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Microwave Components Catalog

June 6, 2005 12:02 pm | News | Comments

This CD catalog contains over 2000 pages of Miteq's component product lines including amplifiers, IF signal processing and microwave control products, mixers and low noise receiver front ends, fiber optic products, frequency multipliers, frequency generation products, passive power components, integrated microwave assemblies and communication systems.

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Short-Form Catalog

June 6, 2005 12:02 pm | News | Comments

Pulse announces the Pulse 2005 Short-Form Catalog. The Pulse 2005 Short-Form Catalog features Pulse’s product offerings from the worldwide telecom, LAN, power, military/aerospace and consumer divisions. New for 2005 are sections on featured products, consumer products and RoHS (Restriction of Hazardous Substances) compliance.

Test and Data Acquisition

June 6, 2005 12:02 pm | News | Comments

VXI introduces their 2005 Product Catalog and Engineering Handbook, containing over 200 functional test and data acquisition products. Detailed engineering and application tutorials, encompassing applications such as functional test, signal switching, data acquisition and dynamic signal analysis make this catalog and engineering handbook a valuable reference.

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Tutorial CD

June 6, 2005 12:02 pm | News | Comments

Keithley releases an interactive, tutorial CD on reliability testing for semiconductor test engineers. "Understanding Measurements: Essential Reliability Testing Techniques" provides information related to stress measure testing of semiconductor devices, new measurement techniques and how to improve test throughput and maintain data integrity.

Elcoteq Inaugurates a New Plant in India

June 6, 2005 9:25 am | Wireless Design & Development | Product Releases | Comments

Elcoteq Network Corporation inaugurated a new plant in Bangalore, India April 11, 2005. At the same time, Elcoteq became the first global EMS company to manufacture telecommunications equipment in India. When fully operational, Elcoteq’s Bangalore facility will employ approximately 1,000 people and manufacture products for global customers operating in India as well as the Asia-Pacific region....

WEP Cracking

June 2, 2005 12:35 pm | Product Releases | Comments

Glossary of acronyms WEP — Wired Equivalent Privacy SSID — Service Set Identification WPA — Wi-Fi Protected Access WEP is an encryption scheme, based on the RC-4 cipher. It is integrated into 802.11a, b and g wireless products. WEP uses a set of bits called a key to scramble information in the data frames as it leaves the access point or client adapter....

A Simulation Technique for Amplifier Performance Verification

June 2, 2005 12:00 pm | Product Releases | Comments

Spending a few minutes simulating can save days of manually tuning a circuit with lumped components and distributed lines for matching networks. By Anurag Bhargava click the image to enlarge Figure 1, left. Combined layout of input and output circuit of a 5350 MHz ±112....

Wireless System On Chip

June 2, 2005 7:50 am | Product Releases | Comments

Zensys announces its second generation chip, the ZW0201. The ZW0201 System on Chip (SoC) is a complete wireless solution consisting of an integrated RF transceiver, an 8051 microcontroller, flash and SRAM memory storage and a range of peripherals. The Z-Wave SoC offers low power consumption; by using an internal wake-up timer, the ZW0201 requires 10% of the power of the Zensys 100 series system....

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Multi-Channel Transceivers

June 2, 2005 7:50 am | Product Releases | Comments

Radiometrix introduces VHF and UHF narrow band multi-channel transceivers for low power ISM applications. The SMX series transceivers are compact (53 × 32 × 12 mm) multi-channel narrowband radios intended for a range of industrial wireless data link applications. This family of designs comprises VHF (SMX1: 173 MHz band) and UHF (SMX2: 433 MHz band) units with identical footprint and pinout....

Inspection Tool

June 2, 2005 7:23 am | Product Releases | Comments

Bede announces the BedeScan™ digital X-ray inspection tool for high-speed identification and quantification of structural defects in semiconductor wafer substrates and epilayers up to 300 mm in diameter. BedeScan uses non-destructive X-ray diffraction (XRD) to identify a range of anomalies in both incoming and processed wafers, including thermal slip dislocations, edge damage and other crystallographic defects....

Load Management Products

June 2, 2005 7:23 am | Product Releases | Comments

Fairchild Semiconductor's eleven IntelliMAX™ high-current (up to 400 mA), low loss (typical RDS(ON) = 0.12Ω) load switches reduce design cycle times and costs for battery-powered portable applications. The IntelliMAX load management portfolio ensures flexibility by addressing various system architectures to simplify designs....

Transistor Library

June 2, 2005 7:23 am | Product Releases | Comments

Modelithics introduces a comprehensive Non-Linear Transistor (NLT) Library. The NLT Library is available for use with Agilent Technologies’ Advanced Design System. With the addition of the NLT, designers using the Modelithics Library for Agilent ADS can improve their design success. With built-in substrate scalability and measurement validations including 2-tone intermodulation distortion, S-parameters, static and pulsed-IV, load- and sourc...

Dielectric Materials

June 2, 2005 7:23 am | Product Releases | Comments

W. L. Gore introduces the MICROLAM® 630 dielectric, low-loss microvia material for high frequency microvia modules and PCBs. This high performance material consists of standard BT resin in a continuous toughening matrix. MICROLAM 630 dielectric provides good thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities and good surface planarization for high-density applications....

EMI/RFI Filters

June 2, 2005 7:23 am | Product Releases | Comments

Spectrum Control introduces a line of high current/high voltage resin sealed EMI/RFI filters with current ratings to 100 A. This filter line offers continuous voltage ratings up to 1250 VDC/240 VAC (400 Hz) and capacitance values from 1000 pF to 0.22µf. Spectrum Control’s high current/high voltage EMI/RFI filters are recognized to UL 60950 and certified to CSA C22....

Bluetooth’s Next Challenge

June 1, 2005 8:03 am | by Greg Burns | Product Releases | Comments

With the frenzy of interconnecting everything to everything, the next iteration of BT definitely has its work cut out for it. BT chips are now shipping at a rate of more than three million per week, more than all other short range RF wireless chips combined (as of November 2004). Glossary of acronyms API — Application Programming Interface AVRCP — Audio/Video Remote Control Profile ...

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