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Ball Grid Array Reduces Memory Footprint

March 6, 2009 6:56 am | Product Releases | Comments

Ramtron International Corporation announces its F-RAM memory in a streamlined FBGA package. The FM22LD16 is a 4 Mb, 3 V, parallel non-volatile RAM in a 48-pin ball grid array (FBGA) package that features fast access, virtually unlimited read/write cycles and low power consumption. Pin-compatible with asynchronous static RAM (SRAM), the package targets industrial control systems such as robotics, network and data storage applications, multi-...

Power Splitters Offer 50 or 75 ? Impedances

March 6, 2009 6:56 am | Product Releases | Comments

International Manufacturing Services, Inc. announces its 1 W, 2-way resistive power splitters that are available with 50 or 75 ? impedances. The 75 ? IPS Series 2-way splitters feature wrap-around or single-sided terminals that are suited for broadcast applications. These resistive power splitters have 6 dB evenly split attenuation and operate from DC to 20 GHz....

Modular Antenna Assembly Addresses Automotive Market

March 6, 2009 6:56 am | Product Releases | Comments

Laird Technologies, Inc. announces its shark fin style modular antenna assembly for automotive vehicles. This patented antenna offers high-performance SDARS, GPS, AMPS and PCS antenna coverage in one compact package. The base module has an low profile design of 16 mm, and is designed to fit multiple vehicle platforms with various roof curvatures....

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Technology Automates Administration of Software Requirements

March 6, 2009 6:56 am | Product Releases | Comments

LDRA announces the creation of a technology that automates the administration and traceability of software requirements. This technology automates the techniques and tools for the integration of requirements traceability with software testing and verification. On completion, the technology will be integrated into TBreq, the portion of the proprietary tool suite devoted to requirements-driven testing....

Synchronous Step-Down Regulator Delivers 2.5 A

March 6, 2009 6:56 am | Product Releases | Comments

The LTC3603 from Linear Technology Corporation is a 3 MHz synchronous buck regulator that uses a constant frequency, current mode architecture. It can deliver up to 2.5 A of continuous output current at output voltages as low as 0.6 V from a 4 × 4 mm QFN or a thermally enhanced MSOP-16 package....

RS-232 Transceivers Deliver High Data Rates

March 6, 2009 6:56 am | Product Releases | Comments

Maxim Integrated Products introduces its MAX13234E-MAX13237E family of RS-232 transceivers. Providing upgraded functionality to proprietary legacy MAX3224E-MAX3227E RS-232 transceivers, the devices provide high data rates (up to 3 Mbps), low-voltage logic-level translation, 1 µA supply current through the AutoShutdown Plus feature, and ESD protection....

Hybrid Couplers Designed for Wireless Band Applications

March 6, 2009 6:56 am | Product Releases | Comments

MECA introduces its 705 Series of 3 dB, 90° hybrid couplers that cover all wireless band applications from UHF through UMTS (0.4 to 2.2 GHz) with power levels to 500 W. Suitable for use as a duplexer for DAS head end systems or combining amplifiers for antenna sharing applications with high isolation, these units are equipped with 7/16 DIN-female, N-female or SMA-female connectors and a rugged aluminum housing coated with a yellow irid...

Regulator Supports Green Appliances and Handheld Products

March 6, 2009 6:56 am | Product Releases | Comments

Micrel Inc. launches its MIC23150 high output current device in the HyperLight Load family of synchronous step-down regulators. The architecture implemented in this regulator delivers high efficiency light load for portable products and green home/office appliances. It features internal MOSFETs that are able to deliver up to 1....

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Stand-Alone SRAM Devices Increase Design Flexibility

March 6, 2009 6:56 am | Product Releases | Comments

Microchip Technology, Inc. introduces its family of 8 and 32 KB stand-alone serial SRAM devices which increase a system's available RAM memory by adding small, inexpensive external devices. The 23A640 and 23K640 (23X640), and 23A256 and 23K256 (23X256) devices feature an industry-standard SPI interface....

DC/DC Converters Feature High Isolation

March 6, 2009 6:56 am | Product Releases | Comments

MicroPower Direct debuts its A500RHI Series of compact, 5 W DC/DC converters with 5,600 V DC isolation. Standard features include safety approvals, high efficiency, and single and dual outputs. Twelve models operate from 2:1 inputs of 9 to 18, 18 to 36 and 36 to 75 V DC, providing outputs of 5, 12, ±12, or ±15 V DC....

SPDT Switch Simplifies Short-Range Wireless Designs

March 6, 2009 6:56 am | Product Releases | Comments

California Eastern Labs announces NEC's UPG2156TB SPDT (single pole double throw) GaAs RFIC switch that requires only a single control line to switch RF power between ports. This switch features high power-handling capability with low harmonic distortion and insertion loss. It operates from 0.8 to 2....

Mini Twin Transistor Works in VCO Apps

March 6, 2009 6:56 am | Product Releases | Comments

California Eastern Labs introduces the UPA828TD Twin Transistor from NEC for engineers tasked with shrinking their VCO designs. The unit combines 2 closely matched silicon NPN chips in a 1.2 × 1 × 0.5 mm 6-pin leadless RoHS-compliant package. The twin transistor enables oscillator and buffer amplifier functions to be combined in 1 device....

Thermally Conductive Adhesives Dissipate Heat

March 6, 2009 6:56 am | Wireless Design & Development | Product Releases | Comments

Duralco 132 thermally conductive adhesives from Cotronics Corporation combine high temperature resins with highly conductive fillers to form thermally conductive, adhesive bonds with continuous service up to 500°F. They are suitable for any industrial, electrical or electronic high-power applications, including bonding and assembling heating coils, cooling coils, heating elements, heat sinks, reaction vessels, semi-conductors, rectifie...

Microwave Transistors Work in Telecom Applications

March 6, 2009 6:56 am | Product Releases | Comments

Cree, Inc. announces the sample release of 2 120 W GaN HEMT microwave transistors for telecommunication applications, such as W-CDMA, LTE and WiMAX. Due to the combination of high RF power density, low capacitance and high thermal conductivity silicon carbide (SiC) substrates, these transistors are said to provide ultimate performance compared to other technologies, such as GaAs MESFET or Si LDMOSFET....

VCO Operates from 2,300 to 2,450 MHz

March 6, 2009 6:56 am | Product Releases | Comments

Crystek Corporation announces its CVCO55CC-2300-2450 VCO that operates from 2,300 to 2,450 MHz with a control voltage range from 0.5 to ~4.5 V. This VCO features a typical phase noise of -106 dBc/Hz at 10 KHz offset, and it has optimal linearity. Output power is typically 4 dBm. This model is packaged in the industry-standard 0....

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