The Source on Design and Technology for the Wireless and RF Engineer
New Battery Design for Solar and Wind Energy Power the Grid
May 7, 2013 9:34 am | by Andy Freeberg, SLAC National Accelerator Laboratory | News | CommentsResearchers from the U.S. Department of Energy’s (DOE) SLAC National Accelerator Laboratory and Stanford University have designed a low-cost, long-life battery that could enable solar and wind energy to become major suppliers to the electrical grid."For solar and wind power to be used in a significant way, we need a battery made of economical materials that are easy to scale and still efficient," said Yi Cui...
KAIST's Vivo Flexible Large Scale Integrated Circuits
May 7, 2013 9:23 am | by The Korea Advanced Institute of Science and Technology (KAIST) | News | CommentsA team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering at KAIST has developed in vivo silicon-based flexible large scale integrated circuits (LSI) for bio-medical wireless communication.
Portable Device Provides Rapid, Accurate Diagnosis
May 7, 2013 9:13 am | by Massachusetts General Hospital | News | CommentsA handheld diagnostic device that Massachusetts General Hospital (MGH) investigators first developed to diagnose cancer has been adapted to rapidly diagnose tuberculosis (TB) and other important infectious bacteria. Two papers appearing in the journals Nature Communications and Nature Nanotechnology...
EU: Motorola May Have Violated Antitrust Rules
May 7, 2013 9:06 am | by Associated Press | News | CommentsThe European Commission said Monday that Motorola Mobility may have abused its dominant market position by denying Apple the right to use technology essential for mobile phones. It is a violation of European Union antitrust rules for a patent holder to deny use to technologically essential...
BMC Software Agrees To Be Sold for $6.6B
May 7, 2013 9:04 am | by Associated Press | News | CommentsBMC Software Inc. has agreed to be sold to a private investor group for about $6.6 billion in cash. The Houston-based maker of system management software for businesses said Monday that the deal is for $46.25 per share. That's less than 2 percent above Friday's closing stock price of $45.42.
Microsoft Touching up Windows 8 to Address Gripes
May 7, 2013 9:02 am | by MICHAEL LIEDTKE, AP Technology Writer | News | CommentsMicrosoft is retooling the latest version of its Windows operating system to address complaints and confusion that have been blamed for deepening a slump in personal computer sales. The tune up announced Tuesday won't be released to consumers and businesses until later this year.
Skyworks’ Surface Mount Limiter Diode
May 7, 2013 8:21 am | by WDD Staff | Product Releases | CommentsSkyworks Solutions, Inc. has introduced a surface mount limiter diode for receiver protection applications. The CLA4608-085LF is a low capacitance silicon PIN limiter diode designed for high power applications ranging from 10 MHz to over 6 GHz.
TI Extends Remote Control Portfolio with New Bluetooth Solution
May 7, 2013 8:18 am | by WDD Staff | Product Releases | CommentsTexas Instruments Incorporated (TI) [NASDAQ: TXN] has announced the extension of its remote control solutions offering with a new Bluetooth low energy advanced remote control kit. As a technology, Bluetooth low energy allows for remotes...
Molex’s Next-Gen, High-Performance Memory Technology
May 7, 2013 8:05 am | by WDD Staff | Product Releases | CommentsMolex Inc. has introduced a portfolio of aerodynamic DDR3 DIMM sockets and ultra-low profile DDR3 DIMM memory module sockets, both of which are ideal for demanding memory applications in telecommunication, networking and storage systems, advanced computing platforms, industrial controls, and medical equipment.
Crystek's CVCO33BE-6000-6000 VCO
May 7, 2013 7:59 am | by WDD Staff | Product Releases | CommentsCrystek's CVCO33BE-6000-6000 VCO (Voltage Controlled Oscillator) operates at 6,000 MHz with a control voltage range of 0.5 to ~4.5 V. This VCO also features a typical phase noise of -85 dBc/Hz @ 10 KHz and a 0.5” x 0.5” SMD package.
GORE’s New Venting a Cooling Products
May 6, 2013 5:34 pm | by W.L. Gore & Associates | News | CommentsW. L. Gore & Associates and its latest venting and cabinet cooling products enable the telecommunications industry to remain connected and protected. Gore will be displaying new venting products and cooling filters that ensure reliability and long-lasting performance...
UniSA Satellite System Sends Data for a Song
May 6, 2013 3:24 pm | by University of South Australia (UniSA) | Articles | CommentsA new communications system being trialed at the University of South Australia (UniSA) could radically lower the cost of using satellites to send and receive sensor information collected in Australia’s vast unpopulated areas.
Agilent Technologies' X-Series Signal Generator Enhancements Enable Faster, More Effective Verification
May 6, 2013 2:54 pm | by Agilent Technologies Inc. | News | CommentsAgilent Technologies Inc. [NYSE: A] has introduced several key enhancements to its high-performance MXG and cost-effective EXG X-Series vector signal generators. The enhancements are designed to improve measurement accuracy, accelerate research and development, and provide in-depth signal simulation for even the most comprehensive receiver verification.
NGI and Cambium Networks Drive Wireless Broadband Across Italy
May 6, 2013 2:46 pm | by NGI, Cambium Networks | News | CommentsNGI and Cambium Networks have strengthened their collaboration to deploy EOLOwave access technology throughout Italy. This announcement comes at a time when NGI has just named Cambium Networks as its “Best Partner for 2013,” with plans to deliver wireless broadband innovation for residents and businesses across the country.
Microchip Expands LIN 2.1/ SAE J2602-2 Portfolio With New Transceiver
May 6, 2013 2:38 pm | by Microchip Technology Inc. | News | CommentsMicrochip Technology Inc. has announced the expansion of its LIN portfolio with the LIN 2.1 and SAE J2602-2 compliant and low-power MCP2003A transceiver, MCP2021A, MCP2022A, MCP2025 and MCP2050 LIN System Basis Chips (SBCs), and PIC16F1829LIN System in Package (SiP).
