This transceiver will lower the cost and increase the battery life of 3G phones, addressing the primary obstacles in the mass adoption of 3G technologies by consumers....

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