Gas Discharge Tube Product Line
July 16, 2001 5:47 am | Product Releases | CommentsBourns announced the launch of its Gas Discharge Tube (GDT) product line. Bourns obtained the GDT product line through the acquisition of the Communication Protection Product lines from Joslyn's JESC Division. The GDT products prevent injury to personnel and damage to equipment from transient voltage disturbances by reacting as fast as a crowbar device....
FM Stereo Transmitter Designed For LPFM And Community Broadcast
July 16, 2001 5:47 am | Product Releases | CommentsRamsey Electronics announces availability of the PX1 35W FM Stereo Transmitter/Exciter. This new transmitter has been designed to meet the needs of LPFM and community broadcasters worldwide. It is also appropriate for use as an exciter for higher power broadcast stations. An 8X oversampled stereo generator with true analog filters throughout is key to its clean, refreshing sound image....
2 way Power Splitters for Multi-Band Applications
July 16, 2001 5:47 am | Product Releases | CommentsMicrolab/FXR announces a 2 way multiband, Power Splitter for high power, wireless applications using 7-16 mm DIN connectors. Designed using gasketed 7-16 mm DIN connectors, this Power Splitter can withstand the most extreme weather environments at average powers up to 700W. Microlab/FXR Model D2-24FD Two Way Power Splitter is ideal for Base Stations, 'Leaky-Line' and similar applications in the 800 - 2,200 MHz frequency range, especially ...
Universal 60
July 16, 2001 5:47 am | Product Releases | CommentsThe UNIVERSAL 60, a premiere member of Christie's innovative Pro-Ease family, is now available wherever Christie products are sold. Previously available only through exclusive dealers, customers now have access to the UNIVERSAL 60 through all Christie distribution channels, as well as factory-direct....
Multicontact Probe
July 16, 2001 5:47 am | Product Releases | CommentsCascade Microtech, Inc. announces its new Multicontact Eye-Pass Probe. The probe is designed to provide a multitude of simultaneous connections to a wafer or other similar device. The connections may be ground, logic, power supply, ac signal, or power sense path. For the power supply connections, Eye-Pass high performance power bypassing technology provides low-impedance and resonance-free power connections over an extremely wide frequency ...
Solution for Wafer-Level Testing of MEMs-Based Optical Switches
July 16, 2001 5:44 am | Product Releases | CommentsThe integration of the Summit Series wafer probing systems and the Polytec Micro-Scanning Laser Vibrometer (MSV) provides an automated, non-invasive device characterization during the Micro Electromechanical System (MEMs) optical switch manufacturing process. Complete characterization of every MEMS device in an optical switch array is critical to ensure final switch performance....
Combination Cleaning and Bonding System
July 16, 2001 5:44 am | Product Releases | CommentsKarl Suss unveiled its latest tool, the CL200 Cleaner / SOI Bonder, the first system worldwide that cleans, dries, aligns and bonds in one closed chamber with specific atmosphere. The system is specially designed for creating silicon-on-insulator (SOI) substrates, promising semiconductor materials for leading edge devices such as low power and high speed LSIs, smart sensors, and smart power devices....
Magnetic Transducers/Buzzers
July 16, 2001 5:44 am | Product Releases | CommentsBetso Tech, Korea have introduced a complete range of magnetic buzzers. They different surface mountable magnetic transducers/buzzers, including a wide frequency range and a typical sound output between 85 and 100 dB. The smallest SMT buzzer is available in sizes of 8 × 8 × 2.5mm. The height of the buzzer is the smallest on the market, but with many advantages....
Forged Pin Fin Heat Sinks
July 16, 2001 5:44 am | Product Releases | CommentsCool Innovations presents the UltraCool III heat sink line parallels the outstanding conceptual design of the UltraCool II line of heat sinks: efficient pin structure resulting in a low thermal resistance, compact size and light weight. Forged from a highly conductive aluminum alloy to allow for superior heat dissipation, the UltraCool III represents an ideal solution for surface mount components dissipating relatively high thermal loads....
2.4GHz 12 db Directional Patch Antenna
July 16, 2001 5:44 am | Product Releases | CommentsPolaris's DA-12 antenna for the 2.4 GHz spectrum is the most recent addition to our antenna product line. The DA-12 is designed and manufactured in the U.S. with high quality components. Applications for the DA-12 include, wireless video, wireless internet and spread spectrum technologies. The DA-12 measures 8....
Design Planning Products
July 16, 2001 5:44 am | Product Releases | CommentsTera Systems announced a major upgrade to its TeraForm® RTL design planning solution, TeraForm 2001.1. Enhancements to the TeraForm analysis partitioning, floorplanning and timing-optimization capabilities solidify the product's status as the new front-end to today's gate-level, logic synthesis and layout solutions for high-performance system-on-chip (SOC) design....
High Power Broadband L Band Solid-State Power Amplifier
July 16, 2001 5:44 am | Product Releases | CommentsAethercomm P/N SSPA 1.35-1.85-30 is high power, broadband, L Band, solid-state power amplifier. This PA operates over 500 MHz of bandwidth from 1350 to 1850 MHz. With its built-in pre-distortion linearizer, a typical OIP3 at 1600 MHz is 58 dBm with two tones spaced at 1 MHz with a single carrier level (SCL) of 39 dBm....
Software Radio Solution
July 16, 2001 5:44 am | Product Releases | CommentsPentek announced a 16-channel digital receiver and A/D VIM-2 (Velocity Interface Mezzanine) module that couples FPGA technology with channelized software radio functions and represents one of the most efficient and powerful products in software radio today. The Model 6231 is a general-purpose, 16-channel narrowband digital receiver and A/D VIM-2 module....
ACM Increases Performance, Reduces Power Consumption
July 9, 2001 9:19 am | Product Releases | CommentsPaul Master, Vice President, Technology, QuickSilver Technology, Inc., Santa Clara,CA Up until now, wireless designers have relied on traditional RISC and DSP architectures as the foundation for early generations of wireless handsets. However, demands for greater functionality in 2.5, 3 and 4G, plus the requirements for higher performance and lower power consumption, are placing major limitations on these conventional microprocessor (&...
M3i adds new functionality to the large California Power System
July 2, 2001 10:42 am | Product Releases | CommentsM3i Systems Inc. has announced the contract signing to provide Los Angeles Department of Water and Power (LADWP) with the M3i PragmaCAD Mobile Workforce Management, as well as additional Outage Management, modules. This integration will further improve customer care levels by automating LADWP's Power Distribution fleet services and field workforce, and provide advanced network management for the creation, modification, and archiving of swit...


