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The Diagnosis for MicroTCA...

July 10, 2008 12:39 pm | Product Releases | Comments

A system designed using the MicroTCA architecture can readily meet medical application requirements. By Nigel Forrester, Emerson Network Power Initially focused towards telecommunications applications, MicroTCA ™ systems can also support applications in the medical, industrial automation and aerospace sectors with a common wireless communication thread....

How US Design Engineers Can Meet Global Legislation Challenges (Part 1)

July 1, 2008 7:39 am | Articles | Comments

By Gary Nevison, Newark Designers of electronic and electrical equipment are increasingly challenged to design new products that comply with legislation that applies in the markets where their products will be sold. As more US manufacturers sell their products internationally, design engineers not only need to consider legislation in the U.

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How US Design Engineers Can Meet Global Legislation Challenges (Part 2)

July 1, 2008 7:39 am | Articles | Comments

By Gary Nevison, Newark Designers of electronic and electrical equipment are increasingly challenged to design new products that comply with legislation which applies in the markets where their products will be sold. Previously, we took a look at all the different flavors of RoHS.

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Classic Discrete Design Skills Are Making a Comeback

July 1, 2008 7:10 am | Product Releases | Comments

Advanced CMOS-MEMS technology is making passive components digitally programmable. Marten Seth, WiSpry Modern CMOS processes that enable integration of both logic and RF functionality are commonly used in the design of transceiver circuits for wireless devices. While logic and radio functions benefit from the integration possibilities, high-Q, high precision passive elements often used for impedance matching and frequency selectivity ...

Ethernet Circular Connector with RJF Range

June 16, 2008 10:57 am | Product Releases | Comments

Amphenol Socapex has released a robust Ethernet circular connector with the RJF range. Its steel shell provides desirable mechanical behavior including 10g vibration resistance (at 10 to 500 Hz, 3-axis) and IK06 impact resistance (equivalent to a 250g weight falling on the mated connectors from a height of 40 cm)....

2.5 V HCMOS Oscillators SignificantlyReduce Noise Levels

June 16, 2008 10:57 am | Product Releases | Comments

Fox Electronics now offers its HCMOS XpressO oscillators with 2.5 V operation. Featuring a third order Delta Sigma Modulator (DSM) that offers significantly reduced noise levels, the oscillators are comparable to traditional bulk quartz and surface acoustic wave (SAW) oscillators at a lower cost. The noise-reducing DSM technology, combined with the series’ low noise architecture, enables the oscillators to offer significantly lower levels o...

Broadband Wireless Chipset Provides Seamless Migration

June 16, 2008 10:57 am | Product Releases | Comments

Wavesat introduces its new family of 4G Broadband Wireless chipset named Odyssey™, with a unique flexible, multimode 4G architecture enabling WiMAX Wave2, WiFi, XG-PHS and seamless migration to future 4G technologies such as LTE. The first product in the Odyssey family, the Odyssey 8500, is powered by a unique 4G multi-core architecture incorporating multiple ultra low power DSPs, offering flexibility, high performance and low power consump...

Design Tools Help Meet Critical Power Budgets

June 16, 2008 10:57 am | Product Releases | Comments

With ChipVision's PowerOpt™ and P-SAM, users can evaluate performance, area and power tradeoffs at the architectural level rather than the gate level, resulting in significant savings. PowerOpt performs synthesis, analysis and estimation, and generates RTL code automatically to bridge the gap between specification at the system level and implementation at the RT level....

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WVAN Wireless Library Helps Prevent Wafer Spins

June 16, 2008 10:57 am | Product Releases | Comments

Agilent Technologies+IBk- Wireless Video Area Networks (WVAN) Library helps prevent unnecessary wafer spins, thus accelerating deployment of next-generation 60 GHz WVAN for high-volume consumer video equipment. The library is for use with Agilent+IBk-s Advanced Design System (ADS) EDA software. The Agilent WVAN Wireless Library is of particular interest to members of the WirelessHD consortium because the library includes portions of Version...

New Process Delivers Significant Miniaturization

June 16, 2008 10:57 am | Product Releases | Comments

Avago Technologies announces a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago’s WaferCap is a semiconductor-based chip scale packaging (CSP) technology. With potential to reach the 100 GHz frequency range for a SMT packaging, WaferCap CSP has the same dimensions as a 0402 component and can reduce the amount of PCB space an RF device occupies by over 50...

Wire-wound Performance with Multi-layer Manufacturability

June 16, 2008 10:57 am | Product Releases | Comments

The BRC1608 series of high-current, wire-wound power inductors from Taiyo Yuden measure 1.6(L) x 0.8(W) x 0.8(H) mm (all dimensions ± 0.2 mm). In addition to small size, the eight models offer a good combination of low DC resistance (0.06 to 0.55 Ohms), high inductance (0.2 to 2.2 mH) and high current ratings (0....

Membrane Media Increases Thermal Performance

June 16, 2008 10:57 am | Product Releases | Comments

W. L. Gore & Associates, Inc. introduces a membrane media for its line of GORE® Cooling Filters that increases thermal performance while providing strong environmental protection and reliability. The GORE Cooling Filters improve thermal cooling while reducing both capital and operating costs in wireless base stations, MCPAs, base band units, power cabinets, switching systems, and other outdoor electronic enclosures....

Email Security Concerns in Enterprise Today

June 16, 2008 10:56 am | Wireless Design & Development | Product Releases | Comments

Nancy Maas Editor-in-Chief Email is probably considered the most important method for communications both inside and outside the enterprise. It allows employees to share information, companies to work easily with partners across the globe and provides the means for companies and their customers to stay in touch....

Is it Real or a Digital Replica?

June 16, 2008 10:56 am | Product Releases | Comments

New wireless networks are being designed with a wide variety of goals in mind, such as improving worker productivity, delivering mission critical information to troops in combat, or just enhancing mobile lifestyles. Wireless networks require different capabilities than their wired counterparts, such as specialized middleware, service-oriented architectures, net-centric services and mobile on-the-go applications....

Internal Structure Allows ESR Values to be Set

June 16, 2008 10:55 am | Product Releases | Comments

TDK Corporation announced that it has developed a multilayer ceramic chip capacitor with a new internal structure that allows Equivalent Series Resistance (ESR) values to be set to any value within a specified range, stabilizes ESR values, and can control circuit impedance (alternating current resistance)....

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