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Sensors Address High-Changeover Environments

April 7, 2008 10:19 am | Product Releases | Comments

Pepperl+Fuchs releases its Tru-Vue photoelectric background suppression sensor that is unaffected by potentially distracting background objects without using reflectors or thru-beam alignment. Able to consistently detect targets at up to 50 mm regardless of target color or reflectivity, the sensors are 29 mm deep, giving them flexibility for tight-confined mounting and offering tamper-proof operation in industry-standard housings with versa...

USB Connector Provides EMI and ESD Protection

April 3, 2008 12:41 pm | Product Releases | Comments

Spectrum Control, Inc. introduces a series of USB connectors that incorporate EMI or ESD filters into an industry standard USB package. These connectors satisfy the requirements of the USB 2.0 spec that calls for EMI and ESD protection according to industry specifications, allowing designers to free up PC board space for other components, and to provide better protection for the entire device....

Test Receiver Provides Measurement of Network Quality

April 3, 2008 12:41 pm | Product Releases | Comments

Digital Receiver Technology, Inc. announces its model DRT4301-LTE software defined radio (SDR) based test receiver that provides measurement and monitoring of network quality for the wireless industry. It also supports E-UTRA (LTE). Due to its SDR architecture, the platform is upgradeable and reconfigurable in the field....

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Innovation in Package-Level EMI/RF Shielding

April 3, 2008 12:27 pm | Product Releases | Comments

By Scott Morris and Milind Shah, RFMD With the trend towards smaller implementation sizes and higher functionality, older can shields have become outdated....

Wireless NFC Chip Sets New Standard for Handset Integration

April 3, 2008 12:21 pm | Product Releases | Comments

Inside Contactless introduces the latest version of its MicroRead® multi-standard NFC chip, a third-generation product that sets a new standard for ease of integration. The MicroRead suite combines third-generation silicon, a full set of host interfaces, NFC software libraries and APIs, a field-proven reference design and robust standards support into a turnkey NFC solution ideal for a broad range of applications in any cell phone, smart...

Dual Core VME Board Enables OEMs to Improve System Performance

April 3, 2008 12:21 pm | Product Releases | Comments

Emerson Network Power announces its highest performance VMEbus single-board computer (SBC), the MVME7100. Featuring a dual core PowerPC® processor and 2eSST high speed VMEbus interface, the board is designed to enable industrial, medical and defense/aerospace OEMs to add performance and features for competitive advantage while providing backwards compatibility to protect their investment in VMEbus technologies....

Single-Antenna Approach Improves Antenna Gain and Receiver Sensitivity

April 3, 2008 12:21 pm | Product Releases | Comments

SkyCross introduces Isolated Mode Antenna Technology (iMAT), a unique single-antenna approach providing significant benefits for device designers and manufacturers, network operators, and end users. iMAT, a patented, counterintuitive solution, enables designers of handsets, PC cards, USB dongles, personal navigation and other wireless electronics to offer diversity or multiple input, multiple output (MIMO) communications, even in applicatio...

Powerful Tool Supports Successful Deployment of Next-Generation Mobile Phone Systems

April 3, 2008 12:21 pm | Product Releases | Comments

Anritsu Company has released three software packages for its MS269xA Signal Analyzer Series that create a powerful tool to support fast and easy evaluation of 3GPP LTE uplink and downlink signals. Taking full advantage of the MS269xA Series’ total level and modulation accuracy over the bandwidth from 50 Hz to 6 GHz, the MX269020A LTE Downlink Measurement Software, MX269021A LTE Uplink Measurement Software, and MX269908A LTE IQproducer™ ...

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Technology Shrinks Quad-band EDGE PA Modules by 50%

April 3, 2008 12:21 pm | Product Releases | Comments

TriQuint Semiconductor, Inc. announces the first two members of its HADRON II PA Module™ family: the TQM7M5012 and TQM7M5005. These second-generation EDGE PAs were designed using the company’s CuFlip™ copper bump technology, improving RF performance while reducing current consumption to provide longer device battery life....

Highly Flexible, Scalable, Mobile WiMAX Base Station

April 3, 2008 12:21 pm | Product Releases | Comments

Fujitsu Network Communications introduces the BroadOne™ WX series of mobile WiMAX base stations. The company has designed its new base stations with many features to meet the global requirements for mobile WiMAX networks. The base stations consume low levels of power, deliver desirable performance, and are easy to install....

Single Slot Solution

April 3, 2008 12:21 pm | Product Releases | Comments

Pentek’s Model 4207 is the company's flagship product for high-performance digital signal processing and data-acquisition systems. This new board employs Freescale's MPC8641D Dual Core PowerPC AltiVec™ Processor and a Xilinx Virtex-4 FX Series FPGA. In addition, the company’s unique fabric-transparent crossbar switch bridges a wealth of gigabit serial resources, including the PowerPC and FPGA, two XMCs, dual VXS ports, dual Fibre Channe...

MCPA Product Increased Cell Site Capacity and Reduces Cost for Wireless Operators

April 3, 2008 12:21 pm | Product Releases | Comments

Andrew Wireless Solutions’ CommScope, Inc. division announces the release of The Andrew OneBase™ Extender Multi-Sector Micro, designed to be the smallest multicarrier power amplifier (MCPA) configuration for wireless operators. This single cabinet will support three separate antenna feeds at a base station site....

Does it Still Hold True?

April 3, 2008 12:13 pm | Product Releases | Comments

Nancy Maas Editor-in-Chief The laws of supply and demand are something everyone in this industry, particularly chip makers, electronics manufacturers and suppliers are all too familiar with. In order to succeed in today’s high-tech business environment, semiconductor suppliers, for example, must look outside the realm of the chip market and make a determination on the direction of their products long before their OEM customers do...

Selecting a Suitable RFIC Amplifier

April 3, 2008 11:13 am | Product Releases | Comments

While the specifications provided in data sheets seem pretty straight forward, beware of some of the potential pitfalls along the way. By Alan Rixon and Philip Gadd, Avago Technologies There are many RFIC amplifiers available on the market, often categorized by the process they are made on, ranging from low cost silicon parts with wideband Figure 1....

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