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This release of Ansoft's high-frequency/high-speed electromagnetic design product introduces new capabilities for design-flow efficiency that allow users to easily share CAD models and results across existing CAD/CAE products. HFSS v10 further offers dynamic-link technology, which allows HFSS to co-simulate with other Ansoft products and extends HFSS applications to include RF/analog IC co-design, EMI/EMC and microwave heating. HFSS v10 includes new model healing, meshing technology and model-resolution techniques that simplify the model translation and meshing process. These new features are designed to help users maximize the benefits of a virtual prototyping design flow by leveraging their investments across existing software products. HFSS v10 expands the company’s dynamic-link technology from Ansoft Designer® to also include dynamic links to Nexxim®, SIwave™, Maxwell® and ePhysics™ for a broader range of end-user applications, including RF/analog IC, EMI/EMC, chip-package-board co-design and microwave heating.

Ansoft Corp.