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Single Power Supply Tracking Controller

October 3, 2005 9:16 am | Product Releases | Comments

Linear Technology Corporation introduces the LTC2927, a single power supply tracking controller that simplifies the tracking and sequencing requirements of complex distributed power architectures. Housed in an 8-lead SOT-23 or 3 mm × 2 mm DFN package, the compact device can be conveniently placed at the point of load....

0203 Size Chip Resistor on Alumina

October 3, 2005 9:16 am | Product Releases | Comments

State of the Art (SOTA), Inc. announces a 0203 (.020 inches× .030 inches) size chip resistor on alumina. The new configuration provides a doubling of the voltage rating, from 15 to 30 V on the same footprint, as compared to the company’s 0302 chip. The power handling capability is comparable at 40 mV....

RoHS Compliant SP3T Switch

October 3, 2005 9:16 am | Product Releases | Comments

M/A-COM announces a RoHS-compliant SP3T T/R switch for tri mode mobile phones. The MASWSS0144 switch offers versatility with a low insertion loss, which maximizes system performance while reducing overall design complexity. It is configured to enable switching from a common antenna port to dual band GSM, CDMA, cellular, PCS and GPS receive ports....

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RoHS-compliant DPDT Switch

October 3, 2005 9:16 am | Product Releases | Comments

M/A-COM introduces an RoHS-compliant DPDT switch for use in WLAN applications that require individual path control, low insertion loss, high isolation and small size at a low cost. The MASWSS0107, with its low leakage current, is a low insertion loss switch which maximizes system performance while reducing DC power consumption....

Surface Mount Isolators/Circulators

October 3, 2005 9:16 am | Product Releases | Comments

Renaissance Electronics announces the redesigned and improved surface mount SLE series isolators (380 to 2200 MHz) designed for low power applications. This device is low cost and miniaturized in size making it a suited for tomorrow’s telecom applications. The SLE series is also available in a circulator version....

Wideband PHY Module

October 3, 2005 9:16 am | Product Releases | Comments

Wisair introduces a UWB physical layer (PHY) module to facilitate the development of applications with Intel’s Peripheral Development Kit for Certified Wireless USB. The Wisair PHY module together with the Certified Wireless USB PDK allow PC peripheral manufacturers and consumer electronics brands to develop applications while guaranteeing interoperability between host PC’s and peripherals based on the Certified Wireless USB specification....

Voice Processing Chips

October 3, 2005 9:16 am | Product Releases | Comments

Zarlink Semiconductor introduces the first in a family of voice processing chips aimed at improving voice quality and reducing noise in hands-free communication devices. The ZL38002 product uses an advanced adaptive algorithm that constantly tracks and reduces background noise while preserving high voice quality....

PFC Module Implements PSC Circuit Topology

October 3, 2005 9:16 am | Product Releases | Comments

Fairchild Semiconductor introduces a Power Factor Correction (PFC) Smart Power Module (SPM™) to implement the Partial Power Factor Correction Switching Converter (PSC) circuit topology. By triggering the IGBTs at every half cycle of the line current, the PFC-SPM FSAB20PH60 provides 97% of power factor (typical) and full compliance with the mandatory PFC standard IEC61000-3-2....

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New Implementation for ECDSA

October 3, 2005 9:16 am | Product Releases | Comments

Certicom Corporation has developed a new implementation for elliptic-curve digital signatures algorithm (ECDSA) that reduces the time needed to verify a digital signature by 40%, making it more efficient than open-source alternatives and other legacy systems. Referred to as "Fast ECDSA Verify," this implementation is especially relevant for applications such as Check 21 and e-passports that need to process large quantities of pieces...

High Linearity Mixer

October 3, 2005 9:16 am | Product Releases | Comments

WJ Communications announces the launch of a high linearity mixer, the MH205A for 2.5G and 3G wireless applications. This device delivers up to +35 dBm of IIP3, L-I isolation of 50 dB and operates from 800 to 960 MHz. The MH205A is a passive GaAs MESFET mixer that provides high dynamic range performance and is available in a Pb-free SOIC-8 package....

SMD High Current Inductors

October 3, 2005 9:16 am | Product Releases | Comments

With their powerful magnetic shield, the low profile DR363 and DR364 series surface mount inductors from Datatronic Distribution, Inc., provide reliable protection against challenging EMI problems in high current applications. The DR363 and DR364 feature a seated profile measuring 0.118 inches (3....

Electromagnetic Design Simulation Software

October 3, 2005 9:16 am | Product Releases | Comments

Flomerics announces that the new Version 7 of its MicroStripes electromagnetic design simulation software for microwave and antenna design increases the speed with which users can tune their designs. The version automatically runs a series of simulations while varying one or more design parameters over a user-specified range....

Antenna for 3.6 GHz Communications Band

October 3, 2005 9:16 am | Product Releases | Comments

mWAVE Industries, LLC introduces model number RPCR2-36-N, a high efficiency 2 feet diameter antenna that was designed for use in the 3.6 GHz point-to-point licensed communications band. The radiation pattern conforms to ETSI EN 302 078 V1.1.1 Class TS3 (Table 6). Operating frequency is 3.4 to 3.8 GHz....

Singulated Substrate Process

October 3, 2005 9:16 am | Product Releases | Comments

DEK announces that it has developed a multiple package solution that increases cycle time while delivering desirable accuracy and repeatability. DEK’s singulated substrate system can be used to process multiple packages in the same cycle. Enabled by the company’s Virtual Panel Tooling (VPT) technology, parts can be fed into the printing system in JEDEC format carriers and simultaneous processing of individual substrates of varying sizes can...

Board-to-cable Connectors

October 3, 2005 9:16 am | Product Releases | Comments

ERNI's LPV family of IEC 60603-13 (DIN 41651) compliant connectors offers a selection of board-to-cable connectors with a 2.54 mm pitch. The IDC technology that is employed ensures gas-tight and corrosion-resistant contact with a consistently low contact resistance throughout the product's service life....

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