The Source on Design and Technology for the Wireless and RF Engineer
FREE WDD Email Newsletter
Forged Pin Fin Heat Sinks
July 16, 2001 5:44 am | Product Releases | CommentsCool Innovations presents the UltraCool III heat sink line parallels the outstanding conceptual design of the UltraCool II line of heat sinks: efficient pin structure resulting in a low thermal resistance, compact size and light weight. Forged from a highly conductive aluminum alloy to allow for superior heat dissipation, the UltraCool III represents an ideal solution for surface mount components dissipating relatively high thermal loads....
Magnetic Transducers/Buzzers
July 16, 2001 5:44 am | Product Releases | CommentsBetso Tech, Korea have introduced a complete range of magnetic buzzers. They different surface mountable magnetic transducers/buzzers, including a wide frequency range and a typical sound output between 85 and 100 dB. The smallest SMT buzzer is available in sizes of 8 × 8 × 2.5mm. The height of the buzzer is the smallest on the market, but with many advantages....
Combination Cleaning and Bonding System
July 16, 2001 5:44 am | Product Releases | CommentsKarl Suss unveiled its latest tool, the CL200 Cleaner / SOI Bonder, the first system worldwide that cleans, dries, aligns and bonds in one closed chamber with specific atmosphere. The system is specially designed for creating silicon-on-insulator (SOI) substrates, promising semiconductor materials for leading edge devices such as low power and high speed LSIs, smart sensors, and smart power devices....
Solution for Wafer-Level Testing of MEMs-Based Optical Switches
July 16, 2001 5:44 am | Product Releases | CommentsThe integration of the Summit Series wafer probing systems and the Polytec Micro-Scanning Laser Vibrometer (MSV) provides an automated, non-invasive device characterization during the Micro Electromechanical System (MEMs) optical switch manufacturing process. Complete characterization of every MEMS device in an optical switch array is critical to ensure final switch performance....
High Power Broadband L Band Solid-State Power Amplifier
July 16, 2001 5:44 am | Product Releases | CommentsAethercomm P/N SSPA 1.35-1.85-30 is high power, broadband, L Band, solid-state power amplifier. This PA operates over 500 MHz of bandwidth from 1350 to 1850 MHz. With its built-in pre-distortion linearizer, a typical OIP3 at 1600 MHz is 58 dBm with two tones spaced at 1 MHz with a single carrier level (SCL) of 39 dBm....
Design Planning Products
July 16, 2001 5:44 am | Product Releases | CommentsTera Systems announced a major upgrade to its TeraForm® RTL design planning solution, TeraForm 2001.1. Enhancements to the TeraForm analysis partitioning, floorplanning and timing-optimization capabilities solidify the product's status as the new front-end to today's gate-level, logic synthesis and layout solutions for high-performance system-on-chip (SOC) design....
2.4GHz 12 db Directional Patch Antenna
July 16, 2001 5:44 am | Product Releases | CommentsPolaris's DA-12 antenna for the 2.4 GHz spectrum is the most recent addition to our antenna product line. The DA-12 is designed and manufactured in the U.S. with high quality components. Applications for the DA-12 include, wireless video, wireless internet and spread spectrum technologies. The DA-12 measures 8....
Software Radio Solution
July 16, 2001 5:44 am | Product Releases | CommentsPentek announced a 16-channel digital receiver and A/D VIM-2 (Velocity Interface Mezzanine) module that couples FPGA technology with channelized software radio functions and represents one of the most efficient and powerful products in software radio today. The Model 6231 is a general-purpose, 16-channel narrowband digital receiver and A/D VIM-2 module....
ACM Increases Performance, Reduces Power Consumption
July 9, 2001 9:19 am | Product Releases | CommentsPaul Master, Vice President, Technology, QuickSilver Technology, Inc., Santa Clara,CA Up until now, wireless designers have relied on traditional RISC and DSP architectures as the foundation for early generations of wireless handsets. However, demands for greater functionality in 2.5, 3 and 4G, plus the requirements for higher performance and lower power consumption, are placing major limitations on these conventional microprocessor (&...
M3i adds new functionality to the large California Power System
July 2, 2001 10:42 am | Product Releases | CommentsM3i Systems Inc. has announced the contract signing to provide Los Angeles Department of Water and Power (LADWP) with the M3i PragmaCAD Mobile Workforce Management, as well as additional Outage Management, modules. This integration will further improve customer care levels by automating LADWP's Power Distribution fleet services and field workforce, and provide advanced network management for the creation, modification, and archiving of swit...
Celestica Recognizes AVX Corporation With Global Supplier Award
July 2, 2001 10:42 am | Product Releases | CommentsAVX Corporation, a leading manufacturer of electronic components, has received the Partners in Performance award from Celestica Inc., a world leader in electronics manufacturing services. AVX is the only capacitor supplier in the industry to receive this award for an unprecedented third consecutive year....
LVDS Enables High-Speed Signal Distribution in 3G Basestations
July 2, 2001 5:42 am | Product Releases | CommentsBy Surawat Promyotin, Maxim Integrated Products 3G mobile communications — such as W-CDMA, EDGE, and CDMA2000 — promise the magic of media-rich, high-speed Internet access at your cell phone. To service this bandwidth, the cellular basestations (which interface wireless handsets to the wireline networks) will process and distribute exponentially greater amounts of digital data....
Paving the Way for Software Definable Radios
June 29, 2001 7:39 am | Product Releases | CommentsHandsets that support multi-operational modes and frequency bands will rely on "breakthrough technology" to achieve advanced functionality. By David McCartney, e-tenna Corporation In order to realize a handset that supports three, four or more operational modes and frequency bands, the wireless design industry will rely on true "breakthrough technology" to achieve this advanced level of functionality in a lightweight and low-c...
Antenna Considerations in the Deployment of Wireless Broadband Networks
June 29, 2001 7:39 am | Product Releases | CommentsAntenna selection for wireless broadband networks is critical, due to the technology's inherent LOS limitations. By Ana Bakas, MAXRAD, Inc. In 1985 and in 1997, the Federal Communications Commission (FCC) allocated three Industrial, Scientific and Medical (ISM) bands for unlicensed commercial use....
Automated Instrumentation Solution
June 29, 2001 4:56 am | Product Releases | CommentsTektronix, Inc. announced an automated instrumentation solution that seamlessly combines many of the company's proven logic analyzer and oscilloscope models, creating an integrated tool set for digital development and troubleshooting. Obtaining a clear signal is a significant challenge for electronic designers working on digital systems because the complexity of these designs can degrade signal quality....
