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Touch Sensor Controller Converts Capacitance to Digital Data

April 8, 2009 6:49 am | Product Releases | Comments

Targeting mobile devices, Fujitsu Microelectronics' FMA1127 touch sensor controller converts capacitance generated by the human body and conductive touch pad to digital data with no analog processing. The water-resistant unit also performs in alarm systems, handheld health care products, home appliances, and applications where the controller can replace mechanical switches and buttons.

Converged 3G/4G Cellular Front End Platform Capable of Nine-Band Coverage

April 8, 2009 6:49 am | Product Releases | Comments

RF Micro Devices, Inc. (RFMD) has released the RF6460, an integrated and scalable 3G/4G cellular front end platform. The RF6460 front end platform features an ultra-compact "converged" multi-band, multimode architecture (2G/2.5G/3G/4G) that delivers best-in-class efficiency, eases implementation, shrinks solution size and reduces component placements, versus mode-specific and band-specific architectures.

Front-End Modules Cut WiFi Board Space by Nearly 50%

April 8, 2009 6:49 am | Product Releases | Comments

LX5551 and LX5552 from Microsemi Corporation are front-end modules (FEMs) for IEEE 802.11b/g/n applications in the 2.4 to 2.5 GHz frequency range. Addressing small form factor requirements driven by portable devices featuring WiFi connectivity, both modules are offered in a low-profile 3 x 3 mm 16-pin MLPQ package.

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Portable Test Cell Offers Fast and Convenient Wireless Testing

April 8, 2009 6:49 am | Product Releases | Comments

ETS-Lindgren introduces a portable RF shielded test cell, Model 5247, for making wireless device design verification and over-the-air performance measurements. At 35.5"(L) x 35.5"(W) x 84"(H) with rolling casters, the test cell can be easily moved between locations for design verification, pre-certification, and production line measurement applications.

Interleaved Boundary-Mode PFC Controller Delivers Over 96% Efficiency

April 8, 2009 6:49 am | Product Releases | Comments

Fairchild Semiconductor brings power supply designers a boundary-conduction mode (BCM) interleaving power factor correction (PFC) controller that provides over 96% power conversion efficiency for AC/DC power supplies. Historically, the higher-efficiency and lower-cost BCM PFC converters are limited to about 300 W of maximum power level.

Dual-Band External MIMO Antennas Designed to Enhance 802.11n System Performance

April 8, 2009 6:49 am | Product Releases | Comments

Laird Technologies, Inc. has released two new dual-band external MIMO antennas – the S245112PT Directional and the S24517PT Sector. Both antennas are specifically designed to enhance the latest generation of Wireless LAN (WLAN) technology systems and make use of MIMO technology in which multiple wireless transmitters and receivers operate simultaneously.

Power Conversion Technology for Solar Applications

April 8, 2009 6:49 am | Product Releases | Comments

Freescale has developed advanced, ultra-low-voltage DC/DC converter technology that enables industry-leading solar cell startup and operating performance and efficiency at levels as low as 0.32 V, as well as operation down to 0.25 V. Most ICs cannot start up at voltages less than the typical turn-on voltage of a transistor (approximately 0.

Demand for 2.4 GHz Wireless Will Continue to Stay Strong

April 8, 2009 6:48 am | Articles | Comments

By Svenn-Tore Larsen, Chief Executive Officer, Nordic Semiconductor Like many organizations in today's electronics sector, my company, Nordic Semiconductor, is rising to the challenge of operating in a global semiconductor market that analysts say could drop by around 20 percent this year compared to 2008.

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Software Tool Improves the PC-based Design-in Process

April 8, 2009 6:48 am | Product Releases | Comments

AVX Corporation has developed a component modeling and simulation software that can save cost, time to market and reduce potential quality issues. Designated AVX Component Simulator, the software enables designers to view all basic characteristics and parameters for Accu-P, Accu-L, Thin Film Low Pass Filters, Couplers, 3dB Splitters, Hi-CV SMT, LICC, LGA and IDC products.

Resistor Thinner and Smaller than Comparable Molded 3W Wirewound Devices

April 8, 2009 6:48 am | Product Releases | Comments

Providing design engineers with a 3W-rated resistive component that requires minimal PC board space, TT electronics IRC has extended the resistance range and voltage rating of its highest power dissipation chip resistor. The SC-3 Series resistor, a 3 W device in a 1 W (1225) chip size, now features a resistance range from 1 up to 100K, with power dissipation of 3 W @70° C, and a maximum voltage rating increase from 50 to 100 V.

EMI Filter Family for Multimedia Wireless Handsets

April 8, 2009 6:48 am | Product Releases | Comments

California Micro Devices announces the CM1693 family of advanced EMI (electromagnetic interference) filters based upon the company's Praetorian III® LC based filtering technology. The CM1693 meets exacting EMI filter and ESD (electrostatic discharge) protection requirements while offering the low line capacitance necessary for the increasingly higher speed data interfaces to the high resolution cameras and displays used in today's most popular feature and smart phone models.

Coupler-Detector Operates over the 2.4 to 2.5 GHz Range

April 8, 2009 6:48 am | Product Releases | Comments

Planar Monolithics Industries, Inc. produces a variety of detector, amplifier and integrated products which operate up to 20 GHz. The PMI Model No:TDC-18T-204F covers from 2.4 to 2.5 GHz (other frequency ranges available). It is a high speed, adjustable, low loss coupler-detector with the output optimized to operate over 2.

Automotive Relay Features Large 40A Switching Capacity

April 8, 2009 6:48 am | Product Releases | Comments

The A2 Series from CIT Relay & Switch is small in size and light weight. Offering both PCB pin and .250 Quick Connect terminals, the A2 is available with a weatherproof shroud along with mounting flange and metal bracket options. Coil voltage options are 6, 12 and 24 VDC with coil power choices of 1.

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Electronic Packaging RF SiPs Demand Early Packaging Focus

April 8, 2009 6:48 am | Articles | Comments

By considering packaging in the early stages of product development, design teams can determine the best architecture for their particular application. By Ralph Ebbutt, Maxtek Components Corp. click to enlarge Figure 1 - An example of a system-on-chip (SoC) device.

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