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Attenuators and Loads Have Reverse Polarity

August 1, 2008 8:29 am | Product Releases | Comments

MECA Electronics’ reverse polarity TNC (RP-TNC) attenuators and loads reverse the polarity of the interface to female contact pins into the male connectors and male contact pins into the female connectors. The devices cover Wi-Fi and wireless LAN systems in a frequency range from DC to 3,000 GHz....

Enclosure Receives Zone 1 Approval

August 1, 2008 8:29 am | Product Releases | Comments

Extronics’ iWAP103 universal access point enclosure carries wireless vendors’ equipment safely in Zone 1 extreme and hazardous environments. The IP66-standardized device includes a 110/230 VAC or 24 VDC power supply, multi-mode fibre optic ethernet connection, antenna lightning arrestors and a heater to extend the temperature range of the wireless equipment to -20°C and prevent condensation....

Comparators Offer Low Quiescent Current

August 1, 2008 8:29 am | Product Releases | Comments

Maxim Integrated Products’ MAX9060-MAX9065 comparators consume a maximum quiescent current of 350 nA at 5.5 V. The 1-mm² 4-bump UCSP- or 5-pin SOT23-packaged MAX family, including 5 variations of single comparators and a window comparator, operates in an input voltage range from 0.9 to 5....

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Thermal Pad Increases Thermal Conductivity

August 1, 2008 8:29 am | Product Releases | Comments

Laird Technologies’ T-flex™ 700 thermal pad increases the thermal conductivity to 5 W/mK and exhibits a low shore OO hardness value of 50. The RoHS-compliant gap filler comes in thickness ranges from 0.04” to 0.20” (1 to 5 mm) in increments of 0.01” (0.25 mm) and is available in standard sheets or die cut parts for custom specification with an option to have adhesive only on one side....

3G & Beyond: Harnessing the Power of Multicore Processors for 3G, WiMAX & LTE

July 14, 2008 8:21 am | by Manish Patel, Texas Instruments | Articles | Comments

Multicore processors are now an increasingly common and effective tool to address the challenges of power and ?performance in cellular basestations. Although wireless’ killer application is still voice, data is rapidly becoming a close second for 3G, a trend that will continue as operators deploy 4G technologies such as mobile WiMAX (IEEE 802.16e) and Long Term Evolution (LTE).

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The Diagnosis for MicroTCA...

July 10, 2008 12:39 pm | Product Releases | Comments

A system designed using the MicroTCA architecture can readily meet medical application requirements. By Nigel Forrester, Emerson Network Power Initially focused towards telecommunications applications, MicroTCA ™ systems can also support applications in the medical, industrial automation and aerospace sectors with a common wireless communication thread....

How US Design Engineers Can Meet Global Legislation Challenges (Part 1)

July 1, 2008 7:39 am | Articles | Comments

By Gary Nevison, Newark Designers of electronic and electrical equipment are increasingly challenged to design new products that comply with legislation that applies in the markets where their products will be sold. As more US manufacturers sell their products internationally, design engineers not only need to consider legislation in the U.

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How US Design Engineers Can Meet Global Legislation Challenges (Part 2)

July 1, 2008 7:39 am | Articles | Comments

By Gary Nevison, Newark Designers of electronic and electrical equipment are increasingly challenged to design new products that comply with legislation which applies in the markets where their products will be sold. Previously, we took a look at all the different flavors of RoHS.

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Classic Discrete Design Skills Are Making a Comeback

July 1, 2008 7:10 am | Product Releases | Comments

Advanced CMOS-MEMS technology is making passive components digitally programmable. Marten Seth, WiSpry Modern CMOS processes that enable integration of both logic and RF functionality are commonly used in the design of transceiver circuits for wireless devices. While logic and radio functions benefit from the integration possibilities, high-Q, high precision passive elements often used for impedance matching and frequency selectivity ...

Ethernet Circular Connector with RJF Range

June 16, 2008 10:57 am | Product Releases | Comments

Amphenol Socapex has released a robust Ethernet circular connector with the RJF range. Its steel shell provides desirable mechanical behavior including 10g vibration resistance (at 10 to 500 Hz, 3-axis) and IK06 impact resistance (equivalent to a 250g weight falling on the mated connectors from a height of 40 cm)....

2.5 V HCMOS Oscillators SignificantlyReduce Noise Levels

June 16, 2008 10:57 am | Product Releases | Comments

Fox Electronics now offers its HCMOS XpressO oscillators with 2.5 V operation. Featuring a third order Delta Sigma Modulator (DSM) that offers significantly reduced noise levels, the oscillators are comparable to traditional bulk quartz and surface acoustic wave (SAW) oscillators at a lower cost. The noise-reducing DSM technology, combined with the series’ low noise architecture, enables the oscillators to offer significantly lower levels o...

Broadband Wireless Chipset Provides Seamless Migration

June 16, 2008 10:57 am | Product Releases | Comments

Wavesat introduces its new family of 4G Broadband Wireless chipset named Odyssey™, with a unique flexible, multimode 4G architecture enabling WiMAX Wave2, WiFi, XG-PHS and seamless migration to future 4G technologies such as LTE. The first product in the Odyssey family, the Odyssey 8500, is powered by a unique 4G multi-core architecture incorporating multiple ultra low power DSPs, offering flexibility, high performance and low power consump...

Design Tools Help Meet Critical Power Budgets

June 16, 2008 10:57 am | Product Releases | Comments

With ChipVision's PowerOpt™ and P-SAM, users can evaluate performance, area and power tradeoffs at the architectural level rather than the gate level, resulting in significant savings. PowerOpt performs synthesis, analysis and estimation, and generates RTL code automatically to bridge the gap between specification at the system level and implementation at the RT level....

WVAN Wireless Library Helps Prevent Wafer Spins

June 16, 2008 10:57 am | Product Releases | Comments

Agilent Technologies+IBk- Wireless Video Area Networks (WVAN) Library helps prevent unnecessary wafer spins, thus accelerating deployment of next-generation 60 GHz WVAN for high-volume consumer video equipment. The library is for use with Agilent+IBk-s Advanced Design System (ADS) EDA software. The Agilent WVAN Wireless Library is of particular interest to members of the WirelessHD consortium because the library includes portions of Version...

New Process Delivers Significant Miniaturization

June 16, 2008 10:57 am | Product Releases | Comments

Avago Technologies announces a breakthrough in packaging technology that brings wireless chip micro-miniaturization and high frequency performance to new levels. Avago’s WaferCap is a semiconductor-based chip scale packaging (CSP) technology. With potential to reach the 100 GHz frequency range for a SMT packaging, WaferCap CSP has the same dimensions as a 0402 component and can reduce the amount of PCB space an RF device occupies by over 50...

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